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    • 55. 发明授权
    • Gallium nitride based diodes with low forward voltage and low reverse current operation
    • 具有低正向电压和低反向电流操作的氮化镓基二极管
    • US07476956B2
    • 2009-01-13
    • US10445130
    • 2003-05-20
    • Primit ParikhUmesh Mishra
    • Primit ParikhUmesh Mishra
    • H01L27/095H01L29/812H01L31/108
    • H01L29/475H01L29/2003H01L29/872H01L29/88
    • New Group III based diodes are disclosed having a low on state voltage (Vf) and structures to keep reverse current (Irev) relatively low. One embodiment of the invention is Schottky barrier diode made from the GaN material system in which the Fermi level (or surface potential) of is not pinned. The barrier potential at the metal-to-semiconductor junction varies depending on the type of metal used and using particular metals lowers the diode's Schottky barrier potential and results in a Vf in the range of 0.1-0.3V. In another embodiment a trench structure is formed on the Schottky diodes semiconductor material to reduce reverse leakage current. and comprises a number of parallel, equally spaced trenches with mesa regions between adjacent trenches. A third embodiment of the invention provides a GaN tunnel diode with a low Vf resulting from the tunneling of electrons through the barrier potential, instead of over it. This embodiment can also have a trench structure to reduce reverse leakage current.
    • 公开了具有低导通状态电压(Vf)和保持反向电流(Irev)相对较低的结构的新的基于III族的二极管。 本发明的一个实施例是由GaN材料系统制成的肖特基势垒二极管,其中费米能级(或表面电位)不被固定。 金属对半导体结的势垒电位根据所使用的金属类型而变化,并且使用特定的金属降低二极管的肖特基势垒电位,并导致Vf在0.1-0.3V的范围内。 在另一个实施例中,在肖特基二极管半导体材料上形成沟槽结构以减少反向漏电流。 并且包括多个平行的等间距的沟槽,其间具有相邻沟槽之间的台面区域。 本发明的第三实施例提供了一种具有低Vf的GaN隧道二极管,其由电子穿过势垒电位而不是在其上引起。 该实施例还可以具有沟槽结构以减少反向漏电流。
    • 57. 发明授权
    • Gallium nitride based diodes with low forward voltage and low reverse current operation
    • 具有低正向电压和低反向电流操作的氮化镓基二极管
    • US06949774B2
    • 2005-09-27
    • US10163944
    • 2002-06-06
    • Primit ParikhUmesh Mishra
    • Primit ParikhUmesh Mishra
    • H01L29/20H01L29/22H01L29/47H01L29/872H01L29/88H01L29/861H01L29/40H01L29/866
    • H01L29/475H01L29/2003H01L29/872H01L29/88
    • New Group III based diodes are disclosed having a low on state voltage (Vf), and structures to keep reverse current (Irev) relatively low. One embodiment of the invention is Schottky barrier diode made from the GaN material system in which the Fermi level (or surface potential) of is not pinned. The barrier potential at the metal-to-semiconductor junction varies depending on the type of metal used and using particular metals lowers the diode's Schottky barrier potential and results in a Vf in the range of 0.1-0.3V. In another embodiment a trench structure is formed on the Schottky diodes semiconductor material to reduce reverse leakage current. and comprises a number of parallel, equally spaced trenches with mesa regions between adjacent trenches. A third embodiment of the invention provides a GaN tunnel diode with a low Vf resulting from the tunneling of electrons through the barrier potential, instead of over it. This embodiment can also have a trench structure to reduce reverse leakage current.
