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51. 外观设计

USD582951S1 Nozzle for plasma cutting machine 有权
公开(公告)号：USD582951S1
公开(公告)日：2008-12-16
申请号：US29290753
申请日：2008-01-10
申请人： Yoshihiro Yamaguchi , Kazuhiro Kuraoka
设计人： Yoshihiro Yamaguchi , Kazuhiro Kuraoka

52. 发明申请

US20080093347A1 Plasma cutter, and plasma cutter power supply system 有权
标题翻译：等离子切割机和等离子切割机供电系统
公开(公告)号：US20080093347A1
公开(公告)日：2008-04-24
申请号：US11907838
申请日：2007-10-18
申请人： Yoshihiro Yamaguchi , Takahiro Iriyama
发明人： Yoshihiro Yamaguchi , Takahiro Iriyama
IPC分类号： H05H1/36 , B23K9/10 , H05H1/26
CPC分类号： H05H1/36
摘要： In a main circuit 11 of the plasma cutter power supply device 6, a plurality of DC power units 14-1, . . . 14-n of low capacity are connected in parallel on their DC output sides, and are connected to a plasma torch 20. Each power unit 14-1, . . . 14-n can operate asynchronously and independently from each other. The power supply control device 6 controls the number of power units to be operated, and the intensity of output electrical current at which each of them is to be operated, according to the cutting conditions (the nature of the material to be cut, its thickness, and the cutting speed) and according to the number of power units which can be operated. If some of the power units are faulty, the power supply control device 6 controls the cutting conditions which can be accepted, according to the number of normal power units.
摘要翻译：在等离子切割器电源装置6的主电路11中，多个直流电力单元14-1，。。 14 -n的低容量在其直流输出侧并联连接，并连接到等离子体焰炬20。每个电源单元14-1，。。。 14 -n可以彼此异步和独立地操作。电源控制装置6根据切割条件（待切割材料的性质，其厚度等）来控制要操作的功率单元的数量和要各自操作的输出电流的强度，切割速度）以及可以操作的动力单元的数量。如果一些动力单元有故障，则电源控制装置6根据正常功率单元的数量来控制可以接受的切割条件。

53. 发明申请

US20080066596A1 Cutting Machine and Method of Moving Cutting Head 审中-公开
标题翻译：切割机及移动切割头的方法
公开(公告)号：US20080066596A1
公开(公告)日：2008-03-20
申请号：US11596677
申请日：2005-05-20
申请人： Yoshihiro Yamaguchi , Satoshi Ohnishi
发明人： Yoshihiro Yamaguchi , Satoshi Ohnishi
IPC分类号： B26D5/02 , B23K26/08 , B23K7/10 , B26D1/00 , B26D5/00
CPC分类号： F16P3/147 , B23K7/002 , B23K7/10 , B23K10/00 , B23K10/006 , B23K26/0876 , B23K26/142 , B23K26/38 , B23K26/702 , B23K37/006 , B23K2101/18 , B23Q15/08 , F16P3/141 , F16P3/144 , G05B2219/43124 , G05B2219/45044 , G05B2219/49074 , Y10T83/05 , Y10T83/081 , Y10T83/8726
摘要： In a thermal cutting machine such as plasma cutting machine or a laser cutting machine, control of the moving speed of a cutting head (24) is improved so as to increase throughput of the cutting machine with increase in cost restricted. Products are cut out one by one from a plate member (14) while a cutting head (24) is moved relative to the plate member (14) on a table (12). In this process, when the cutting head (24) is fast-forwarded without performing cutting to a position at which cutting of each product starts, the speed of movement in the direction (Y-axis direction) along a short side of the table (12) is controlled at a speed higher than that of the movement in the direction (X-axis direction) along a long side of the table. The pattern of a sequence of cutting out the products from the plate member (14) is a meandering pattern in which reciprocation in the Y-axis direction dominates and the movement in the X-direction is one time one way. Exhaust chambers are arranged in the X-axis direction in the table (12), and the exhaust chambers are driven as the cutting head (24) moves in the X-axis direction.
摘要翻译：在诸如等离子切割机或激光切割机之类的热切割机中，提高了切割头（24）的移动速度的控制，从而在成本受到限制的情况下增加切割机的生产量。当切割头（24）相对于板构件（14）移动到工作台（12）上时，从板构件（14）逐个切割产品。在该过程中，当切割头（24）不进行切割到每个产品的切割开始的位置而快进时，沿着桌子的短边方向（Y轴方向）的移动速度 12）以比桌子长边方向（X轴方向）移动速度高的速度进行控制。从板构件（14）切出产品的顺序的图案是在Y轴方向上的往复运动占主导地位且X方向移动一次的曲折图案。在台（12）中排列室沿X轴方向排列，当切割头（24）沿X轴方向移动时，排气室被驱动。

