专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5306679A Heat conductive colored aluminum nitride sintered body 失效
标题翻译：导热色氮化铝烧结体
公开(公告)号：US5306679A
公开(公告)日：1994-04-26
申请号：US24820
申请日：1993-03-01
申请人： Kouhei Shimoda , Takao Maeda , Kouichi Sogabe , Masaya Miyake
发明人： Kouhei Shimoda , Takao Maeda , Kouichi Sogabe , Masaya Miyake
IPC分类号： C04B35/581 , H01L21/48 , C04B35/58
CPC分类号： C04B35/581 , H01L21/4807
摘要： A heat conductive aluminum nitride sintered body contains 100 parts by weight of aluminum nitride, at least 0.005 parts by weight and not more than 0.5 parts by weight of carbon, at least 0.01 parts by weight and not more than 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of a rare earth element, and at least 0.01 parts by weight and not more than 15 parts by weight of at least one element selected from a group of compounds containing elements belonging to the groups IVB, VB and VIB of the periodic table in terms of the simple substance of the element. Such a sintered body has a heat conductivity of at least 100 W/m.multidot.K. and not more than 270 W/m.multidot.K. at room temperature.
摘要翻译：导热氮化铝烧结体含有100重量份的氮化铝，至少0.005重量份，不超过0.5重量份的碳，至少0.01重量份，不超过15重量份的稀有金属以稀土元素的单质为基准的至少0.01重量份至少15重量份的选自包含属于IVB族，VB族的元素的化合物的族中的至少一种元素和元素周期表的VIB。这种烧结体的导热率至少为100W / m×K。不超过270 W / m * K。在室温下。

2. 发明授权

US5294388A Heat conductive colored aluminum nitride sintered body and method of preparing the same 失效
标题翻译：导热色氮化铝烧结体及其制备方法
公开(公告)号：US5294388A
公开(公告)日：1994-03-15
申请号：US922682
申请日：1992-07-29
申请人： Kouhei Shimoda , Takao Maeda , Kouichi Sogahe , Masaya Miyake
发明人： Kouhei Shimoda , Takao Maeda , Kouichi Sogahe , Masaya Miyake
IPC分类号： C04B35/581 , H01L21/48 , F27B9/04 , C04B35/58
CPC分类号： C04B35/581 , H01L21/4807
摘要： A heat conductive aluminum nitride sintered body contains 100 parts by weight of aluminum nitride, at least 0.005 parts by weight and not more than 0.5 parts by weight of carbon, at least 0.01 parts by weight and not more than 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of a rare earth element, and at least 0.01 parts by weight and not more than 15 parts by weight of at least one element selected from a group of compounds containing elements belonging to the groups IVB, VB and VIB of the periodic table in terms of the simple substance of the element. Heat conductivity of the aluminum nitride sintered body is at least 100 W/m.multidot.K and not more than 270 W/m.multidot.K at the ordinary temperature. According to a method of preparing such an aluminum nitride sintered body, at least 0.01 parts by weight and not more than 5 parts by weight of carbon, at least 0.01 parts by weight and not more than 15 parts by weight of an oxide of a rare earth element, and at least 0.01 parts by weight and not more than 15 parts by weight of an oxide, a carbide or a nitride of an element belonging to the group IVB, VB or VIB of the periodic table are added to 100 parts by weight of aluminum nitride. A compact of this mixture is fired in a nonoxidizing atmosphere under a temperature of at least 1500.degree. C. and not more than 2100.degree. C.
摘要翻译：导热氮化铝烧结体含有100重量份的氮化铝，至少0.005重量份，不超过0.5重量份的碳，至少0.01重量份，不超过15重量份的稀有金属以稀土元素的单质为基准的至少0.01重量份至少15重量份的选自包含属于IVB族，VB族的元素的化合物的族中的至少一种元素和元素周期表的VIB。氮化铝烧结体的导热率在常温下为至少100W / m×K且不大于270W / m×K。根据制备这种氮化铝烧结体的方法，至少0.01重量份且不超过5重量份的碳，至少0.01重量份且不超过15重量份的稀有氧化物并且将至少0.01重量份且不超过15重量份的元素周期表中IVB族，VB族或VIB族元素的氧化物，碳化物或氮化物加入到100重量份的氮化铝。将该混合物的压块在至少1500℃且不超过2100℃的温度下在非氧化气氛中焙烧。

