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    • 51. 发明申请
    • Self-aligned STI SONOS
    • 自对准STI SONOS
    • US20060240635A1
    • 2006-10-26
    • US11113509
    • 2005-04-25
    • Hidehiko ShiraiwaMark RandolphYu Sun
    • Hidehiko ShiraiwaMark RandolphYu Sun
    • H01L21/76
    • H01L21/76229H01L27/105H01L27/115H01L27/11568H01L27/11573
    • Methods 300 and 350 are disclosed for fabricating shallow isolation trenches and structures in multi-bit SONOS flash memory devices. One method aspect 300 comprises forming 310 a multi-layer dielectric-charge trapping-dielectric stack 420 over a substrate 408 of the wafer 402, for example, an ONO stack 420, removing 312 the multi-layer dielectric-charge trapping-dielectric stack 420 in a periphery region 406 of the wafer 402, thereby defining a multi-layer dielectric-charge trapping-dielectric stack 420 in a core region 404 of the wafer 402. The method 300 further comprises forming 314 a gate dielectric layer 426 over the periphery region 406 of the substrate 408, forming 316 a first polysilicon layer 428 over the multi-layer dielectric-charge trapping-dielectric stack 420 in the core region 402 and the gate dielectric 426 in the periphery region 406 , then concurrently forming 318 an isolation trench 438 in the substrate 408 in the core region 404 and in the periphery region 406. Thereafter, the isolation trenches are filled 326 with a dielectric material 446, and a second polysilicon layer 452 that is formed 332 over the first polysilicon layer 428 and the filled trenches 438, forming an self-aligned STI structure 446. The method 300 avoids ONO residual stringers at STI edges in the periphery region, reduces active region losses, reduces thinning of the periphery gate oxide and the ONO at the STI edge, and reduces dopant diffusion during isolation implantations due to reduced thermal process steps.
    • 公开了用于在多位SONOS闪存器件中制造浅隔离沟槽和结构的方法300和350。 一个方法方面300包括在晶片402的衬底408(例如,ONO堆叠420)上形成310多层介电电荷俘获 - 电介质堆叠420,去除312多层介电电荷俘获 - 电介质堆叠420 在晶片402的外围区域406中,由此在晶片402的芯区域404中限定多层介电电荷捕获 - 电介质叠层420.方法300还包括在周边区域314上形成314栅极电介质层426 406,在芯区域402中的多层介电 - 电荷俘获 - 电介质堆叠层420和周边区域406中的栅极电介质426之间形成316第一多晶硅层428,然后同时形成318隔离沟槽438 在核心区域404和外围区域406中的衬底408中。此后,隔离沟槽用介电材料446填充326,第二多晶硅层452形成为332o 形成第一多晶硅层428和填充沟槽438,形成自对准STI结构446.方法300避免在外围区域的STI边缘处的ONO残余桁条,减少有源区域损耗,减少外围栅极氧化物的稀化和 ONO在STI边缘,并且由于减少的热处理步骤,在隔离注入期间减少掺杂剂扩散。
    • 54. 发明申请
    • Memory cell array with staggered local inter-connect structure
    • 具有交错局部互连结构的存储单元阵列
    • US20050077567A1
    • 2005-04-14
    • US10685044
    • 2003-10-14
    • Mark RandolphSameer HaddadTimothy ThurgateRichard Fastow
    • Mark RandolphSameer HaddadTimothy ThurgateRichard Fastow
    • G11C16/04H01L21/8246H01L21/8247H01L27/115H01L29/788
    • H01L27/11568G11C16/0483H01L27/115H01L27/11521
    • A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.
    • 存储单元阵列包括在半导体衬底上制造的存储器单元的二维阵列。 存储单元布置成多行和多列。 每列存储单元包括多个交替沟道区和源极/漏极区。 导电互连位于每个源极/漏极区域上方并且仅耦合到另一个源极/漏极区域。 另一个源/漏区位于与该列相邻的第二列中。 导电互连被定位成使得每隔一个导电布线连接到列的右侧的相邻列,并且每隔一个导电布线连接到列的左侧的相邻列。 多个源极/漏极控制线在相邻列的存储器单元之间延伸,并且电耦合到在相邻列之间耦合的每个导电互连。
    • 56. 发明授权
    • Use of a large angle implant and current structure for eliminating a critical mask in flash memory processing
    • 使用大角度注入和电流结构来消除闪存处理中的关键掩模
    • US06168637A
    • 2001-01-02
    • US08991322
    • 1997-12-16
    • Mark RandolphTimothy J. ThurgateScott D. Luning
    • Mark RandolphTimothy J. ThurgateScott D. Luning
    • H01L218247
    • H01L27/11521Y10T29/41
    • A method and system for providing a flash memory cell on a semiconductor is disclosed. In one aspect, the method and system include providing a plurality of gate stacks and providing a drain implant at an angle. The plurality of gate stacks define a plurality of drain areas and a plurality of source areas. The angle is measured from a direction perpendicular to the surface of the semiconductor. The angle allows the plurality of gate stacks to block the drain implant from reaching the plurality of source areas. In another aspect, the method and system include providing a plurality of gate stacks and providing a source implant at an angle. The plurality of gate stacks define a plurality of drain areas and a plurality of source areas. The angle is measured from a direction perpendicular to the surface of the semiconductor. The angle allows the plurality of gate stacks to block the source implant from reaching the plurality of drain areas.
    • 公开了一种用于在半导体上提供闪存单元的方法和系统。 在一个方面,该方法和系统包括提供多个栅极堆叠并以一定角度提供漏极注入。 多个栅极堆叠限定多个漏极区域和多个源极区域。 该角度是从垂直于半导体表面的方向测量的。 该角度允许多个栅极堆叠阻挡漏极植入物到达多个源极区域。 在另一方面,该方法和系统包括提供多个栅极叠层并以一定角度提供源植入物。 多个栅极堆叠限定多个漏极区域和多个源极区域。 该角度是从垂直于半导体表面的方向测量的。 该角度允许多个栅极堆叠阻挡源植入物到达多个漏极区域。