54. 发明授权

US07301178B2 Pressed-contact type semiconductor device 失效
标题翻译：压接式半导体器件
公开(公告)号：US07301178B2
公开(公告)日：2007-11-27
申请号：US11212602
申请日：2005-08-29
申请人： Yoshihiro Yamaguchi , Kenji Oota
发明人： Yoshihiro Yamaguchi , Kenji Oota
IPC分类号： H01L29/74
CPC分类号： H01L29/0661 , H01L24/72 , H01L29/0615 , H01L29/0657 , H01L29/32 , H01L29/74 , H01L2924/0102 , H01L2924/1301 , H01L2924/00
摘要： A P++-type first diffusion layer is formed by diffusing P-type impurities on a front side of an N−-type semiconductor substrate, and an N-type fourth diffusion layer which is shallower than the first diffusion layer is formed by diffusing N-type impurities on the front side, and a P-type second diffusion layer is locally formed in a ring-shape so as to be exposed on the lateral side by diffusing P-type impurities on the back side, and P-type impurities are diffused on the back side of the substrate and a P+-type third diffusion layer is locally formed so as to be distributed inward from the second diffusion layer and not to be exposed to the lateral side, and the P-type second diffusion layer and the P+-type third diffusion layer are formed in the two-stage structure, thereby various characteristics can be improved.
摘要翻译： AP ++类型的第一扩散层是通过在N +型半导体衬底的正面扩散P型杂质形成的，N型第四扩散层通过在前侧扩散N型杂质而形成比第一扩散层浅的层，并且P型第二扩散层局部形成为环状，以便通过扩散P而暴露在侧面型杂质，P型杂质扩散到基板的背面，局部地形成P +型第三扩散层，以从第二层向内分布扩散层并且不暴露于侧面，并且P型第二扩散层和P + +型第三扩散层形成在两级结构中，因此可以有各种特性改进。

55. 发明申请

US20070241083A1 Multiple Thermal Cutting Device and Multiple Thermal Cutting Method 有权
标题翻译：多种热切割装置和多种热切割方法
公开(公告)号：US20070241083A1
公开(公告)日：2007-10-18
申请号：US11630141
申请日：2005-06-20
申请人： Yoshihiro Yamaguchi , Tetsuya Kabata , Ikuo Kamada
发明人： Yoshihiro Yamaguchi , Tetsuya Kabata , Ikuo Kamada
IPC分类号： B23K26/08 , B23K10/00
CPC分类号： B23P23/00 , B23K10/006 , B23K26/0093 , B23K26/0876 , B23K26/38 , B23K28/02 , B23K37/0229 , B23K37/0235 , B23K2101/18
摘要： A hybrid thermal cutting apparatus has both a laser head and a plasma torch, both of which can be controlled independently, can perform both laser processing and plasma processing, thus reducing the running costs. A large number of cutting lines for cutting out various types of manufactured products from plate materials are classified into a laser cutting type and a plasma cutting type, according to the cutting length, whether they are the external periphery of manufactured products or apertures, the size of the manufactured products or the apertures, the required process accuracy, the plate thickness, or the like. The lines of the laser cutting type are cut by laser processing, while the lines of the plasma cutting type are cut by plasma processing.
摘要翻译：混合热切割装置具有激光头和等离子体焰炬，它们都可以独立控制，可以进行激光加工和等离子体处理，从而降低运行成本。根据切割长度，无论是制造产品或孔的外围，大量用于从板材切割各种类型的制造产品的切割线分为激光切割型和等离子切割型，尺寸的制造产品或孔，所需的加工精度，板厚等。通过激光加工切割激光切割类型的线，而通过等离子体处理切割等离子体切割类型的线。

