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1. 发明申请

US20110312190A1 COATING METHOD AND COATING APPARATUS 审中-公开
标题翻译：涂料方法和涂料装置
公开(公告)号：US20110312190A1
公开(公告)日：2011-12-22
申请号：US13161948
申请日：2011-06-16
申请人： Katsunori Ichino , Kentaro Yoshihara , Kousuke Yoshihara
发明人： Katsunori Ichino , Kentaro Yoshihara , Kousuke Yoshihara
IPC分类号： H01L21/31 , B05C13/02
CPC分类号： B05D1/005 , B05D3/104 , G03F7/162 , H01L21/6715 , H01L21/67178
摘要： A coating method based on such a technique includes a prewetting step of supplying a prewetting liquid to the center of a substrate (W) and rotating the substrate thereby spreading the prewetting liquid over the whole surface of a first substrate, and a coating film forming step of supplying a coating solution (e.g., a resist solution) to the substrate supplied with the prewetting liquid and drying the coating solution thereby forming a coating film on the surface of the first substrate. The prewetting liquid used is a mixed liquid obtained by mixing a solvent capable of dissolving components of the coating film (e.g., components of resist) and a high surface tension liquid having a surface tension higher than that of the solvent, the mixed liquid having a surface tension higher than that of the coating solution.
摘要翻译：基于这种技术的涂布方法包括：预润湿步骤，将预润湿液体供给到基板（W）的中心并旋转基板，从而将预润湿液体扩展到第一基板的整个表面上;以及涂膜形成步骤向提供预润湿液体的基材供给涂布溶液（例如，抗蚀剂溶液）并干燥涂布溶液，从而在第一基板的表面上形成涂膜。所使用的预润湿液是通过混合能够溶解涂膜的成分（例如抗蚀剂的成分）的溶剂和表面张力高于溶剂的表面张力的高表面张力液体得到的混合液，所述混合液具有表面张力高于涂层溶液。

2. 发明申请

US20090246397A1 RESIST SOLUTION SUPPLY APPARATUS, RESIST SOLUTION SUPPLY METHOD, AND COMPUTER STORAGE MEDIUM 审中-公开
标题翻译：电阻解决方案供应设备，电阻解决方案供应方法和计算机存储介质
公开(公告)号：US20090246397A1
公开(公告)日：2009-10-01
申请号：US12408262
申请日：2009-03-20
申请人： Kousuke Yoshihara , Kentaro Yoshihara
发明人： Kousuke Yoshihara , Kentaro Yoshihara
IPC分类号： B05D3/00 , B05C9/00 , B05C11/00
CPC分类号： G03F7/162 , H01L21/6715
摘要： The present invention is a resist solution supply apparatus for supplying a resist solution to a coating nozzle for discharging the resist solution to a substrate, including: a resist solution supply source storing the resist solution therein; a supply tube for supplying the resist solution from the resist solution supply source to the coating nozzle; a heating means provided on a side of the resist solution supply source along the supply tube for heating the resist solution in the supply tube to a predetermined temperature higher than room temperature; and a cooling means provided on a side of the coating nozzle along the supply tube for cooling the resist solution in the supply tube down to room temperature.
摘要翻译：本发明是一种用于将抗蚀剂溶液供应到用于将抗蚀剂溶液排放到基底的涂布喷嘴的抗蚀剂溶液供给装置，包括：将抗蚀剂溶液存储在其中的抗蚀剂溶液供给源; 供给管，用于将抗蚀剂溶液从抗蚀剂溶液供给源供给到涂布喷嘴; 沿着供给管设置在抗蚀剂溶液供给源侧的加热装置，用于将供应管中的抗蚀剂溶液加热到高于室温的预定温度; 以及冷却装置，其沿着供给管设置在涂料喷嘴的一侧，用于将供应管中的抗蚀剂溶液冷却至室温。

3. 发明申请

US20090181174A1 METHOD OF TREATING SUBSTRATE AND COMPUTER STORAGE MEDIUM 审中-公开
标题翻译：处理基板和计算机存储介质的方法
公开(公告)号：US20090181174A1
公开(公告)日：2009-07-16
申请号：US12348513
申请日：2009-01-05
申请人： Kousuke YOSHIHARA , Tomohiro Iseki , Koji Takayanagi , Kentaro Yoshihara
发明人： Kousuke YOSHIHARA , Tomohiro Iseki , Koji Takayanagi , Kentaro Yoshihara
IPC分类号： B05D3/02
CPC分类号： H01L21/67248 , G03F7/162 , H01L21/6715
摘要： In the present invention, a substrate is adjusted in temperature such that its contact portion held on a substrate holding unit and its outer peripheral portion outside the contact portion are at different temperatures. The temperature of the contact portion is adjusted such that the contact portion and the substrate holding unit are at the same temperature when the substrate is held on the substrate holding unit. The temperature-adjusted substrate is then held and rotated by the substrate holding unit, and a coating solution is applied onto the rotating substrate to form a coating film with a uniform film thickness, so that even if the number of times of coating treatment for substrates increases, the film thickness of the coating film to be formed on the substrate can be made uniform.
摘要翻译：在本发明中，调整基板的温度，使得其保持在基板保持单元上的接触部分及其外部接触部分外部的温度处于不同的温度。调节接触部分的温度，使得接触部分和基板保持单元在基板被保持在基板保持单元上时处于相同的温度。然后通过基板保持单元将调温后的基板保持旋转，将涂布液涂布在旋转基板上，形成膜厚均匀的涂膜，使得即使基板的涂布处理次数可以使待在基板上形成的涂膜的膜厚均匀。

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