3. 发明授权

US5955148A Aluminium nitride ceramics and method for preparing the same 失效
标题翻译：氮化铝陶瓷及其制备方法
公开(公告)号：US5955148A
公开(公告)日：1999-09-21
申请号：US958873
申请日：1997-10-27
申请人： Kouhei Shimoda , Kazuya Kamitake , Hirohiko Nakata , Kazutaka Sasaki , Masuhiro Natsuhara , Harutoshi Ukegawa
发明人： Kouhei Shimoda , Kazuya Kamitake , Hirohiko Nakata , Kazutaka Sasaki , Masuhiro Natsuhara , Harutoshi Ukegawa
IPC分类号： C04B35/581 , C04B41/50 , C04B41/52 , C04B41/86 , C04B41/87 , C04B41/89 , H01L21/48 , H01L23/15 , B05D3/02 , B05D3/12
CPC分类号： C04B41/009 , C04B35/581 , C04B41/5022 , C04B41/5063 , C04B41/52 , C04B41/86 , C04B41/87 , C04B41/89 , H01L21/481 , H01L23/15 , C04B2111/00301 , C04B2111/00844 , H01L2924/0002 , Y10T428/24413 , Y10T428/24479 , Y10T428/24942 , Y10T428/265 , Y10T428/31678
摘要： Aluminium nitride ceramics improved in heat radiation property used as a substrate for integrated circuits and package material, comprising a sintered article consisting mainly of aluminium nitride and having a thermal conductivity higher than 100.multidot.W/m.multidot.K at room temperature and a surface layer consisting mainly of aluminium nitride or oxide glass deposited on the sintered article. A paste of aluminium nitride powder or oxide glass powder is coated on a surface of the sintered article of aluminium nitride and then is sintered to prepare a dense smooth surface layer.
摘要翻译：氮化铝陶瓷提高了用作集成电路和封装材料的基板的热辐射性能，其包括主要由氮化铝组成并且在室温下具有高于100×W / m×K的热导率的烧结制品和主要由氮化铝组成的表面层或沉积在烧结制品上的氧化物玻璃。将氮化铝粉末或氧化物玻璃粉末的糊料涂覆在氮化铝烧结体的表面上，然后烧结以制备致密的光滑表面层。

4. 发明授权

US06696103B1 Aluminium nitride ceramics and method for preparing the same 失效
标题翻译：氮化铝陶瓷及其制备方法
公开(公告)号：US06696103B1
公开(公告)日：2004-02-24
申请号：US09358484
申请日：1999-07-22
申请人： Kouhei Shimoda , Kazuya Kamitake , Hirohiko Nakata , Kazutaka Sasaki , Masuhiro Natsuhara , Harutoshi Ukegawa
发明人： Kouhei Shimoda , Kazuya Kamitake , Hirohiko Nakata , Kazutaka Sasaki , Masuhiro Natsuhara , Harutoshi Ukegawa
IPC分类号： B05D500
CPC分类号： C04B41/5063 , C04B35/581 , C04B41/5022 , C04B41/52 , C04B41/86 , C04B41/87 , C04B41/89 , H01L21/481 , H01L23/15 , H01L2924/0002 , H01L2924/00
摘要： Aluminium nitride ceramics improved in heat radiation property used as a substrate for integrated circuits and package material, comprising a sintered article consisting mainly of aluminium nitride and having a thermal conductivity higher than 100.W/m.K at room temperature and a surface layer consisting mainly of aluminium nitride or oxide glass deposited on the sintered article. A paste of aluminium nitride powder or oxide glass powder is coated on a surface of the sintered article of aluminium nitride and then is sintered to prepare a dense smooth surface layer.
摘要翻译：氮化铝陶瓷提高了用作集成电路和封装材料的基板的热辐射性能，其包括主要由氮化铝组成并且在室温下具有高于100.W / mK的热导率的烧结制品，以及主要由将氮化铝或氧化物玻璃沉积在烧结制品上。将氮化铝粉末或氧化物玻璃粉末的浆料涂覆在氮化铝烧结体的表面上，然后烧结以制备致密的光滑表面层。