56. 发明申请

US20070066654A1 Inhibitory or blocking agents of molecular generating and/or inducing functions 审中-公开
标题翻译：分子产生和/或诱导功能的抑制剂或阻断剂
公开(公告)号：US20070066654A1
公开(公告)日：2007-03-22
申请号：US11513174
申请日：2006-08-31
申请人： Shozo Koyama , Yoshihiro Yamaguchi
发明人： Shozo Koyama , Yoshihiro Yamaguchi
IPC分类号： A61K31/445 , A61K31/40 , A61K31/13 , A61K31/12
CPC分类号： C11D3/0084 , A01N35/06 , A61K8/35 , A61K31/12 , A61K31/122 , A61K31/13 , A61K31/40 , A61K31/445 , A61Q5/02 , A61Q19/00 , C08F2/38
摘要： A method for inhibiting or blocking molecular generating and/or inducing functions of molecules using an inhibitory or blocking agent of the formula: wherein R1-6 are as defined herein.
摘要翻译：使用下式的抑制性或阻断剂抑制或阻断分子产生和/或诱导分子功能的方法：其中R1-6如本文所定义。

57. 发明授权

US07143355B2 Information processing device for processing information based on a status monitoring program and method therefor 失效
标题翻译：用于基于状态监视程序处理信息的信息处理装置及其方法
公开(公告)号：US07143355B2
公开(公告)日：2006-11-28
申请号：US10085655
申请日：2002-02-26
申请人： Yoshihiro Yamaguchi , Shinsuke Noguchi
发明人： Yoshihiro Yamaguchi , Shinsuke Noguchi
IPC分类号： G06F3/00 , G06F15/16 , G06F9/44
CPC分类号： G06F3/038 , G06F1/1616 , G06F1/169 , G06F3/0362 , H04M1/233
摘要： A jog dial server monitors an operation notification by a jog dial, then decides the operation based on the operation notification, and executes the decided operation as a jog script engine. The jog dial server loads a script file describing status transition of the jog dial in the script language at the time of start-up, then reads the status transition, and operates in accordance with the status transition thus read. Thus, an information processing device is provided which enables extension of the operation with respect to an application incompatible with the jog dial.
摘要翻译：慢跑拨号服务器通过微动拨盘监视操作通知，然后基于操作通知来决定操作，并且作为点动指令引擎执行所确定的操作。慢跑拨号服务器在启动时以脚本语言加载描述慢速拨盘的状态转换的脚本文件，然后读取状态转换，并根据读取的状态转换进行操作。因此，提供了一种信息处理装置，其能够相对于与微动拨盘不兼容的应用来扩展操作。

58. 发明授权

US07133641B2 Wireless communication RF circuit and communication apparatus including the same 失效
标题翻译：无线通信RF电路和包括其的通信设备
公开(公告)号：US07133641B2
公开(公告)日：2006-11-07
申请号：US10497513
申请日：2003-04-23
申请人： Tsutomi Ieki , Yoshihiro Yamaguchi
发明人： Tsutomi Ieki , Yoshihiro Yamaguchi
IPC分类号： H04B7/00 , H04B1/40 , H04Q5/22
CPC分类号： G06K19/0723 , H04B1/44 , H04B1/48
摘要： A wireless communication RF circuit includes a transmitting-and-receiving antenna, a modulator circuit, an SPST switching circuit, and a demodulator circuit, which are arranged in a sequence. Upon signal reception, the SPST switching circuit is switched ON, and the demodulator circuit extracts a signal wave from a signal received by the antenna and outputs the signal wave to a control circuit. Upon signal transmission, the SPST switching circuit is switched OFF, and the modulator circuit mixes transmission data supplied from the control circuit with a carrier and outputs the carrier to the antenna. Only a single antenna is required. Upon signal reception, the influence of the modulator circuit is negligible. Upon signal transmission, the SPST switching circuit is switched OFF, thus the effect of the demodulator circuit is negligible, which greatly reduces loss.
摘要翻译：无线通信RF电路包括按顺序排列的发送和接收天线，调制器电路，SPST切换电路和解调器电路。信号接收后，SPST切换电路接通，解调电路从天线接收的信号中提取信号波，并将信号波输出到控制电路。信号传输时，SPST切换电路切换为OFF，调制电路将从控制电路提供的发送数据与载波混合，并将载波输出到天线。只需要一根天线。在信号接收时，调制器电路的影响可以忽略不计。在信号传输时，SPST切换电路关闭，解调电路的影响可以忽略不计，大大降低了损耗。

