专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20080190899A1 Electrode Tip Holder, Welding Method, and Electrode Tip Adjusting Device 审中-公开
标题翻译：电极头支架，焊接方法和电极头调整装置
公开(公告)号：US20080190899A1
公开(公告)日：2008-08-14
申请号：US11793738
申请日：2005-12-22
申请人： Toshio Sugahara , Noritoshi Takasaki , Harumi Takasaki , Hideo Aoki
发明人： Toshio Sugahara , Noritoshi Takasaki , Harumi Takasaki , Hideo Aoki
IPC分类号： B23K9/32 , B23K11/00 , B23K11/10
CPC分类号： B23K11/314 , B23K11/11 , B23K11/3018 , B23K11/3072
摘要： An electrode tip holder, a welding method, and an electrode tip adjusting device. The electrode tip holder comprises a chuck body having an inner diameter hole with a first tapered inner peripheral surface diverging toward the tip thereof, a lock nut threaded with the tip male screw part of the chuck body, and a collet fitted to the inner diameter hole. The collet is axially pressed since the lock nut is threaded with the tip male screw part and reduced in diameter by the elastic deformation of a slit to hold an electrode tip fitted to the inside thereof. The chuck body comprises a coolant supply port supplying a coolant to a groove part and a coolant recovery port recovering the coolant from the groove part which are opened at positions facing the groove part.
摘要翻译：电极头保持器，焊接方法以及电极头调整装置。电极头保持器包括具有内径孔的卡盘体，内径孔具有朝向其前端分叉的第一锥形内周面，与卡盘主体的前端外螺纹部分螺纹连接的锁紧螺母，以及装配到内径孔。夹头被轴向按压，因为锁紧螺母与前端外螺纹部分螺纹连接，并且通过狭缝的弹性变形直径减小，以保持安装在其内部的电极头。卡盘体包括向槽部供应冷却剂的冷却剂供给口和从凹槽部回收冷却剂的冷却剂回收口，所述冷却剂回收口在面向槽部的位置处开口。

52. 发明申请

US20060071271A1 Semiconductor device and method of manufacturing semiconductor device 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060071271A1
公开(公告)日：2006-04-06
申请号：US11230624
申请日：2005-09-21
申请人： Ichiro Omura , Kenji Takahashi , Chiaki Takubo , Hideo Aoki , Hideo Numata , Mie Matsuo , Hirokazu Ezawa , Susumu Harada , Hisashi Kaneko , Hiroshi Ikenoue , Kenichi Matsushita
发明人： Ichiro Omura , Kenji Takahashi , Chiaki Takubo , Hideo Aoki , Hideo Numata , Mie Matsuo , Hirokazu Ezawa , Susumu Harada , Hisashi Kaneko , Hiroshi Ikenoue , Kenichi Matsushita
IPC分类号： H01L29/76 , H01L21/336
CPC分类号： H01L29/41766 , H01L23/481 , H01L24/14 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L29/7809 , H01L29/7811 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/30107 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05005 , H01L2224/05541 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device which is compact and thin in size, low in resistance of a current path and parasitic inductance and excellent in reliability is provided. This semiconductor device comprises a semiconductor substrate, a first main electrode which is formed on a front surface of the semiconductor substrate, a second main electrode which is formed on a rear surface of the semiconductor substrate, and a conducting portion which is formed in a direction to pierce through the semiconductor substrate, wherein the second main electrode is extracted to the front surface of the semiconductor substrate via the conducting portion. And, the conducting portion is a through via which has a through hole formed through the semiconductor substrate in its thickness direction and a conductive portion which is formed in the through hole and connected to the second main electrode.
摘要翻译：提供了一种尺寸小型化，电流通路电阻低，寄生电感小，可靠性优异的半导体装置。该半导体器件包括半导体衬底，形成在半导体衬底的前表面上的第一主电极，形成在半导体衬底的后表面上的第二主电极和形成在半导体衬底的背面上的导电部分穿过半导体衬底，其中第二主电极经由导电部分被提取到半导体衬底的前表面。并且，导电部是贯通通孔，该通孔在其厚度方向上形成有通过半导体基板的通孔，以及形成在通孔中并连接到第二主电极的导电部。

