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51. 发明申请

US20100216078A1 DEVELOPING METHOD 有权
标题翻译：发展方法
公开(公告)号：US20100216078A1
公开(公告)日：2010-08-26
申请号：US12710510
申请日：2010-02-23
申请人： Taro YAMAMOTO , Kousuke Yoshihara , Yuichi Yoshida
发明人： Taro YAMAMOTO , Kousuke Yoshihara , Yuichi Yoshida
IPC分类号： G03C7/407
CPC分类号： H01L21/027 , G03F7/3021 , H01L21/67051 , H01L21/6715
摘要： Disclosed is a developing method that develops a substrate, which has a surface coated with a resist having been exposed, while the substrate is held horizontally and is rotating about a vertical axis. The method includes supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion of the substrate toward a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion of the substrate toward the peripheral portion of the substrate. The supplying of the developing liquid and the supplying the first rinse liquid are performed concurrently, while the first rinse nozzle is maintained nearer to a center of the substrate than the developer nozzle.
摘要翻译：公开了一种显影方法，其显影方法是在基板被水平地保持并且围绕垂直轴线旋转的同时，使具有被曝光的抗蚀剂的表面被覆的基板。该方法包括将显影剂喷嘴的排出口的显影液从衬底的中心部分朝向衬底的周边部分移动，将显影剂喷嘴的显影剂供给到衬底的表面上，将第一冲洗喷嘴的第一冲洗液从第一冲洗喷嘴的排出口喷射到基板的表面上，同时将基板上方的第一冲洗喷嘴从基板的中心部朝向基板的周边部分移动。同时进行显影液的供给和供给第一冲洗液，同时第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。

52. 发明授权

US09162247B2 Coating and development treatment system with airflow control including control unit and movable airflow control plate 有权
标题翻译：涂装开发处理系统，包括控制单元和可移动气流控制板
公开(公告)号：US09162247B2
公开(公告)日：2015-10-20
申请号：US13448526
申请日：2012-04-17
申请人： Kousuke Yoshihara , Koji Takayanagi , Shinichi Hatakeyama , Kohei Kawakami
发明人： Kousuke Yoshihara , Koji Takayanagi , Shinichi Hatakeyama , Kohei Kawakami
IPC分类号： B05C11/00 , B05C13/02 , B05C5/00 , B05C11/02 , B05D1/00 , H01L21/67 , G03F7/16 , B05D3/12 , H01L21/00 , H01L51/00
CPC分类号： H01L21/0337 , B05C11/023 , B05D1/005 , G03F7/162 , G06F19/00 , H01L21/0271 , H01L21/6715 , H01L51/0003 , H01L2224/03418
摘要： A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.
摘要翻译：一种涂布处理装置，其将涂布溶液供给到旋转的基板的前表面，并将供给的涂布溶液扩散到基板的外周侧，从而将涂布液涂布在基板的前表面上，包括：保持基板底物; 旋转部，旋转保持在所述基板保持部上的所述基板; 供给部，其向保持在所述基板保持部的所述基板的前表面供给涂布液; 以及气流控制板，其设置在保持在所述基板保持部上的所述基板上方的预定位置，用于在任意位置局部地改变由所述旋转部旋转的所述基板上方的气流。

53. 发明授权

US08505479B2 Resist coating apparatus 有权
标题翻译：抗蚀涂层设备
公开(公告)号：US08505479B2
公开(公告)日：2013-08-13
申请号：US12877187
申请日：2010-09-08
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
IPC分类号： B05C11/00 , B05C11/02
CPC分类号： H01L21/6715 , G03F7/162
摘要： A resist coating apparatus supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.
摘要翻译：抗蚀涂层装置在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后使基板的旋转减速到低于第一转速的第二转速，或直到旋转停止，随着转速变得更接近于第二转速或转动停止，减速步骤中的减速度变小，并且将基板的旋转加速到高于第二转速的第三转速，以使其脱离抗蚀剂溶液的残留物。

54. 发明授权

US08414972B2 Coating treatment method, coating treatment apparatus, and computer-readable storage medium 有权
标题翻译：涂布处理方法，涂布处理装置和计算机可读存储介质
公开(公告)号：US08414972B2
公开(公告)日：2013-04-09
申请号：US12530345
申请日：2008-02-28
申请人： Kousuke Yoshihara , Tomohiro Iseki , Koji Takayanagi
发明人： Kousuke Yoshihara , Tomohiro Iseki , Koji Takayanagi
IPC分类号： B05D3/12
CPC分类号： H01L21/02104 , B05D1/005 , G03F7/162 , H01L21/02282 , H01L21/6715
摘要： In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.
摘要翻译：在涂布步骤中，基板高速旋转，并且在该状态下，将抗蚀剂溶液从第一喷嘴排出到基板的中心部分，以将抗蚀剂溶液涂覆在基板上。随后，在平坦化步骤中，基板的旋转减速，并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。在这种情况下，在涂布步骤中，通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间，并且当在平坦化步骤中完成抗蚀剂溶液的排出时，第一喷嘴移动抗蚀剂溶液从衬底的中心部分的放电位置。根据本发明，能够将抗蚀剂溶液均匀地涂布在基板内。