5. 发明授权

US06231817B1 Exhaust emission control device and method of manufacturing the same 有权
公开(公告)号：US06231817B1
公开(公告)日：2001-05-15
申请号：US09209264
申请日：1998-12-11
申请人： Kouhei Shimoda , Syoji Nakagama , Tomohiko Ihara
发明人： Kouhei Shimoda , Syoji Nakagama , Tomohiko Ihara
IPC分类号： B01D5394
CPC分类号： B01D53/945 , B01D2255/1021 , B01J23/8926 , B01J37/0248 , Y02T10/22
摘要： A highly durable exhaust emission control device which is provided in a container disposed in an intermediate portion of an exhaust system, wherein the exhaust emission control device comprises (1) a heat-resistant porous body having communicating pores, (2) a mixture of copper oxide and aluminum oxide supported on the surface of the porous body, and (3) platinum supported on the surface and an inner portion of the mixture, the grain size of the copper oxide being from 0.1 &mgr;m to 50 &mgr;m. The exhaust emission control device is manufactured by preparing the heat-resistant porous body; (2) applying to the porous body a slurry of a mixture of copper oxide and aluminum oxide and/or compounds convertible into these oxides by firing, and baking the mixture and/or compounds; and (3) applying a water-soluble platinum compound to the porous body, and baking the platinum compound. The platinum compound may be applied with the oxide mixture and/or the compounds of copper and aluminum to the porous body.

6. 发明授权

US5147832A Thermal conductive colored aluminum nitride sintered body and method of preparing the same 失效
标题翻译：热传导性有色氮化铝烧结体及其制备方法
公开(公告)号：US5147832A
公开(公告)日：1992-09-15
申请号：US738461
申请日：1991-07-31
申请人： Kouhei Shimoda , Takao Maeda , Kouichi Sogabe , Masaya Miyake
发明人： Kouhei Shimoda , Takao Maeda , Kouichi Sogabe , Masaya Miyake
IPC分类号： C04B35/581 , H01L23/08 , H01L23/15
CPC分类号： C04B35/581
摘要： An AlN sintered body which has a color within the range of gray to black and a thermal conductivity within the range of 100 to 270 W/m.multidot.K at room temperature. Such a body is useful as an electronic material and a method of preparing the same. The AlN sintered body contains 100 parts by weight of AlN, 0.005 to 0.5 parts by weight of carbon, not more than 1 part by weight of a boron compound in terms of the simple substance of boron, 0.01 to 15 parts by weight of a rare earth aluminum oxide in terms of the simple substance of the rare earth element, and 0.01 to 15 parts by weight of a compound containing an element belonging to the group IVB of the periodic table in terms of the simple substance of the element. This AlN sintered body is obtained by shaping a mixture of the above components into a prescribed configuration and thereafter firing the as-formed compact in a non-oxidizing atmosphere containing at least 10 percent by volume of nitrogen, at a temperature of 1500.degree. to 2100.degree. C.