53. 发明申请

US20060024875A1 Semiconductor integrated circuit device and process for manufacturing the same 审中-公开
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US20060024875A1
公开(公告)日：2006-02-02
申请号：US11234118
申请日：2005-09-26
申请人： Makoto Yoshida , Takahiro Kumauchi , Yoshitaka Tadaki , Kazuhiko Kajigaya , Hideo Aoki , Isamu Asano
发明人： Makoto Yoshida , Takahiro Kumauchi , Yoshitaka Tadaki , Kazuhiko Kajigaya , Hideo Aoki , Isamu Asano
IPC分类号： H01L21/8234
CPC分类号： H01L21/2652 , H01L21/32051 , H01L21/32053 , H01L21/324 , H01L21/76802 , H01L21/76849 , H01L21/76855 , H01L21/76889 , H01L21/76897 , H01L21/823814 , H01L21/823871 , H01L23/53257 , H01L27/1052 , H01L27/10814 , H01L27/10855 , H01L27/10873 , H01L27/10882 , H01L27/10894 , H01L29/6659 , H01L2924/0002 , H01L2924/00
摘要： In a process for manufacturing a semiconductor integrated circuit device having a MISFET, in order that a shallow junction between the source/drain of the MISFET and a semiconductor substrate may be realized by reducing the number of heat treatment steps, all conductive films to be deposited on the semiconductor substrate are deposited at a temperature of 500° C. or lower at a step after the MISFET has been formed. Moreover, all insulating films to be deposited over the semiconductor substrate are deposited at a temperature of 500° C. or lower at a step after the MISFET has been formed.
摘要翻译：在制造具有MISFET的半导体集成电路器件的工艺中，为了通过减少热处理步骤的数量来实现MISFET的源极/漏极与半导体衬底之间的浅结，可以将所有导电膜沉积在形成MISFET之后的步骤中，在500℃以下的温度下沉积半导体基板。此外，要沉积在半导体衬底上的所有绝缘膜在形成MISFET之后的步骤中在500℃或更低的温度下沉积。

54. 发明授权

US06977130B2 Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit 失效
标题翻译：电子电路的制造方法和电子电路的制造装置
公开(公告)号：US06977130B2
公开(公告)日：2005-12-20
申请号：US10618631
申请日：2003-07-15
申请人： Hideo Aoki , Chiaki Takubo , Atsuko Iida , Yasuyuki Hotta , Naoko Yamaguchi
发明人： Hideo Aoki , Chiaki Takubo , Atsuko Iida , Yasuyuki Hotta , Naoko Yamaguchi
IPC分类号： H01L21/28 , G03G5/05 , G03G9/09 , G03G13/26 , H01L21/288 , H01L21/3205 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/46 , G03G13/16 , B05D1/04 , H05C1/00
CPC分类号： H05K3/4664 , G03G5/056 , G03G9/0926 , G03G13/26 , G03G15/224 , G03G15/225 , G03G15/6585 , G03G15/6591 , H01L24/19 , H01L2224/04105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/1266 , H05K3/246 , H05K2201/0212 , H05K2201/0347 , H05K2203/0425 , H05K2203/0517 , H05K2203/0522 , H05K2203/0537 , H01L2924/00
摘要： A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.
摘要翻译：提供了一种制造满足成本降低，多样化的小批量生产和更短的设计，制造，评估和校正周期的电子电路的方法。该方法包括至少形成第一图案或形成第二图案。形成第一图案包括：通过基本上由树脂制成的带电粒子的粘附在形成在感光基底上的静电潜像上形成可见图像; 通过可见图像的接触和加压将可见图像转印到中间转印基底上; 在中间转移基体上加热/软化; 并通过树脂层的接触和加压将加热/软化的树脂层转移到基材上。在形成第二图案时，使用含有导电金属微粒的带电粒子，在与第一图案形成类似地转移含金属的树脂图案之后，通过无电镀形成导体金属层。

