会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 52. 发明授权
    • Microstructure and method for the production thereof
    • 微结构及其制造方法
    • US06969628B2
    • 2005-11-29
    • US10296771
    • 2001-06-13
    • Andreas BertzThomas GessnerMatthias KüchlerRoman Knöfler
    • Andreas BertzThomas GessnerMatthias KüchlerRoman Knöfler
    • B81B3/00B81C1/00H01L21/00
    • B81B3/0086B81B2203/033B81C2201/016
    • The invention relates to a microstructure in a preferably electrically conductive substrate (1), more specifically made of doped single crystal silicon, with at least one functional unit (2.1, 2.2) and to a method of fabricating the same. In accordance with the invention, the functional unit (2.1, 2.2) is mechanically and electrically separated from the substrate (1) on all sides by means of isolation gaps (5, 5a) and is connected, on at least one site, to a first structure (4a) of an electrically conductive layer (S) that is electrically isolated from the substrate (1) by way of an isolation layer (3) and that secures the unit into position relative to the substrate (1). For this purpose, the functional unit (2.1, 2.2) is released from the substrate (1) in such a manner that the isolation gaps (5, 5a) are provided on all sides relative to the substrate (1). The electrically conductive layer (S) is applied in such a manner that it is connected through contact fingers (4a) for example to the functional unit (2.1, 2.2) which it secures into position. The method in accordance with the invention permits to substantially facilitate the manufacturing process and to produce a microstructure with but small parasitic capacitances.
    • 本发明涉及在具有至少一个功能单元(2.1,2.2)的优选导电衬底(1)中,更具体地由掺杂单晶硅制成的微观结构及其制造方法。 根据本发明,通过隔离间隙(5,5a),功能单元(2.1,2.2)在所有侧面上与基板​​(1)机械地和电气地分开,并且在至少一个位置连接到 通过隔离层(3)与衬底(1)电绝缘的导电层(S)的第一结构(4a),并且将单元固定在相对于衬底(1)的位置。 为此,功能单元(2.1,2.2)以这样的方式从基板(1)释放,使得隔离间隙(5,5a)相对于基板(1)设置在所有侧面上。 导电层(S)以这样的方式被施加,使得它通过接触指状物(4a)例如连接到功能单元(2.1,2.2)上,其被固定到位。 根据本发明的方法允许基本上方便制造过程并产生具有小的寄生电容的微结构。
    • 55. 发明授权
    • Micromechanical accelerometer and method of manufacture thereof
    • 微机械加速度计及其制造方法
    • US5504032A
    • 1996-04-02
    • US224750
    • 1994-04-07
    • Thomas GessnerMartin HafenEberhard HandrichPeter LeinfelderBruno RyrkoEgbert VetterMaik Wiemer
    • Thomas GessnerMartin HafenEberhard HandrichPeter LeinfelderBruno RyrkoEgbert VetterMaik Wiemer
    • G01P15/08G01P15/125H01L21/306H01L29/84H01L21/76
    • G01P15/0802G01P15/125G01P2015/0828Y10S148/012Y10S73/01
    • A high precision micromechanical accelerometer comprises a layered structure of five (5) semiconductor wafers insulated from one another by thin semiconductor material oxide layers. The accelerometer is formed by first connecting a coverplate and a baseplate to associated insulating plates. Counter-electrodes, produced by anisotropic etching from the respective insulating plates, are fixed to the coverplate and the baseplate respectively. The counter-electrodes are contactable through the cover or baseplate via contact windows. A central wafer contains a unilaterally linked mass (pendulum) that is also produced by anisotropic etching and which serves as a movable central electrode of a differential capacitor. The layered structure is hermetically sealed by semiconductor fusion bonding. A stepped gradation from the top is formed at a wafer edge region for attaching contact pads to individual wafers to permit electrical contacting of individual wafers. The invention permits fabrication of a .mu.B device characterized by extremely small leakage capacitances and high temperature stability.
    • 一种高精度微机械加速度计包括由薄半导体材料氧化物层彼此绝缘的五(5)个半导体晶片的分层结构。 通过首先将盖板和底板连接到相关联的绝缘板来形成加速度计。 通过各自绝缘板的各向异性蚀刻制成的对电极分别固定在盖板和基板上。 相对电极可以通过接触窗口通过盖板或底板接触。 中央晶片包含单向连接的质量(摆),其也通过各向异性蚀刻产生,并且用作差分电容器的可移动中心电极。 层状结构通过半导体熔融粘合而密封。 在晶片边缘区域形成从顶部的阶梯状梯度,用于将接触焊盘附接到单个晶片以允许单个晶片的电接触。 本发明允许制造以极小的泄漏电容和高温稳定性为特征的μB器件。
    • 58. 发明授权
    • MEMS vacuum sensor based on the friction principle
    • 基于摩擦原理的MEMS真空传感器
    • US08186225B2
    • 2012-05-29
    • US12301874
    • 2007-05-09
    • Steffen KurthDirk TenholteKarla HillerChristian KaufmannThomas GessnerWolfram Doetzel
    • Steffen KurthDirk TenholteKarla HillerChristian KaufmannThomas GessnerWolfram Doetzel
    • G01L11/00
    • G01L21/22
    • The invention relates to a sensor element for pressure measurement, having a substrate (5) and at least one mass element (1), which is arranged spaced apart from the substrate (5) and is connected in an oscillating manner to the substrate (5) and/or a support body (6) fixed relative to the substrate (5), so that a gap is formed between the mass element (1) and the substrate (5), the width of which can be varied through oscillations of the mass element (1). At least one recess and/or at least one bushing (4) is located in the surface of the substrate (5) delimiting the gap, which recess is used for reducing the damping of the oscillation of the mass element through the gas or plasma surrounding the mass element (1). The sensor element is used in particular in pressure sensors for measuring pressures in the vacuum range. Through the use of the sensor element according to the invention as a pressure sensor, maximum pressures up to the range of atmospheric air pressure can be recorded. The lowest pressures to be determined are in the range of 10−6 mbar.
