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51. 发明专利

JP2001176779A BOARD-PROCESSING APPARATUS 失效
公开(公告)号：JP2001176779A
公开(公告)日：2001-06-29
申请号：JP35788599
申请日：1999-12-16
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , SENBA NORIO , AKUMOTO MASAMI
IPC分类号： H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a board-processing apparatus that can save energy, efficiently control the temperature and moisture of an air or adult the temperature of liquid, and realize space savings. SOLUTION: A coating developing device 1 is provided with an air supply device 81 for supplying air in a cup 24 which houses a wafer W, a constant temperature water device 82 for supplying a temperature controlled water for temperature adjustment, and a cooling device 50 for cooling the wafer W. The cooling device 50 is provided with a passage 93 for distributing cooling water, and the air supply device 81 is provided with a cooling/moisture reducing part 85 therein to cool the air, temperature controlled water and cooling water.

52. 发明专利

JP2001168167A TREATING SYSTEM AND METHOD 失效
公开(公告)号：JP2001168167A
公开(公告)日：2001-06-22
申请号：JP35014499
申请日：1999-12-09
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , INADA HIROICHI
IPC分类号： H01L21/677 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To shorten a treating time by increasing the efficiencies of substrate carry-in/carry-out to treating equipment and substrate transfer between the treating equipment. SOLUTION: The system includes a vertical transport device 7 for transporting a substrate W in a vertical direction and circumferential transport devices for transporting the substrate W in a circumferential direction. Treating equipment 20, 21, 22 and 23 for performing predetermined treating over the substrate W are arranged in the circumferential direction to which the substrate is transported by the circumferential transport devices 10, 11, 12 and 13.

53. 发明专利

JP2001168004A WAFER TREATING DEVICE 失效
公开(公告)号：JP2001168004A
公开(公告)日：2001-06-22
申请号：JP34842899
申请日：1999-12-08
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , DEGUCHI MASATOSHI
IPC分类号： H01L21/677 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a wafer treating device capable of efficiently conveying a wafer and further to prevent liquid treatment unit from being affected by the heat of a heat treatment unit. SOLUTION: A wafer treating device 1 is provided with a first treatment unit group U1 for applying a first treatment process to a wafer W, a second treatment unit group U2 for applying a second treatment process to the wafer W, and conveying means 81 and 82 for conveying the wafer W to these first and second treatment unit groups U1 and U2. The first treatment unit group U1 is located along with a first conveyance route 21, and the second treatment unit group U2 is located along with a second conveyance route 22. Besides, concerning the first and second treatment unit groups U1 and U2, the liquid treatment unit is located so as not to be affected by the heat of the heat treatment unit.

54. 发明专利

JP2001093827A TREATMENT SYSTEM 失效
公开(公告)号：JP2001093827A
公开(公告)日：2001-04-06
申请号：JP2000195805
申请日：2000-06-29
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI
IPC分类号： B65G49/00 , F24F7/06 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a treatment system for preventing disturbance of air flow formed in a system. SOLUTION: When a wafer carriage means 54 of a first carriage unit 50 and a wafer carriage means 64 of a second carriage unit 60 move downward at the same time, the exhausting amount of exhausting fans 135 to 138 is increased under control of a controller 139, and a downflow of cleaning air is made strong. Then, a disturbance in air flow caused by the downward movement of the wafer carriage means 54 of the first carriage unit 50, and the wafer carriage means 64 of the second carriage unit 60 at the same time is absorbed by the strengthened downflow.

55. 发明专利

JP2001044119A RESIST COATING, DEVELOPING, AND PROCESSING APPARATUS 失效
公开(公告)号：JP2001044119A
公开(公告)日：2001-02-16
申请号：JP2000150418
申请日：2000-05-22
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI
IPC分类号： G03F7/16 , B65G49/00 , G03F7/30 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To effectively eliminate influence of impurity components, such as the particles, alkaline component, etc., and the variations in the environment, such as the temperature, humidity, etc., on processing. SOLUTION: A resist coating, developing, and processing apparatus is provided with a cassette station 10, a processing station 11, and air flow forming mechanisms 60 and 80, which form an air flow from the top side to the bottom side of an interface section 12. The apparatus is also provided with a controller 90 which controls the mechanisms 60 and 80. The processing station 11 has vent holes 56 and 57, respectively communicating with the cassette station 10 and interface section 12, and the controller 90 forms air flows from the processing station 11 to the cassette station 10 and interface section 12 by controlling the air flow forming mechanism 60, so that the pressure in the processing station 11 becomes higher than those in the cassette station 11 and interface section 12.

56. 发明专利

JP2000331907A PROCESSING SYSTEM 失效
公开(公告)号：JP2000331907A
公开(公告)日：2000-11-30
申请号：JP13673399
申请日：1999-05-18
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI
IPC分类号： H01L21/027 , G03F7/16 , G03F7/30 , H01L21/00
摘要： PROBLEM TO BE SOLVED: To provide a processing system for reducing costs for forming a system environment. SOLUTION: In this processing system, down-flow clean air is supplied from the upper part through a temperature/moisture adjuster 81 for controlling temperature and moisture to a first block B in which processing for applying a reflection preventing film on a wafer W is operated, and a second block B2 in which processing for applying a resist film on the wafer W is operated, and downflow clean air is supplied from the upper part through a temperature adjuster 83 for controlling only the temperature to a third block B3 in which processing for developing the exposed resist film is operated, and the downflow clean air is directly supplied to a first block B2 in which processing for carrying the wafer W between the blocks is excited.

