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1. 发明申请

US20130095233A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20130095233A1
公开(公告)日：2013-04-18
申请号：US13439916
申请日：2012-04-05
申请人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
发明人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
IPC分类号： B05D5/12
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译：一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

2. 发明授权

US08154849B2 Laminated electronic component 有权
标题翻译：层压电子部件
公开(公告)号：US08154849B2
公开(公告)日：2012-04-10
申请号：US12030282
申请日：2008-02-13
申请人： Tatsuo Kunishi , Yoshihiko Takano , Shigeyuki Kuroda , Akihiro Motoki , Hideyuki Kashio , Takashi Noji
发明人： Tatsuo Kunishi , Yoshihiko Takano , Shigeyuki Kuroda , Akihiro Motoki , Hideyuki Kashio , Takashi Noji
IPC分类号： H01G4/228
CPC分类号： C25D3/12 , C25D5/02 , C25D7/00 , C25D21/10 , H01G4/2325 , H01G4/30 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49163 , Y10T29/49204
摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
摘要翻译：制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 相邻的内部电极与端面的退出距离为1μm以下。在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。

3. 发明申请

US20110162180A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 有权
标题翻译：多层电子元件及制造多层电子元件的方法
公开(公告)号：US20110162180A1
公开(公告)日：2011-07-07
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
IPC分类号： H01G9/00 , B82Y99/00
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

4. 发明申请

US20080210564A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20080210564A1
公开(公告)日：2008-09-04
申请号：US12110484
申请日：2008-04-28
申请人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
发明人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
IPC分类号： C25D5/02 , H01G4/008
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译：一种多层电子部件的制造方法，其特征在于，包括以下步骤：层叠多个绝缘层的层叠体，以及沿着所述绝缘层的界面形成的多个内部电极，以预定的方式露出所述内部电极的边缘表面，并且在预定表面上形成外部电极，以便电连接在层压体的预定表面处暴露的内部电极的边缘。形成外部电极的步骤包括：电镀步骤，通过在制备层压体的步骤中制备的层压体的预定表面处暴露在内部电极的边缘上沉积电镀沉积物形成连续的镀膜，并进行电镀电镀沉积物的生长以彼此连接;以及热处理步骤，对形成在其上的镀膜的层压体在氧分压为约5ppm以下，温度为约600℃以上。

5. 发明授权

US06579392B1 Composite laminate and method for manufacturing the same 有权
标题翻译：复合层压板及其制造方法
公开(公告)号：US06579392B1
公开(公告)日：2003-06-17
申请号：US09698394
申请日：2000-10-27
申请人： Hirokazu Kameda , Shuya Nakao , Shigeyuki Kuroda , Masaru Kojima , Kenji Tanaka
发明人： Hirokazu Kameda , Shuya Nakao , Shigeyuki Kuroda , Masaru Kojima , Kenji Tanaka
IPC分类号： B32B3126
CPC分类号： B32B18/00 , B32B2315/08 , C04B35/111 , C04B35/6263 , C04B35/63 , C04B35/632 , C04B35/63456 , C04B35/6346 , C04B35/63488 , C04B35/653 , C04B37/042 , C04B2235/5445 , C04B2235/656 , C04B2235/6567 , C04B2235/9615 , C04B2237/30 , C04B2237/341 , C04B2237/343 , C04B2237/345 , C04B2237/36 , C04B2237/365 , C04B2237/52 , C04B2237/525 , C04B2237/64 , C04B2237/68 , C04B2237/704 , H01L21/481 , H01L21/4857 , H01L23/15 , H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4629 , H05K3/4688 , H05K2201/0195 , Y10T428/24942 , Y10T428/2495 , Y10T428/249953 , Y10T428/249994 , Y10T428/25 , Y10T428/252 , Y10T428/2848 , Y10T428/31504 , H01L2924/00
摘要： A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.
摘要翻译：复合层压板包括第一片层和第二片层。第一片层包括第一颗粒聚集体，第二片层包括第二颗粒聚集体。每个内部第二片层设置在两个第一片层之间，两个外部第二片层构成复合层压体的两个主面。内部第二片层的厚度大于外部第二片层的厚度。第一片层和第二片层通过将包含在第一片层中的第一颗粒聚集体的一部分穿入第二片层而彼此接合。这种构造可以减少复合层叠体的烧成工序的横向收缩。