    • 公开了具有低导通状态电压(V SUB)的新的基于III族的二极管,以及保持反向电流(I SUB)的结构相对较低。 本发明的一个实施例是由GaN材料系统制成的肖特基势垒二极管,其中费米能级(或表面电位)不被固定。 金属 - 半导体结的势垒电位根据所使用的金属的种类而变化,并且使用特定的金属降低了二极管的肖特基势垒电位,并导致在0.1-0.3V的范围内的V < 。 在另一个实施例中,在肖特基二极管半导体材料上形成沟槽结构以减少反向漏电流。 并且包括多个平行的等间距的沟槽,其间具有相邻沟槽之间的台面区域。 本发明的第三实施例提供了由电子穿过势垒电位而不是在其上的隧穿形成的具有低V bias的GaN隧道二极管。 该实施例还可以具有沟槽结构以减少反向漏电流。
    • 58. 发明授权
    • Gallium nitride based diodes with low forward voltage and low reverse current operation
    • 具有低正向电压和低反向电流操作的氮化镓基二极管
    • US07994512B2
    • 2011-08-09
    • US11173035
    • 2005-06-30
    • Primit ParikhUmesh Mishra
    • Primit ParikhUmesh Mishra
    • H01L29/861H01L29/88H01L29/20
    • H01L29/475H01L29/2003H01L29/872H01L29/88
    • New Group III based diodes are disclosed having a low on state voltage (Vf) and structures to keep reverse current (Irev) relatively low. One embodiment of the invention is Schottky barrier diode made from the GaN material system in which the Fermi level (or surface potential) of is not pinned. The barrier potential at the metal-to-semiconductor junction varies depending on the type of metal used and using particular metals lowers the diode's Schottky barrier potential and results in a Vf in the range of 0.1-0.3V. In another embodiment a trench structure is formed on the Schottky diodes semiconductor material to reduce reverse leakage current. and comprises a number of parallel, equally spaced trenches with mesa regions between adjacent trenches. A third embodiment of the invention provides a GaN tunnel diode with a low Vf resulting from the tunneling of electrons through the barrier potential, instead of over it. This embodiment can also have a trench structure to reduce reverse leakage current.
    • 公开了具有低导通状态电压(Vf)和保持反向电流(Irev)相对较低的结构的新的基于III族的二极管。 本发明的一个实施例是由GaN材料系统制成的肖特基势垒二极管,其中费米能级(或表面电位)不被固定。 金属对半导体结的势垒电位根据所使用的金属类型而变化,并且使用特定的金属降低二极管的肖特基势垒电位,并导致Vf在0.1-0.3V的范围内。 在另一个实施例中,在肖特基二极管半导体材料上形成沟槽结构以减少反向漏电流。 并且包括多个平行的等间距的沟槽,其间具有相邻沟槽之间的台面区域。 本发明的第三实施例提供了一种具有低Vf的GaN隧道二极管,其由电子穿过势垒电位而不是在其上引起。 该实施例还可以具有沟槽结构以减少反向漏电流。
    • 59. 发明申请
    • Gallium nitride based diodes with low forward voltage and low reverse current operation
    • 具有低正向电压和低反向电流操作的氮化镓基二极管
    • US20050242366A1
    • 2005-11-03
    • US11173035
    • 2005-06-30
    • Primit ParikhUmesh Mishra
    • Primit ParikhUmesh Mishra
    • H01L29/20H01L29/22H01L29/47H01L29/872H01L29/88
    • H01L29/475H01L29/2003H01L29/872H01L29/88
    • New Group III based diodes are disclosed having a low on state voltage (Vf) and structures to keep reverse current (Irev) relatively low. One embodiment of the invention is Schottky barrier diode made from the GaN material system in which the Fermi level (or surface potential) of is not pinned. The barrier potential at the metal-to-semiconductor junction varies depending on the type of metal used and using particular metals lowers the diode's Schottky barrier potential and results in a Vf in the range of 0.1-0.3V. In another embodiment a trench structure is formed on the Schottky diodes semiconductor material to reduce reverse leakage current. and comprises a number of parallel, equally spaced trenches with mesa regions between adjacent trenches. A third embodiment of the invention provides a GaN tunnel diode with a low Vf resulting from the tunneling of electrons through the barrier potential, instead of over it. This embodiment can also have a trench structure to reduce reverse leakage current.
    • 公开了具有低导通状态电压(V SUB)的新的基于III族的二极管,并且保持反向电流(I SUB)的结构相对较低。 本发明的一个实施例是由GaN材料系统制成的肖特基势垒二极管,其中费米能级(或表面电位)不被固定。 金属 - 半导体结的势垒电位根据所使用的金属的种类而变化,并且使用特定的金属降低了二极管的肖特基势垒电位,并导致在0.1-0.3V的范围内的V < 。 在另一个实施例中,在肖特基二极管半导体材料上形成沟槽结构以减少反向漏电流。 并且包括多个平行的等间距的沟槽,其间具有相邻沟槽之间的台面区域。 本发明的第三实施例提供了由电子穿过势垒电位而不是在其上的隧穿形成的具有低V bias的GaN隧道二极管。 该实施例还可以具有沟槽结构以减少反向漏电流。