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51. 发明授权

US08355241B2 Laminated electronic component 有权
标题翻译：层压电子部件
公开(公告)号：US08355241B2
公开(公告)日：2013-01-15
申请号：US12943072
申请日：2010-11-10
申请人： Makoto Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/2325 , H01G4/30
摘要： A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
摘要翻译：层叠电子部件包括：具有多个层叠功能层的多个内部导体和设置在所述部件主体内侧的多个内部导体的部件体以及经由所述内部导体的露出部与内部导体电连接的外部端子电极，由直接电镀膜定义。限定镀膜的金属颗粒的平均粒径为约0.1μm以下。

52. 发明授权

US08334748B2 Method for manufacturing ceramic electronic component and ceramic electronic component 有权
标题翻译：制造陶瓷电子部件和陶瓷电子部件的方法
公开(公告)号：US08334748B2
公开(公告)日：2012-12-18
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
发明人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
IPC分类号： H01F5/00
CPC分类号： H01C1/148 , H01C7/008 , H01C7/18 , H01G4/012 , H01G4/232 , H01G4/30
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译：陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率，并对其进行电镀，在其上形成镀层。

53. 发明授权

US08184424B2 Multilayer electronic component including a counter diffusion layer 有权
标题翻译：多层电子元件包括反扩散层
公开(公告)号：US08184424B2
公开(公告)日：2012-05-22
申请号：US12110484
申请日：2008-04-28
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
IPC分类号： H01G4/228 , H01G4/005
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.
摘要翻译：多层电子部件包括层压体，该层压体包括彼此层压的绝缘层和沿着绝缘层之间的界面设置的内部电极，内部电极的边缘暴露在层压体的预定表面处，并且外部电极设置在预定表面上。外部电极包括直接设置在层压体的预定表面上的电镀膜，以电连接在层压体的预定表面处暴露的内部电极的边缘，以及在每个内部电极和提供了一种反扩散层，其中镀膜中的金属成分和内部电极中的金属成分都是可检测的，并且延伸到内部电极和镀膜的两侧，并且在一侧的内部电极。

54. 发明授权

US08125763B2 Multilayer ceramic electronic component and method for making the same 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08125763B2
公开(公告)日：2012-02-28
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori Kobayashi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Tatsunori Kobayashi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/228 , H01G4/005
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译：多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

55. 发明授权

US07933113B2 Multilayer electronic component and method for manufacturing multilayer electronic component 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US07933113B2
公开(公告)日：2011-04-26
申请号：US12055372
申请日：2008-03-26
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

56. 发明申请

US20090310277A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20090310277A1
公开(公告)日：2009-12-17
申请号：US12469799
申请日：2009-05-21
申请人： Takayuki Kayatani , Akihiro Motoki
发明人： Takayuki Kayatani , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn—Cu—Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.
摘要翻译：多层陶瓷电子部件包括陶瓷体，陶瓷体包括多个陶瓷层，陶瓷体具有第一主表面和第二主表面以及将第一主表面连接到第二主表面的多个侧表面，内部导体包括镍，所述内部导体设置在所述陶瓷体中，并具有露出至少一个所述侧面的露出部分，以及设置在所述陶瓷体的至少一个侧面上的外部端子电极，所述外部端子电极为电连接到内部导体。外部端子电极包括包含Sn-Cu-Ni金属间化合物的第一导电层，第一导电层覆盖陶瓷体的至少一个侧表面的内部导体的暴露部分。

57. 发明申请

US20090268374A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：US20090268374A1
公开(公告)日：2009-10-29
申请号：US12354026
申请日：2009-01-15
申请人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Akihiro Motoki , Makoto Ogawa , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/12
CPC分类号： H01G4/005 , H01G4/008 , H01G4/12 , H01G4/30
摘要： A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要翻译：多层陶瓷电子部件包括层叠体，其包括多个陶瓷层的堆叠体和沿着陶瓷层之间的界面延伸的多个内部电极，以及电连接在层叠体的表面露出的内部电极的多个外部电极。每个外部电极至少包括直接连接到内部电极的部分的镀层。镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。

58. 发明申请

US20090226705A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20090226705A1
公开(公告)日：2009-09-10
申请号：US12142924
申请日：2008-06-20
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi
IPC分类号： B32B5/16 , B27N3/02
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325 , H05K1/0306 , H05K1/092 , H05K3/102 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T428/25
摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.
摘要翻译：一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。形成外部电极的步骤包括将多个粒径为约1μm以上的导电粒子附着到层压体的规定表面的步骤，以及在导电粒子的规定表面上直接进行电镀的工序附上。

59. 发明申请

US20090103240A1 CAPACITOR ARRAY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电容阵列及其制造方法
公开(公告)号：US20090103240A1
公开(公告)日：2009-04-23
申请号：US12249032
申请日：2008-10-10
申请人： Katsumori Nagamiya , Atsushi Ishida , Akihiro Motoki
发明人： Katsumori Nagamiya , Atsushi Ishida , Akihiro Motoki
IPC分类号： H01G4/38 , H01G7/00
CPC分类号： H01G4/012 , H01G4/228 , H01G4/38 , Y10T29/435
摘要： A capacitor array includes mutually opposed first and second internal electrodes having a first capacitance portion and a second capacitance portion, respectively, a first lead portion and a second lead portion, respectively, which are electrically connected to a first outer terminal electrode and a second outer terminal electrode, and a first protrusion portion and a second protrusion portion, respectively, which partially protrude toward the second outer terminal electrode and the first outer terminal electrode. The outer terminal electrodes have plating films directly connected to the internal electrodes. The plating film is formed by electrolytic plating. In the electrolytic plating, deposition of plating proceeds while being prevented from spreading in width directions of the individual side surfaces by electric fields generated from the protrusion portions toward the vicinities of exposure portions of the respective lead portions on the side surfaces.
摘要翻译：电容器阵列包括分别具有第一电容部分和第二电容部分的相互相对的第一和第二内部电极，分别与第一外部端子电极和第二外部电极电连接的第一引线部分和第二引线部分端子电极，以及分别朝向第二外部端子电极和第一外部端子电极部分地突出的第一突出部分和第二突出部分。外部端子电极具有直接连接到内部电极的电镀膜。镀膜通过电解电镀形成。在电解电镀中，通过从突出部向侧面的各引线部的曝光部附近的电场防止在各个侧面的宽度方向上扩散镀层。

60. 发明申请

US20080123249A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20080123249A1
公开(公告)日：2008-05-29
申请号：US12030360
申请日：2008-02-13
申请人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
发明人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/2325 , Y10T29/435
摘要： A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
摘要翻译：制备层叠体，其中在内部电极暴露的端面处，相邻设置的内部电极彼此电隔离，并且沿着沿着所述内部电极的测量沿相邻设置的内部电极之间的距离为约20mum以下绝缘体层的厚度方向，从端面测定时，内部电极的取出深度为1μm以下。在化学镀的步骤中，形成在多个内部电极的端部的电镀沉积物的尺寸增加以彼此连接。

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