    • 本发明涉及一种用于压力测量的传感器元件,具有基板(5)和至少一个质量元件(1),其与基板(5)间隔开并且以振荡方式连接到基板(5) )和/或相对于基板(5)固定的支撑体(6),使得在质量元件(1)和基板(5)之间形成间隙,其宽度可以通过 质量元件(1)。 至少一个凹部和/或至少一个衬套(4)位于限定间隙的衬底(5)的表面中,该凹槽用于减少通过气体或等离子体周围的质量元件的振荡的阻尼 质量元件(1)。 传感器元件特别用于测量真空范围内的压力的压力传感器。 通过使用根据本发明的传感器元件作为压力传感器,可以记录高达大气压力范围的最大压力。 要确定的最低压力在10-6毫巴的范围内。
    • 59. 发明申请
    • MICROSTRUCTURE, METHOD FOR PRODUCING THE SAME, DEVICE FOR BONDING A MICROSTRUCTURE AND MICROSYSTEM
    • US20110284975A1
    • 2011-11-24
    • US13146759
    • 2010-01-26
    • Joerg BraeuerThomas GessnerLutz HofmannJoerg FroemelMaik WiemerHolger LetschMario Baum
    • Joerg BraeuerThomas GessnerLutz HofmannJoerg FroemelMaik WiemerHolger LetschMario Baum
    • H01L29/06H01L29/82H01L21/28H01L29/84B82Y99/00
    • B81C3/001B81C2203/019B81C2203/032
    • A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A device for bonding a microstructure, which has at least one bonding substrate and a reactive multilayer system, to a further structure, which has a bonding substrate. The device has a bonding chamber, which can be opened and closed and evacuated and in which the microstructure and the further structure can be introduced and aligned with one another, and also an activation mechanism, which is coupled to the bonding chamber and by means of which the reactive multilayer system of the microstructure, said reactive multilayer system being formed from reactive nanostructures with—situated therebetween—a material constituting a reaction partner with respect to the material of the nanostructures, can be activated mechanically, electrically, electromagnetically, optically and/or thermally in such a way that a self-propagating, exothermic reaction takes place between the nanostructures and the material constituting a reaction partner with respect to the material of the nanostructures. A microsystem is formed from two bonding substrates and a construction lying between the bonding substrates, the construction having a reacted reactive layer system, wherein the reacted reactive layer system is a reacted structure sequence composed of at least one surface layer—provided on the bonding substrate—with vertically oriented nanostructures spaced apart from one another, and regions filled between the nanostructures with at least one material constituting a reaction partner with respect to the material of the nanostructures. The microsystem is a sensor coated with biomaterial and/or has elements composed of polymeric material and/or at least one magnetic and/or piezoelectric and/or piezoresistive component.
    • 60. 发明申请
    • SWITCHABLE SPECIAL EFFECT SUBSTANCES
    • 可切换的特殊效应物质
    • US20110060113A1
    • 2011-03-10
    • US12991710
    • 2009-05-18
    • Thomas GessnerRuediger SensSophia Ebert
    • Thomas GessnerRuediger SensSophia Ebert
    • C08F26/06C07D471/06G21G5/00B23K26/00
    • B42D15/00B23K26/00C07D487/22C09B5/62C09B57/00C09B57/008
    • A process for altering the absorption of electromagnetic radiation by one or more compounds of the general formulae (I) wherein these compounds are irradiated with electromagnetic radiation of wavelength from 300 to 750 nm. The use of compounds of the general formula (I) or (II) for marking materials, for example paper or mineral oil, and use of compounds of the general formula (I) or (II) for causing a color change. The use of compounds of the general formula (I) or (II) for laser welding, heat management, as a photoinitiator, as a free-radical scavenger or for detection of oxygen. A process for regulating the absorption or transmission of electromagnetic radiation by a material wherein one or more compounds of the general formula (I) or (II) are contacted with this material and these compounds are irradiated with electromagnetic radiation of wavelength from 300 to 750 nm. Specific compounds of the general formula (I).
    • 一种通过一种或多种通式(I)化合物改变电磁辐射吸收的方法,其中这些化合物用波长为300-750nm的电磁辐射照射。 使用通式(I)或(II)的化合物来标记材料,例如纸或矿物油,以及使用通式(I)或(II)的化合物引起颜色变化。 将通式(I)或(II)的化合物用作激光焊接,热处理,作为光引发剂,作为自由基清除剂或用于检测氧气。 通过其中一种或多种通式(I)或(II)化合物与该材料接触的材料调节电磁辐射的吸收或透过的方法,并且这些化合物用波长在300至750nm的电磁辐射照射 。 具体的通式(I)化合物。