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    • 54. 发明申请
    • FORMING ELECTRICALLY-CONDUCTIVE PATTERNS USING CROSSLINKABLE REACTIVE POLYMERS
    • 使用可交联反应聚合物形成电导体图案
    • US20160048078A1
    • 2016-02-18
    • US14457396
    • 2014-08-12
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • G03F7/16G03F7/038
    • G03F7/16G03F7/0045G03F7/0046G03F7/038G03F7/0382G03F7/0388G03F7/26
    • An electrically-conductive pattern is prepared using a reactive composition having: (1) a reactive polymer; (2) a compound that provides a cleaving acid upon exposure to radiation; and (3) a crosslinking agent that reacts in the presence of the cleaving acid, to provide crosslinking in the reactive polymer. A polymeric layer of the reactive composition is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising sulfonic acid or sulfonate groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, which pattern is reduced to provide a pattern of corresponding electroless seed metal particles. Electrolessly plating is then carried out in the exposed regions. The unique reactive comprises (a) recurring units represented Structure (A) as described in the disclosure, and can also include other recurring units that are crosslinkable or provide other properties.
    • 使用具有以下物质的反应性组合物制备导电图案:(1)反应性聚合物; (2)暴露于辐射时提供裂解酸的化合物; 和(3)在裂解酸存在下反应以在反应性聚合物中提供交联的交联剂。 将反应性组合物的聚合物层图案地暴露以提供包含非暴露区域的聚合物层和包含包含磺酸或磺酸盐基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电晶种金属离子的图案,该图案被还原以提供相应的无电子种子金属颗粒的图案。 然后在暴露的区域进行无电镀。 独特的反应性包括(a)如本公开所述的结构(A)所示的重复单元,并且还可以包括可交联或提供其它性质的其它重复单元。
    • 55. 发明申请
    • FORMING CONDUCTIVE METAL PATTERNS USING WATER-SOLUBLE POLYMERS
    • 使用水溶性聚合物形成导电金属图案
    • US20160018737A1
    • 2016-01-21
    • US14331519
    • 2014-07-15
    • Thomas B. BrustGrace Ann Bennett
    • Thomas B. BrustGrace Ann Bennett
    • G03F7/40G03F7/038
    • G03F7/40G03F7/031G03F7/038G03F7/0388
    • A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises photosensitive non-aromatic heterocyclic groups each of these groups comprising a carbon-carbon double bond in conjugation with an electron withdrawing group, as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
    • 可以使用包含反应性组合物的聚合物层形成导电图案,所述反应性组合物包含金属离子络合,水溶性和可交联的反应性聚合物。 该反应性聚合物包含光敏非芳族杂环基团,这些基团包括与吸电子基团共轭的碳 - 碳双键,以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去,但是聚合物层的暴露区域与无电子种子金属离子接触,然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。
    • 56. 发明申请
    • FORMING CONDUCTIVE METAL PATTERNS USING THIOSULFATE COPOLYMERS
    • 使用硫代脂肪族共聚物形成导电金属图案
    • US20150293451A1
    • 2015-10-15
    • US14249390
    • 2014-04-10
    • Mark Edward IrvingThomas B. BrustGrace Ann Bennett
    • Mark Edward IrvingThomas B. BrustGrace Ann Bennett
    • G03F7/16G03F7/038G03F7/20
    • G03F7/038G03F7/0384G03F7/11G03F7/16G03F7/2002G03F7/40G03F7/405
    • A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant thiosulfate groups as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
    • 可以使用包含反应性组合物的聚合物层形成导电图案,所述反应性组合物包含金属离子络合,水溶性和可交联的反应性聚合物。 该反应性聚合物包括硫代硫酸根基团以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除,但是聚合物层的暴露区域与无电晶种金属离子接触,然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。
    • 58. 发明授权
    • Pattern formation using electroless plating and articles
    • 使用化学镀和制品的图案形成
    • US09081282B1
    • 2015-07-14
    • US14187423
    • 2014-02-24
    • Thomas B. BrustCatherine A. FalknerMark Edward Irving
    • Thomas B. BrustCatherine A. FalknerMark Edward Irving
    • G03F7/26G03F7/16G03F7/20G03F7/038
    • G03F7/0388G03F7/00G03F7/40G03F7/405
    • A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant groups comprising crosslinkable —C(═O)—CR═CR1—Y— groups wherein R and R1 are defined in the disclosure, as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
    • 可以使用包含反应性组合物的聚合物层形成导电图案,所述反应性组合物包含金属离子络合,水溶性和可交联的反应性聚合物。 该反应性聚合物包括包含可交联的-C(= O)-CR = CR 1 -Y-基团的侧基,其中R和R 1在本公开内定义,以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除,但是聚合物层的暴露区域与无电晶种金属离子接触,然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。
    • 59. 发明授权
    • Forming conductive metal patterns using water-soluble copolymers
    • 使用水溶性共聚物形成导电金属图案
    • US09069248B1
    • 2015-06-30
    • US14277334
    • 2014-05-14
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • Thomas B. BrustGrace Ann BennettMark Edward Irving
    • G03F7/26G03F7/16G03F7/20
    • G03F7/0388G03F7/405
    • A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises photosensitive non-aromatic unsaturated carbocyclic groups as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
    • 可以使用包含反应性组合物的聚合物层形成导电图案,所述反应性组合物包含金属离子络合,水溶性和可交联的反应性聚合物。 该反应性聚合物包括光敏非芳族不饱和碳环基团以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除,但是聚合物层的暴露区域与无电晶种金属离子接触,然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。