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    • 54. 发明申请
    • Fluid heating heater
    • 流体加热器
    • US20070133964A1
    • 2007-06-14
    • US11636495
    • 2006-12-11
    • Masuhiro NatsuharaHirohiko Nakata
    • Masuhiro NatsuharaHirohiko Nakata
    • H05B3/78
    • H05B3/265F24H1/102H05B3/141H05B2203/003
    • The invention provides a fluid heater in which the efficiency of heat transfer to a fluid is improved, downsizing of the heater itself can be achieved, and the rise time until warm water heated to a necessary temperature is supplied is shortened, which results in reduction of the power consumption. The heater includes a flat ceramic substrate (1) and a heating element formed on one surface of or in the interior of the ceramic substrate (1). The ceramic substrate (1) is made of A1N, etc. or silicon nitride, whose thermal conductivity is 50W/m·K or more. A zigzag water channel is formed by walls 6, etc., on the fluid-heating surface of the ceramic substrate (1). A plurality of fins 5 are fixed in the water channel. A heat insulating material 8 can be mounted so as to cover a surface excluding the fluid-heating surface of the ceramic substrate (1).
    • 本发明提供了一种流体加热器,其中提高了对流体的传热效率,可以实现加热器本身的小型化,并且提供加热到必要温度的温水的上升时间缩短,从而导致 功耗。 加热器包括平坦陶瓷基板(1)和形成在陶瓷基板(1)的内表面上或其内部的加热元件。 陶瓷基板(1)由A 1 N等或氮化硅制成,其导热率为50W / m·K以上。 在陶瓷基板(1)的流体加热表面上由壁6等形成锯齿形的水通道。 多个翅片5固定在水通道中。 绝热材料8可以安装成覆盖除了陶瓷基板(1)的流体加热表面之外的表面。
    • 55. 发明授权
    • Fluid heating heater
    • 流体加热器
    • US07177536B2
    • 2007-02-13
    • US10169249
    • 2001-10-19
    • Masuhiro NatsuharaHirohiko Nakata
    • Masuhiro NatsuharaHirohiko Nakata
    • F24H1/10
    • H05B3/265F24H1/102H05B3/141H05B2203/003
    • The invention provides a fluid heater in which the efficiency of heat transfer to a fluid is improved, downsizing of the heater itself can be achieved, and the rise time until warm water heated to a necessary temperature is supplied is shortened, which results in reduction of the power consumption. The heater includes a flat ceramic substrate (1) and a beating element formed on one surface of or in the interior of the ceramic substrate (1). The ceramic substrate (1) is made of AlN, etc. or silicon nitride, whose thermal conductivity is 50 W/m·K or more. A zigzag water channel is formed by walls 6, etc., on the fluid-heating surface of the ceramic substrate (1). A plurality of fins 5 are fixed in the water channel. A heat insulating material 8 can be mounted so as to cover a surface excluding the fluid-heating surface of the ceramic substrate (1).
    • 本发明提供了一种流体加热器,其中提高了对流体的传热效率,可以实现加热器本身的小型化,并且提供加热到必要温度的温水的上升时间缩短,这导致 功耗。 加热器包括平坦陶瓷基板(1)和形成在陶瓷基板(1)的内表面上或其内部的打浆元件。 陶瓷基板(1)由AlN等或氮化硅制成,其导热率为50W / m·K以上。 在陶瓷基板(1)的流体加热表面上由壁6等形成锯齿形的水通道。 多个翅片5固定在水通道中。 绝热材料8可以安装成覆盖除了陶瓷基板(1)的流体加热表面之外的表面。
    • 58. 发明申请
    • Semiconductor Manufacturing Apparatus
    • 半导体制造装置
    • US20050028739A1
    • 2005-02-10
    • US10710841
    • 2004-08-06
    • Masuhiro NatsuharaHirohiko Nakata
    • Masuhiro NatsuharaHirohiko Nakata
    • C23C16/00C23C16/458H01L21/68H01L21/683
    • C23C16/4586C23C16/4581
    • According to the present invention, a wafer holder is supported by support pieces mounted on a pedestal and is installed within the processing chamber of a semiconductor manufacturing device, wherein the lift pins are set up anchored to the semiconductor-manufacturing-device chamber and the pedestal is driven vertically, thereby running the wafer holder up/down to thrust the lift pins out from, or retract them into, the top side of the wafer holder, which makes it possible to dechuck wafers from and pocket them into the holder. Consequently, leveling the height of the tip ends of the plurality of lift pins is facilitated and synchronization problems are completely eliminated besides, which thus makes it possible to prevent wafer drop-off during wafer dechucking/pocketing. And since a mechanism for synchronously driving the plural lift pins up/down is unnecessary, the device overall can be made more compact.
    • 根据本发明,晶片保持器由安装在基座上的支撑件支撑并安装在半导体制造装置的处理室内,其中提升销被固定在半导体制造装置室和基座 被垂直驱动,从而使晶片保持器上/下移动以将提升销推出或者将其退回到晶片保持器的顶侧,这使得可以将晶片从其中取出并将其包入保持器中。 因此,除了多个提升销的顶端的高度以外,还能够完全消除同步问题,从而可以防止晶片脱胶/贴片期间的晶片脱落。 并且,由于不需要同时驱动多个提升销的机构,因此能够使装置整体更加紧凑。