7. 发明授权

US06939824B2 Exhaust emission control device and method of manufacturing the same 失效
标题翻译：废气排放控制装置及其制造方法
公开(公告)号：US06939824B2
公开(公告)日：2005-09-06
申请号：US09798921
申请日：2001-03-06
申请人： Kouhei Shimoda , Syoji Nakagama , Tomohiko Ihara
发明人： Kouhei Shimoda , Syoji Nakagama , Tomohiko Ihara
IPC分类号： F01N3/02 , B01D53/94 , B01J21/16 , B01J23/89 , B01J37/02 , B01J23/40 , B01J23/42 , B01J23/56 , B01J23/70 , B01J23/72
CPC分类号： B01D53/945 , B01D2255/1021 , B01J23/8926 , B01J37/0248 , Y02T10/22
摘要： A highly durable exhaust emission control device which is provided in a container disposed in an intermediate portion of an exhaust system, wherein the exhaust emission control device comprises (1) a heat-resistant porous body having communicating pores, (2) a mixture of copper oxide and aluminum oxide supported on the surface of the porous body, and (3) platinum supported on the surface and an inner portion of the mixture, the grain size of the copper oxide being from 0.1 μm to 50 μm. The exhaust emission control device is manufactured by preparing the heat-resistant porous body; (2) applying to the porous body a slurry of a mixture of copper oxide and aluminum oxide and/or compounds convertible into these oxides by firing, and baking the mixture and/or compounds; and (3) applying a water-soluble platinum compound to the porous body, and baking the platinum compound. The platinum compound may be applied with the oxide mixture and/or the compounds of copper and aluminum to the porous body.
摘要翻译：一种高度耐用的废气排放控制装置，其设置在设置在排气系统的中间部分的容器中，其中排气排放控制装置包括（1）具有连通孔的耐热多孔体，（2）铜氧化物和氧化铝负载在多孔体的表面上，（3）铂负载在表面和混合物的内部，氧化铜的粒径为0.1〜50μm。废气排放控制装置通过制备耐热多孔体制造; （2）通过烧结向该多孔体施加氧化铜和氧化铝的混合物的浆料和/或可转化成这些氧化物的化合物，并烘烤该混合物和/或化合物; 和（3）向多孔体中涂布水溶性铂化合物，并烘烤铂化合物。可以将铂化合物与氧化物混合物和/或铜和铝的化合物施加到多孔体上。

8. 发明授权

US5679469A Metallized ceramic substrate having smooth plating layer and method for producing the same 失效
标题翻译：具有光滑镀层的金属化陶瓷基板及其制造方法
公开(公告)号：US5679469A
公开(公告)日：1997-10-21
申请号：US506898
申请日：1995-07-26
申请人： Kouhei Shimoda , Hirohiko Nakata
发明人： Kouhei Shimoda , Hirohiko Nakata
IPC分类号： C04B41/90 , C04B41/52 , C04B41/89 , H01L23/13 , B32B15/04 , B32B15/16 , B32B18/00
CPC分类号： C04B41/009 , C04B41/52 , C04B41/89 , C04B2111/00336 , Y10S428/901 , Y10T428/12028 , Y10T428/12056 , Y10T428/12146 , Y10T428/12174 , Y10T428/12576 , Y10T428/12826 , Y10T428/1284 , Y10T428/12889 , Y10T428/12944
摘要： A metallized ceramic substrate having a smooth plating layer comprises a ceramic substrate containing aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate; and a nickel-based plating layer formed on the metallized layer wherein the plating layer has a thickness of not greater than 2 .mu.m and a surface roughness (Ra) of not greater than 2 .mu.m. Alternatively, the plating layer on the ceramic substrate may comprise a first nickel-based plating layer having a thickness of not greater than 2 .mu.m and a second gold-based plating layer having a thickness of not greater than 1 .mu.m wherein the gold-based plating layer has a surface roughness (Ra) of 2 .mu.m or less. These metallized substrates are produced by applying a metallizing paste containing tungsten and/or molybdenum onto a green aluminum nitride ceramic substrate, flattening the metallizing paste layer, firing the metallizing paste-coated ceramic substrate, and forming the plating layer or layers.
摘要翻译：具有平滑镀层的金属化陶瓷基板包括含有氮化铝作为主要成分的陶瓷基板; 形成在所述陶瓷基板的至少一个面上的钨和/或钼基金属化层; 以及形成在金属化层上的镍基镀层，其中镀层的厚度不大于2μm，表面粗糙度（Ra）不大于2μm。或者，陶瓷基板上的镀层可以包括厚度不大于2μm的第一镍基镀层和厚度不大于1μm的第二金基镀层，其中金 - 基底镀层的表面粗糙度（Ra）为2μm以下。这些金属化基板通过将涂覆有钨和/或钼的金属化浆料涂敷在绿色氮化铝陶瓷基板上，使金属化糊料层平坦化，烧结金属化涂布陶瓷基板，形成镀层而制成。