57. 发明专利

JP2000100718A EQUIPMENT FOR TREATMENT AND METHOD THEREFOR 失效
公开(公告)号：JP2000100718A
公开(公告)日：2000-04-07
申请号：JP28606298
申请日：1998-09-22
申请人： TOKYO ELECTRON LTD
发明人： KIMURA YOSHIO , UEDA KAZUNARI
IPC分类号： H01L21/677 , H01L21/027 , H01L21/673 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To smoothly perform the flow of a delivering part of a carrier at a delivering part of a substrate carrier, and effectively use the space of a clean room, in spreading/developing equipment which spreads resist on a substrate and develops and treats the resist after exposure. SOLUTION: A carrier delivering part 2 is constituted by arranging, e.g. four exchanging mechanisms 20 in which two carriers C are made one set and vertical positions of the carriers C are exchanged. The exchanging mechanisms 20 is so constituted that two mounting tables S1, S2 can be vertically rotated, keeping the almost horizontal in attitude as it is. Access to the carrier C on a mounting table S1 (S2) of the upper side is performed with a substrate-carrying mechanism 52, which moves along a guide member 51 in the vicinity of a ceiling part of a clean room, and access to a substrate in the carrier C on a mounting table S2 (S1) of the lower side is made with a substrate-carrying mechanism of the equipment side. After treatment of the substrate in the carrier C of the lower side is finished, positions of the carriers C of the upper side and the lower side are exchanged.

58. 发明专利

JP2002164410A APPARATUS FOR PROCESSING SUBSTRATE AND METHOD FOR PROCESSING SUBSTRATE 失效
公开(公告)号：JP2002164410A
公开(公告)日：2002-06-07
申请号：JP2001077548
申请日：2001-03-19
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , HAYASHI SHINICHI , IIDA NARIAKI , MATSUYAMA YUJI , DEGUCHI YOICHI , MATSUNAGA MASATAKA , MIYATA AKIRA
IPC分类号： B65G49/00 , B65G49/06 , B65G49/07 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for processing a substrate and a method for processing the substrate where the influence of the time needed for cooling process of the substrate can be reduced to the throughput drop as much as possible. SOLUTION: Each heat treatment unit to ten steps G3-G5 and each coating unit of five steps G1 and G2 are arranged at the periphery of a first main wafer transfer A1 and a second main wafer transfer A2, and in the heat treatment unit G3-G5, by transferring the wafer W while controlling the temperature of the wafer W with an apparatus C for controlling temperature and transferring, the influence of the time needed for cooling process of the substrate can be reduced to the throughput drop as much as possible.

59. 发明专利

JP2001155992A SYSTEM FOR PROCESSING SUBSTRATE 失效
公开(公告)号：JP2001155992A
公开(公告)日：2001-06-08
申请号：JP2000274113
申请日：2000-09-08
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI
IPC分类号： G03F7/16 , B65G49/00 , G03F7/30 , H01L21/027 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a system for processing substrate in which temperature control of processing liquid supply units or cooling units for processing substrates in the vicinity of normal temperature can be performed precisely while saving the space. SOLUTION: The system for processing substrate is sectioned, on the opposite sides of a transfer stage TRS, into first regions 21, 31 for processing an wafer W in the vicinity of normal temperature and second regions 22, 32 for heating the wafer W. Processing units can be disposed entirely on the four sides around first carrying units 14, 24 and additional processing units can be disposed on the three sides around second carrying units 15, 25. The remaining one side can be utilized for delivering the wafer W to the outside.

60. 发明专利

JP2001118782A SUBSTRATE TREATER 失效
公开(公告)号：JP2001118782A
公开(公告)日：2001-04-27
申请号：JP29850399
申请日：1999-10-20
申请人： TOKYO ELECTRON LTD
发明人： UEDA KAZUNARI , TAKEKUMA TAKASHI , OKUMURA KENJI
IPC分类号： H01L21/677 , G03F7/16 , G03F7/30 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To arrange the layout which can shorten the pipe of treatment liquid in the case of piling up liquid treatment units in a plurality of stages, in a substrate treater where a cassette station and a treatment station are connected with each other and which treats a board, taken out of a substrate cassette, in liquid by means of the liquid treatment units within the treatment station, for example, an applicator and developer which forms, for example, a resist pattern. SOLUTION: Liquid treatment units piled up in a plurality of stages are arranged along a straight line at the right (or at the left) as one views, for example, the back from a cassette station, and supply control apparatuses such as a container, a valve, etc., for treatment liquid used for the liquid treatment device concerned are arranged in a lump as a chemical unit next or under the liquid treatment units in a plurality of stages.

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