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    • 53. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE WITH STACKED MEMORY CELL AND METHOD OF MANUFACTURING THE STACKED MEMORY CELL
    • 具有堆叠存储单元的半导体存储器件和制造堆叠存储器单元的方法
    • US20090168493A1
    • 2009-07-02
    • US12273225
    • 2008-11-18
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • G11C11/00H01L21/00H01L47/00
    • G11C13/003G11C5/02G11C7/18G11C11/15G11C11/56G11C11/5678G11C13/0004G11C13/0023G11C13/0026G11C13/0064G11C13/0069G11C2013/0071G11C2213/71G11C2213/74G11C2213/79H01L27/24
    • In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells.
    • 在半导体存储器件和方法中,提供了电阻变化存储单元,每个包括形成在不同层上的多个控制晶体管和包括电阻变化存储器的可变电阻器件。 每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 在一个示例中,控制晶体管的数量是两个。 半导体存储器件包括全局位线; 通过分别对应于本地位线的本地位线选择电路分别连接到全局位线或与全局位线断开的多个局部位线; 以及分别在连接到本地位线时存储数据的多个电阻变化存储单元组。 每个电阻变化存储单元组中的每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 此外,半导体存储器件具有使用全局位线和局部位线的分层位线结构。 因此,可以增加半导体存储器件的集成密度和流过每个电阻变化存储单元的电流量。
    • 55. 发明申请
    • NONVOLATILE MEMORY DEVICE USING VARIABLE RESISTIVE ELEMENT
    • 使用可变电阻元件的非易失性存储器件
    • US20080232177A1
    • 2008-09-25
    • US12052761
    • 2008-03-21
    • Byung-gil ChoiDu-eung Kim
    • Byung-gil ChoiDu-eung Kim
    • G11C7/00
    • G11C13/00G11C13/0004G11C13/004G11C13/0061G11C2013/0054
    • Disclosed is a nonvolatile memory device using a variable resistive element, and a data read circuit for use in variable resistive memory devices. More specifically, embodiments of the invention provide a data read circuit with one or more decoupling units to remove noise from one or more corresponding control signals. For instance, embodiments of the invention remove noise from a clamping control signal, a read bias control signal, and/or precharge signal. The disclosed decoupling units may be used alone or in any combination. Embodiments of the invention are beneficial because they can increase sensing margin and improve the reliability of read operations in memory devices with variable resistive elements.
    • 公开了一种使用可变电阻元件的非易失性存储器件和用于可变电阻存储器件的数据读取电路。 更具体地,本发明的实施例提供具有一个或多个去耦单元的数据读取电路,以从一个或多个相应的控制信号中去除噪声。 例如,本发明的实施例从钳位控制信号,读取偏置控制信号和/或预充电信号中去除噪声。 所公开的去耦单元可以单独使用或以任何组合使用。 本发明的实施例是有益的,因为它们可以增加感测裕度并提高具有可变电阻元件的存储器件中的读取操作的可靠性。