9. 发明申请

US20110140162A1 CONDUCTIVE ADHESIVE AND LED SUBSTRATE USING THE SAME 审中-公开
标题翻译：导电胶和使用其的LED基板
公开(公告)号：US20110140162A1
公开(公告)日：2011-06-16
申请号：US13058579
申请日：2009-06-26
申请人： Issei Okada , Kouhei Shimoda
发明人： Issei Okada , Kouhei Shimoda
IPC分类号： H01L33/00 , C09K11/02
CPC分类号： H05K3/321 , C08G59/4021 , C08K3/08 , C09J163/00 , H01B1/22 , H01L33/62 , H01L2924/0002 , H05K2201/0266 , H01L2924/00
摘要： Provided are a conductive adhesive capable of ensuring both conductive properties and adhesion properties and an LED substrate using the conductive adhesive. The conductive adhesive contains a conductive filler, a binder resin, and a solvent as main components thereof, and the conductive filler contains a metal powder having an average particle size of 2 to 30 μm as a main component thereof and contains ultrafine metal particles having an average particle size of 100 nm or less.
摘要翻译：提供能够确保导电性和粘合性的导电粘合剂和使用导电粘合剂的LED基板。导电性粘合剂含有导电性填料，粘合剂树脂和溶剂作为其主要成分，导电性填料含有作为主要成分的平均粒径为2〜30μm的金属粉末，其含有超细金属粒子，平均粒径为100nm以下。

10. 发明授权

US5677052A Aluminum nitride ceramics and method for preparing the same 失效
标题翻译：氮化铝陶瓷及其制备方法
公开(公告)号：US5677052A
公开(公告)日：1997-10-14
申请号：US698293
申请日：1996-08-15
申请人： Kouhei Shimoda , Kazuya Kamitake , Hirohiko Nakata , Kazutaka Sasaki , Masuhiro Natsuhara , Harutoshi Ukegawa
发明人： Kouhei Shimoda , Kazuya Kamitake , Hirohiko Nakata , Kazutaka Sasaki , Masuhiro Natsuhara , Harutoshi Ukegawa
IPC分类号： C04B35/581 , C04B41/50 , C04B41/52 , C04B41/86 , C04B41/87 , C04B41/89 , H01L21/48 , H01L23/15 , C04B35/58 , H05K1/03
CPC分类号： C04B41/009 , C04B35/581 , C04B41/5022 , C04B41/5063 , C04B41/52 , C04B41/86 , C04B41/87 , C04B41/89 , H01L21/481 , H01L23/15 , C04B2111/00301 , C04B2111/00844 , H01L2924/0002 , Y10T428/24413 , Y10T428/24479 , Y10T428/24942 , Y10T428/265 , Y10T428/31678
摘要： Aluminium nitride ceramics improved in heat radiation property used as a substrate for integrated circuits and package material, comprising a sintered article consisting mainly of aluminium nitride and having a thermal conductivity higher than 100.multidot.W/m.multidot.K at room temperature and a surface layer consisting mainly of aluminium nitride or oxide glass deposited on the sintered article. A paste of aluminium nitride powder or oxide glass powder is coated on a surface of the sintered article of aluminium nitride and then is sintered to prepare a dense smooth surface layer.
摘要翻译：氮化铝陶瓷提高了用作集成电路和封装材料的基板的热辐射性能，其包括主要由氮化铝组成并且在室温下具有高于100×W / m×K的热导率的烧结制品和主要由氮化铝组成的表面层或沉积在烧结制品上的氧化物玻璃。将氮化铝粉末或氧化物玻璃粉末的糊料涂覆在氮化铝烧结体的表面上，然后烧结以制备致密的光滑表面层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式