59. 发明申请

US20050183040A1 Information processing device, information processing method, and program storage medium 有权
标题翻译：信息处理装置，信息处理方法和程序存储介质
公开(公告)号：US20050183040A1
公开(公告)日：2005-08-18
申请号：US11099136
申请日：2005-04-05
申请人： Hirohito Kondo , Tomoki Shiono , Yoshihiro Yamaguchi , Takahiko Sueyoshi
发明人： Hirohito Kondo , Tomoki Shiono , Yoshihiro Yamaguchi , Takahiko Sueyoshi
IPC分类号： G06F3/02 , G06F1/16 , G06F3/00 , G06F3/023 , G06F3/033 , G06F3/048 , G09G5/00
CPC分类号： G06F1/1616 , G06F1/1632 , G06F1/1635 , G06F1/1679 , G06F1/1686 , G06F1/169 , G06F3/0362 , G06F3/04847 , G06F3/04897 , G06F2203/04806
摘要： [Object]The object of the present invention is to make the setting condition of menu items easily adjustable on the setting screen with regard to the predetermined object to be operated. [Solution]According to the present invention, since the camera setting utility screen 320 for the CCD camera 23 is displayed on the liquid crystal display 21, any one of the plural number of menu items is selected from said camera setting utility screen 320 displayed according to the rotation operation and the push operation of the jog dial 30, the setting condition with regard to the menu item selected is adjusted corresponding to the rotation operation and the push operation of the jog dial 30, and the CCD camera 23 is to be set to said setting condition adjusted, the whole processing from the selection of menu item to the adjustment of setting condition can be conducted only by the rotation operation and the push operation of the jog dial 30.
摘要翻译：本发明的目的是使菜单项的设置条件在设定画面上相对于要操作的预定对象容易调节。 [解决方案]根据本发明，由于用于CCD摄像机23的照相机设置实用画面320显示在液晶显示器21上，所以根据相机设置实用程序屏幕320选择多个菜单项中的任何一个，对于微动拨盘30的旋转操作和按压操作，根据微动拨盘30的旋转操作和按压操作来调整关于所选择的菜单项的设置条件，并且将CCD相机23设置在调整到所述设定条件的情况下，可以仅通过微动拨盘30的旋转操作和按压操作来进行从菜单项的选择到设置条件的调整的整个处理。

60. 发明授权

US06914209B2 Plasma arc machining method 失效
标题翻译：等离子弧加工方法
公开(公告)号：US06914209B2
公开(公告)日：2005-07-05
申请号：US10733490
申请日：2003-12-10
申请人： Yoshihiro Yamaguchi , Tetsuya Kabata , Takahiro Iriyama
发明人： Yoshihiro Yamaguchi , Tetsuya Kabata , Takahiro Iriyama
IPC分类号： B23K10/00
CPC分类号： B23K10/006
摘要： Not only damage to a nozzle caused by spatter generated during piercing is prevented but also the deterioration of the nozzle owing to a pilot arc is restrained, whereby the service life of the nozzle is significantly increased. To this end, the plasma torch is positioned at an initial level which is the distance between the plasma torch and a steel plate when generating a plasma arc to start piercing operation and which has been set equal to a cutting level which is the distance between the plasma torch and the steel plate when carrying out cutting operation. After generation of the plasma arc, the plasma torch is immediately raised to a piercing level which is more distant from the steel plate W than the initial level and piercing operation is performed at the piercing level. After completion of the piercing operation, the plasma torch is lowered to the cutting level to start cutting operation. Just after transfer from a pilot arc into a main arc, a pilot current is cut off by turning a transistor off.
摘要翻译：不仅防止了在穿刺期间产生的飞溅造成的喷嘴损坏，而且由于引导电弧引起的喷嘴劣化也受到限制，从而喷嘴的使用寿命显着增加。为此，等离子体焰炬位于等离子体焰炬和钢板之间的距离的初始水平，当等离子体电弧产生等离子体电弧以开始穿孔操作时，等离子体焰炬被设定为等于切割水平等离子火炬和钢板进行切割操作。在等离子体电弧产生之后，等离子体焰炬立即升高到与初始水平相比更远离钢板W的穿透水平，并且在穿孔水平进行刺穿操作。在穿孔操作完成之后，等离子体焰炬降低到切割水平以开始切割操作。在从导电电弧转移到主电弧之后，通过关闭晶体管来切断导通电流。

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