55. 发明授权

US06931435B2 Congestion control and avoidance method in a data processing system 失效
标题翻译：数据处理系统中的拥塞控制和回避方法
公开(公告)号：US06931435B2
公开(公告)日：2005-08-16
申请号：US10183519
申请日：2002-06-28
申请人： Hideo Aoki , Takashi Nishikado , Daisuke Yokota , Yasuhiro Takahashi , Fumio Noda , Yoshiteru Takeshima
发明人： Hideo Aoki , Takashi Nishikado , Daisuke Yokota , Yasuhiro Takahashi , Fumio Noda , Yoshiteru Takeshima
IPC分类号： G06F12/00 , G06F13/00 , H04L29/06 , H04L29/08 , G06F15/16 , G06F12/08
CPC分类号： H04L67/2819 , H04L47/10 , H04L47/12 , H04L67/02 , H04L67/1002 , H04L67/1014 , H04L67/2828 , H04L67/2842 , H04L67/2885
摘要： A congestion control and avoidance method including a method check step of determining whether the request contents is cacheable or uncacheable on the basis of the request inputted from the client terminal, a first Uniform Resource Identifier (URI) check step of, when it is determined that the request contents is cacheable in the method check step, checking a URI included in the request from the client terminal to determine whether the request contents is cacheable or uncacheable, a first URI hash search step of, when it is determined that the request contents is cacheable based on determination of the first URI check step, searching a URI hash to determine to execute any of regular caching, priority caching and access limitationing operation, and a step of executing any of the regular caching, priority caching and access limitationing operation according to determination in the first URI hash search step.
摘要翻译：一种拥塞控制和回避方法，包括：基于从所述客户终端输入的请求来确定所述请求内容是可高速缓存还是不可缓存的方法检查步骤;第一统一资源标识符（URI）检查步骤，当确定所述请求内容在所述方法检查步骤中是可高速缓存的，从所述客户机终端检查所述请求中包含的URI，以确定所述请求内容是可高速缓存还是不可缓存的;第一URI散列搜索步骤，当确定所述请求内容为根据第一URI检查步骤的确定可缓存，搜索URI散列来确定执行常规高速缓存，优先级高速缓存和访问限制操作中的任何一种，以及执行任何常规高速缓存，优先级高速缓存和访问限制操作的步骤，根据在第一个URI散列搜索步骤中确定。

56. 发明申请

US20050014003A1 Thermoplastic resin composition and production method thereof 有权
标题翻译：热塑性树脂组合物及其制备方法
公开(公告)号：US20050014003A1
公开(公告)日：2005-01-20
申请号：US10617664
申请日：2003-07-14
申请人： Seiji Takei , Masahiro Osuka , Hideo Aoki , Mari Sekita , Masaaki Mouri
发明人： Seiji Takei , Masahiro Osuka , Hideo Aoki , Mari Sekita , Masaaki Mouri
IPC分类号： B05D1/34 , B32B15/02 , B32B17/02 , C08F14/26 , C08K5/02 , C08L23/04
CPC分类号： C08F14/26 , C08L23/04 , Y10T428/25 , Y10T428/254 , Y10T428/2998 , C08F2/16 , C08L2666/06
摘要： The present invention provides a thermoplastic resin composition comprising a thermoplastic resin (A), an acrylic polymer (B), a polytetrafluoroethylene-containing powder mixture (C) and a filler (D), the amount of the acrylic polymer (B) being from 0.1 to 400 parts by weight, the amount of the filler (D) being from 1 to 2000 parts by weight, based on 100 parts by weight of the thermoplastic resin (A), and the amount of a polytetrafluoroethylene component in the polytetrafluoroethylene-containing powder mixture (C) is from 0.01 to 400 parts by weight based on 100 parts by weight of the thermoplastic resin (A).
摘要翻译：本发明提供一种包含热塑性树脂（A），丙烯酸类聚合物（B），含聚四氟乙烯的粉末混合物（C）和填料（D）的热塑性树脂组合物，丙烯酸类聚合物（B）的量来自相对于热塑性树脂（A）100重量份，含有聚四氟乙烯的聚四氟乙烯成分的含量为0.1〜400重量份，填料（D）的含量为1〜2000重量份粉末混合物（C）相对于热塑性树脂（A）100重量份为0.01〜400重量份。