55. 发明申请

US20130068324A1 CHEMICAL SUPPLY SYSTEM, SUBSTRATE TREATMENT APPARATUS INCORPORATING THE SAME, AND COATING AND DEVELOPING SYSTEM INCORPORATING THE SAME APPARATUS 有权
公开(公告)号：US20130068324A1
公开(公告)日：2013-03-21
申请号：US13695844
申请日：2011-03-16
申请人： Toshinobu Furusho , Takahiro Ookubo , Kousuke Yoshihara , Yusuke Yamamoto , Steffen Hornig
发明人： Toshinobu Furusho , Takahiro Ookubo , Kousuke Yoshihara , Yusuke Yamamoto , Steffen Hornig
IPC分类号： F17D1/00
CPC分类号： B05D1/02 , B01D29/56 , B01D35/02 , B05C9/06 , B05C11/10 , F17D1/00 , H01L21/67017 , H01L21/6715 , H01L21/67173 , H01L21/67178 , Y10T137/794
摘要： A chemical supply system comprises: a first container and a second container for storing a chemical solution; a first pump, located on a first pipe connecting the first and second containers, for directing the solution stored in the first container to the second container; and a first filter, located in the first pipe, for filtering the solution flowing through the first pipe from the first container toward the second container. The system further includes: a second pipe for connecting the first container and the second container; and a second pump, located on the second pipe, for directing the solution stored in the second container to the first container.

56. 发明授权

US08318247B2 Coating treatment method, coating treatment apparatus, and computer-readable storage medium 有权
标题翻译：涂布处理方法，涂布处理装置和计算机可读存储介质
公开(公告)号：US08318247B2
公开(公告)日：2012-11-27
申请号：US12205999
申请日：2008-09-08
申请人： Kousuke Yoshihara , Tomohiro Iseki , Koji Takayanagi
发明人： Kousuke Yoshihara , Tomohiro Iseki , Koji Takayanagi
IPC分类号： B05D3/12
CPC分类号： G03F7/162
摘要： The present invention includes: a first step of discharging a coating solution from a nozzle to a center portion of the substrate to apply the coating solution on a surface of the substrate while rotating the substrate; a second step of decelerating, after the first step, the rotation of the substrate and continuously rotating the substrate; and a third step of accelerating, after the second step, the rotation of the substrate to dry the coating solution on the substrate, wherein: the substrate is rotated at a fixed speed of a first speed immediately before the first step; and in the first step, the rotation of the substrate which is at the first speed before start of the first step is gradually accelerated after the start of the first step so as to make the speed continuously change, and the acceleration of the rotation of the substrate is gradually decreased so as to make the speed of the rotation of the substrate converge in a second speed higher than the first speed at end of the first step.
摘要翻译：本发明包括：第一步骤，将涂布液从喷嘴排出到基板的中心部分，以在旋转基板的同时将涂布溶液施加到基板的表面上; 在第一步骤之后使基板旋转并使基板连续旋转的第二步骤; 以及第三步骤，在所述第二步骤之后加速所述基板的旋转以使所述基板上的所述涂布溶液干燥，其中：所述基板在所述第一步骤之前以一速度的固定速度旋转; 并且在第一步骤中，在第一步骤开始之后以第一速度的基板的旋转在第一步骤开始之后逐渐加速，以使得速度连续变化，并且旋转的加速度基板逐渐减小，以使得基板的旋转速度在第一步骤结束时以比第一速度高的第二速度会聚。

57. 发明授权

US07906173B2 Resist coating method and resist coating apparatus 有权
标题翻译：抗蚀涂层方法和抗蚀涂层设备
公开(公告)号：US07906173B2
公开(公告)日：2011-03-15
申请号：US11549826
申请日：2006-10-16
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
IPC分类号： B05D3/12
CPC分类号： H01L21/6715 , G03F7/162
摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then reduces a rotational speed of the target substrate to a second rotational speed lower than the first rotational speed, reduces the rotational speed of the target substrate to a third rotational speed lower than the second rotational speed or until rotational halt to adjust the film thickness of the resist solution, and accelerates the rotation of the target substrate to a fourth rotational speed higher than the third rotational speed to spin off a residue of the resist solution.
摘要翻译：抗蚀剂涂布方法在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将目标基板的转速降低到低于第一转速的第二转速将目标基板的旋转速度降低到低于第二旋转速度的第三旋转速度，或者直到旋转停止，以调整抗蚀剂溶液的膜厚度，并且将目标基板的旋转加速至高于第三旋转速度以分离抗蚀剂溶液的残留物。