6. 发明授权

US5907271A Positive characteristic thermistor device 失效
标题翻译：正特性热敏电阻器件
公开(公告)号：US5907271A
公开(公告)日：1999-05-25
申请号：US763365
申请日：1996-12-11
申请人： Atsushi Hirano , Shigeyuki Kuroda , Kenji Tanaka
发明人： Atsushi Hirano , Shigeyuki Kuroda , Kenji Tanaka
IPC分类号： H01C7/02 , H01C7/18 , H01C7/10
CPC分类号： H01C7/18 , H01C7/02 , H01C7/027 , Y10T29/49085
摘要： A positive characteristic thermistor device includes a device main body made of a semiconductor ceramic material which reliably and cleanly delaminates upon the application of excessive voltage thereto. The main body has outer layers having lower porosity formed on both sides of an inner layer having higher porosity. The inner layer having higher porosity can be obtained by burning a ceramic material for positive characteristic thermistors including resin beads mixed therein. After forming the main body, an electrode is formed on the outer surface of each of the outer layers. When an overvoltage is applied to this positive characteristic thermistor device, delamination occurs in the inner layer having higher porosity to create an open-circuit in a circuit in which the thermistor device is connected.
摘要翻译：正特性热敏电阻器件包括由半导体陶瓷材料制成的器件主体，其在施加过大电压时可靠且清洁地分层。主体具有在具有较高孔隙率的内层的两侧形成的具有较低孔隙率的外层。具有较高孔隙率的内层可以通过对包含混合在其中的树脂珠的正特性热敏电阻的陶瓷材料进行烧制来获得。在形成主体之后，在每个外层的外表面上形成电极。当对该正特性热敏电阻器件施加过电压时，在具有较高孔隙率的内层中发生分层，以在其中连接热敏电阻器件的电路中产生开路。

7. 发明授权

US08804303B2 Multilayer electronic component and method for manufacturing the same 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US08804303B2
公开(公告)日：2014-08-12
申请号：US13439916
申请日：2012-04-05
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
IPC分类号： H01G4/228 , H01G4/005
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译：一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

8. 发明授权

US08631549B2 Method for manufacturing multilayer electronic component 有权
标题翻译：多层电子部件的制造方法
公开(公告)号：US08631549B2
公开(公告)日：2014-01-21
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

9. 发明授权

US08184424B2 Multilayer electronic component including a counter diffusion layer 有权
标题翻译：多层电子元件包括反扩散层
公开(公告)号：US08184424B2
公开(公告)日：2012-05-22
申请号：US12110484
申请日：2008-04-28
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
IPC分类号： H01G4/228 , H01G4/005
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.
摘要翻译：多层电子部件包括层压体，该层压体包括彼此层压的绝缘层和沿着绝缘层之间的界面设置的内部电极，内部电极的边缘暴露在层压体的预定表面处，并且外部电极设置在预定表面上。外部电极包括直接设置在层压体的预定表面上的电镀膜，以电连接在层压体的预定表面处暴露的内部电极的边缘，以及在每个内部电极和提供了一种反扩散层，其中镀膜中的金属成分和内部电极中的金属成分都是可检测的，并且延伸到内部电极和镀膜的两侧，并且在一侧的内部电极。

10. 发明授权

US07933113B2 Multilayer electronic component and method for manufacturing multilayer electronic component 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US07933113B2
公开(公告)日：2011-04-26
申请号：US12055372
申请日：2008-03-26
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

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