57. 发明授权

US06742701B2 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus 失效
标题翻译：凸块成型方法，预焊处理方法，焊接方法，凸块成形装置，预焊处理装置和焊接装置
公开(公告)号：US06742701B2
公开(公告)日：2004-06-01
申请号：US10161566
申请日：2002-05-30
申请人： Masahiko Furuno , Tsugunori Masuda , Hideo Aoki , Kazuhide Doi
发明人： Masahiko Furuno , Tsugunori Masuda , Hideo Aoki , Kazuhide Doi
IPC分类号： B23K100
CPC分类号： H01L21/67138 , B23K1/206 , B23K2101/40 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1184 , H01L2224/13099 , H01L2224/45144 , H01L2224/742 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H05K3/3457 , H05K3/3489 , H05K3/3494 , H01L2924/00
摘要： Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.
摘要翻译：处理气体从气体供给装置供给到真空室中的等离子体发生装置，并且在低压下由等离子体产生装置产生含氢等离子体。在由工件曝光装置支撑的工件的表面上的软焊料合金暴露于含氢等离子体，使得软焊合金被含氢等离子体照射。在等离子体照射之间或同时等离子体照射之后，软焊料合金通过加热装置在真空中进行回流处理。由于不使用助熔剂，因此不需要洗涤工序，通过在工件表面使用廉价的软焊料合金制成的凸点电极端子具有很高的可靠性。

58. 发明授权

US5932142A Benzotriazolyl-alkylene bisphenol compounds, process for their preparation, and stabilized organic materials containing them 失效
标题翻译：苯并三唑基 - 亚烷基双酚化合物，其制备方法和含有它们的稳定的有机材料
公开(公告)号：US5932142A
公开(公告)日：1999-08-03
申请号：US986797
申请日：1997-12-08
申请人： Toshiyuki Yamauchi , Eisuke Kanagawa , Hideo Aoki , Kazuyuki Ishihara
发明人： Toshiyuki Yamauchi , Eisuke Kanagawa , Hideo Aoki , Kazuyuki Ishihara
IPC分类号： C07D249/20 , C08K5/3475 , C08L101/00 , C09K15/30 , C09K15/08 , C09K15/16 , C09K15/24
CPC分类号： C08K5/3475 , C07D249/20
摘要： A process for preparing benzotriazolyl-alkylene bisphenol compounds which comprises reacting a 2-hydroxyphenylbenzotriazole and a 2,4-substituted phenol with an aldehyde in the presence of a basic catalyst and an amine compound; benzotriazolyl-alkylene bisphenol compounds obtained by the process; and stabilized organic materials containing the resulting benzotriazolyl-alkylene bisphenol compounds in an amount of 0.01-10 percent by weight. It is possible to prepare the benzotriazolyl-alkylene bisphenol compounds at a high yield, and organic materials can be effectively stabilized with the resulting compounds.
摘要翻译：一种制备苯并三唑基 - 亚烷基双酚化合物的方法，包括在碱性催化剂和胺化合物的存在下使2-羟基苯基苯并三唑和2,4-取代的苯酚与醛反应; 通过该方法获得的苯并三唑基 - 亚烷基双酚化合物; 和含有所得到的苯并三唑基 - 亚烷基双酚化合物的稳定的有机材料的量为0.01-10重量％。可以以高产率制备苯并三唑基 - 亚烷基双酚化合物，并且可以用所得化合物有效地稳定有机材料。