58. 发明申请

US20090246397A1 RESIST SOLUTION SUPPLY APPARATUS, RESIST SOLUTION SUPPLY METHOD, AND COMPUTER STORAGE MEDIUM 审中-公开
标题翻译：电阻解决方案供应设备，电阻解决方案供应方法和计算机存储介质
公开(公告)号：US20090246397A1
公开(公告)日：2009-10-01
申请号：US12408262
申请日：2009-03-20
申请人： Kousuke Yoshihara , Kentaro Yoshihara
发明人： Kousuke Yoshihara , Kentaro Yoshihara
IPC分类号： B05D3/00 , B05C9/00 , B05C11/00
CPC分类号： G03F7/162 , H01L21/6715
摘要： The present invention is a resist solution supply apparatus for supplying a resist solution to a coating nozzle for discharging the resist solution to a substrate, including: a resist solution supply source storing the resist solution therein; a supply tube for supplying the resist solution from the resist solution supply source to the coating nozzle; a heating means provided on a side of the resist solution supply source along the supply tube for heating the resist solution in the supply tube to a predetermined temperature higher than room temperature; and a cooling means provided on a side of the coating nozzle along the supply tube for cooling the resist solution in the supply tube down to room temperature.
摘要翻译：本发明是一种用于将抗蚀剂溶液供应到用于将抗蚀剂溶液排放到基底的涂布喷嘴的抗蚀剂溶液供给装置，包括：将抗蚀剂溶液存储在其中的抗蚀剂溶液供给源; 供给管，用于将抗蚀剂溶液从抗蚀剂溶液供给源供给到涂布喷嘴; 沿着供给管设置在抗蚀剂溶液供给源侧的加热装置，用于将供应管中的抗蚀剂溶液加热到高于室温的预定温度; 以及冷却装置，其沿着供给管设置在涂料喷嘴的一侧，用于将供应管中的抗蚀剂溶液冷却至室温。

59. 发明授权

US07208066B2 Substrate processing apparatus and substrate processing method 失效
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07208066B2
公开(公告)日：2007-04-24
申请号：US10649780
申请日：2003-08-28
申请人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
发明人： Junichi Kitano , Yuji Matsuyama , Takahiro Kitano , Takayuki Katano , Hidefumi Matsui , Yo Suzuki , Masami Yamashita , Toru Aoyama , Hiroyuki Iwaki , Satoru Shimura , Masatoshi Deguchi , Kousuke Yoshihara , Naruaki Iida
IPC分类号： C23F1/00 , H01L21/306 , B05C11/00
CPC分类号： H01L21/67178 , G03F7/70991 , H01L21/67017 , H01L21/6715 , H01L21/67161 , H01L21/67184 , H01L21/67742 , H01L21/67778 , Y10T29/41
摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.
摘要翻译：在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。在各个区域的底部设置用于各区域的排气的排气管。通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

60. 发明授权

US08496991B2 Coating treatment method 有权
标题翻译：涂层处理方法
公开(公告)号：US08496991B2
公开(公告)日：2013-07-30
申请号：US13236750
申请日：2011-09-20
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
IPC分类号： B05D3/12
CPC分类号： H01L21/6715 , G03F7/162
摘要： The present invention supplies a solvent to a front surface of a substrate while rotating the substrate. The substrate is acceleratingly rotated to a first number of rotations, and a resist solution is supplied to a central portion of the substrate during the accelerating rotation and the rotation at a first number of rotations. The substrate is deceleratingly rotated to a second number of rotations, and after the number of rotations of the substrate reaches the second number of rotations, the resist solution is discharged to the substrate. The substrate is then acceleratingly rotated to a third number of rotations higher than the second number of rotations so that the substrate is rotated at the third number of rotations. According to the present invention, consumption of the resist solution can be suppressed and a high in-plane uniformity can be obtained for the film thickness of the resist film.
摘要翻译：本发明在旋转基板的同时将溶剂供给到基板的前表面。基板被加速旋转到第一转数，并且在加速旋转期间以及以第一转数旋转时，将抗蚀剂溶液供应到基板的中心部分。基板减速旋转到第二转数，并且在基板的转数达到第二转数之后，将抗蚀剂溶液排出到基板。然后将衬底加速旋转到高于第二转数的第三转数，使得衬底以第三转数旋转。根据本发明，可以抑制抗蚀剂溶液的消耗，并且可以获得抗蚀剂膜的膜厚度的高的面内均匀性。

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