59. 发明授权

US5628111A Methods of fabricating of semiconductor package and mounting of semiconductor device 失效
标题翻译：制造半导体封装的方法和半导体器件的安装
公开(公告)号：US5628111A
公开(公告)日：1997-05-13
申请号：US396236
申请日：1995-03-01
申请人： Hiroshi Iwasaki , Hideo Aoki
发明人： Hiroshi Iwasaki , Hideo Aoki
IPC分类号： H01L21/60 , H01L21/56 , H01L21/58 , H01L23/02 , H05K3/30
CPC分类号： H01L24/83 , H01L24/29 , H01L24/75 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/7565 , H01L2224/75755 , H01L2224/83102 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/0665 , H01L2924/07802 , H01L2924/3025 , Y10T29/49146 , Y10T29/53178
摘要： A method of fabricating a semiconductor package comprising the steps of setting a semiconductor chip having a pad with protruding electrodes on an insulation board having a main surface on which a wiring circuit and connection terminals are formed and an other main surface on which flat-type external connecting terminals are formed, to align the protruding electrodes of the semiconductor chip with the connection terminals of the insulating board, wherein the insulating board is installed on a pressing stage, pressing the semiconductor chip onto the insulation board to connect the protruding electrodes to the connection terminals, clamping the semiconductor chip and the insulation board by clamping means to form a clamped unit which keeps the pressure on the semiconductor chip and the insulation board, transferring the clamped unit from the pressing stage to a resin supplying stage, supplying a sealing resin in a space formed between an upper surface of the circuit board and a lower surface of the semiconductor chip in the clamped unit, transferring the resin supplied unit from the resin supplying stage to a resin curing stage, curing the sealing resin filled in the space formed between the upper surface of the insulation board and the lower surface of the semiconductor chip in the clamped unit, and removing the clamping means from the clamped unit after the curing of the sealing resin is completed.
摘要翻译：一种制造半导体封装的方法，包括以下步骤：将具有突起电极的焊盘的半导体芯片设置在具有主表面的绝缘板上，在其上形成有布线电路和连接端子的主表面和在其上形成平坦型外部形成连接端子，以将半导体芯片的突出电极与绝缘板的连接端对准，其中绝缘板安装在加压台上，将半导体芯片按压到绝缘板上以将突出的电极连接到连接端子，通过夹持装置夹紧半导体芯片和绝缘板，以形成夹持单元，其保持半导体芯片和绝缘板上的压力，将夹紧单元从压制阶段转移到树脂供应阶段，将密封树脂供应到形成在电路板的上表面和下侧之间的空间将树脂供给单元从树脂供给台传递到树脂固化阶段，使填充在形成于绝缘板的上表面和半导体的下表面之间的空间中填充的密封树脂固化并且在密封树脂固化完成之后从夹紧单元移除夹紧装置。

60. 发明授权

US5168407A Flying magnetic head 失效
标题翻译：飞磁头
公开(公告)号：US5168407A
公开(公告)日：1992-12-01
申请号：US612935
申请日：1990-11-13
申请人： Tatsushi Shimizu , Hideo Aoki , Nobuo Imazeki
发明人： Tatsushi Shimizu , Hideo Aoki , Nobuo Imazeki
IPC分类号： G11B5/60
CPC分类号： G11B5/6005
摘要： A flying magnetic head is provided in which a head core, formed by laminating a magentic thin film on a non-magnetic substrate, is fitted into a slot formed in a slider through a bonding glass layer. The substrate of the head core and the slider are formed from the same material. The coefficient of thermal expansion of the head core substrate is substantially the same as that of the magnetic thin film. The thickness of the bonding glass layer which bonds the head core to the slider is reduced to 20 .mu.M or less.
摘要翻译：提供了一种飞行磁头，其中通过在非磁性基板上层叠磁性薄膜而形成的磁头芯通过粘合玻璃层装配到形成在滑块中的槽中。头芯和滑块的基板由相同的材料形成。头芯基板的热膨胀系数与磁性薄膜的热膨胀系数基本相同。将磁头芯与滑块结合的接合玻璃层的厚度减小到20μm以下。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式