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51. 发明授权

US07252008B2 Micromechanical piezoresistive pressure sensor device 有权
标题翻译：微机械压阻式压力传感器装置
公开(公告)号：US07252008B2
公开(公告)日：2007-08-07
申请号：US11128147
申请日：2005-05-11
申请人： Joerg Muchow , Hubert Benzel
发明人： Joerg Muchow , Hubert Benzel
IPC分类号： G01L9/06
CPC分类号： G01L19/0069 , G01L9/0054 , G01L19/147
摘要： A micromechanical piezoresistive pressure sensor device having a sensor substrate, in which an essentially rectangular diaphragm region is provided; a piezoresistive resistance device having at least one piezoresistive resistor strip, which runs parallel to the longitudinal edges of the diaphragm device across the entire length of the diaphragm device and onto the surrounding sensor substrate; the piezoresistive resistor strip having a narrow center region and widened end regions and the widened end regions running across the short edges of the diaphragm device.
摘要翻译：一种具有传感器基板的微机械压阻传感器装置，其中设置有基本上矩形的隔膜区域; 压阻电阻装置，具有至少一个压阻电阻条，其平行于膜片装置的纵向边缘延伸穿过隔膜装置的整个长度并延伸到周围的传感器基板上; 所述压阻电阻条带具有窄的中心区域和加宽的端部区域，并且所述加宽的端部区域跨越所述隔膜装置的所述短边缘延伸。

52. 发明申请

US20060162462A1 Pressure sensor featuring pressure loading of the fastening element 有权
标题翻译：压力传感器具有紧固元件的压力载荷
公开(公告)号：US20060162462A1
公开(公告)日：2006-07-27
申请号：US10539526
申请日：2003-08-18
申请人： Joerg Muchow , Hubert Benzel , Heribert Weber , Frank Schaefer
发明人： Joerg Muchow , Hubert Benzel , Heribert Weber , Frank Schaefer
IPC分类号： G01L9/02
CPC分类号： G01L19/148 , G01L19/147 , H01L2224/48091 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A pressure sensor having a pressure sensor element, the pressure sensor element having a diaphragm area and a first fixing area, the pressure to be measured exerting a force action on the diaphragm area, the first fixing area being connected to a second fixing area of a fixing element to fix the pressure sensor element, and the first fixing area and the second fixing area being pressure-loaded by the force action.
摘要翻译：一种具有压力传感器元件的压力传感器，所述压力传感器元件具有隔膜区域和第一固定区域，所述测量对所述隔膜区域施加力作用的所述压力，所述第一固定区域连接到所述隔膜区域的第二固定区域固定元件以固定压力传感器元件，并且第一固定区域和第二固定区域由于力作用被加压。

53. 发明申请

US20050252302A1 Micromechanical piezoresistive pressure sensor device 有权
标题翻译：微机械压阻式压力传感器装置
公开(公告)号：US20050252302A1
公开(公告)日：2005-11-17
申请号：US11128147
申请日：2005-05-11
申请人： Joerg Muchow , Hubert Benzel
发明人： Joerg Muchow , Hubert Benzel
IPC分类号： B81B3/00 , G01L9/00 , G01L9/06 , H01L29/82
CPC分类号： G01L19/0069 , G01L9/0054 , G01L19/147
摘要： The present invention creates a micromechanical piezoresistive pressure sensor device having a sensor substrate (1), in which an essentially rectangular diaphragm region (50) is provided; a piezoresistive resistance device (S1-S4; S1, S2, S3′, S4′) having at least one piezoresistive resistor strip (S1-S4; S1, S2), which runs parallel to the longitudinal edges (55a, 55b) of the diaphragm device (50) across the entire length of the diaphragm device (50) and onto the surrounding sensor substrate (1); the piezoresistive resistor strip (S1-S4; S1, S2) having a narrow center region (S10-S40; S10, S20, S30′, S40′) and widened end regions (S11, S12, S21, S22, S31, S32, S41, S42; S11, S12, S21, S22, S31′, S32′, S41′, S42′) and the widened end regions (S11, S12, S21, S22, S31, S32, S41, S42; S11, S12, S21, S22, S31′, S32′, S41′, S42′) running across the short edges (56a, 56b) of the diaphragm device (50).
摘要翻译：本发明创建了一种具有传感器基板（1）的微机械压阻式压力传感器装置，其中设置有基本上矩形的隔膜区域（50）具有至少一个压阻电阻条（S 1 -S 4; S 1，S 2）的压阻电阻器件（S 1 -S 4; S 1，S 2，S 3'，S 4'），其平行于隔膜装置（50）的纵向边缘（55a，55b）穿过隔膜装置（50）的整个长度并且在周围的传感器基板（1）上; 具有窄中心区域（S 10 -S 40; S 10，S 20，S 30'，S 40'）和加宽端部区域（S11）的压阻电阻带（S 1 -S 4; S 1，S 2），S 12，S 21，S 22，S 31，S 32，S 41，S 42，S 11，S 12，S 21，S 22，S 31'，S 32'，S 41'，S 42' 和加宽的端部区域（S11，S12，S21，S22，S31，S32，S41，S42; S11，S12，S21，S22，S31'，S32' S 41'，S 42'）延伸穿过隔膜装置（50）的短边缘（56a，56b）。

54. 发明授权

US06782756B2 Micromechanical component and equalization method 有权
标题翻译：微机械部件和均衡方法
公开(公告)号：US06782756B2
公开(公告)日：2004-08-31
申请号：US10239470
申请日：2003-01-09
申请人： Joerg Muchow , Jochen Franz , Uwe Lipphardt , Andreas Duell , Wolfgang Romes
发明人： Joerg Muchow , Jochen Franz , Uwe Lipphardt , Andreas Duell , Wolfgang Romes
IPC分类号： G01L900
CPC分类号： G01L9/0054
摘要： A micromechanical component, in particular a pressure sensor, including a substrate that has a membrane region, a surrounding region of the membrane region, at least one measuring resistance provided in the membrane region and modifiable by deformation of the membrane region, and a corresponding evaluation circuit provided in the surrounding region. An interference effect on the measuring resistance is producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit relative to the substrate. The invention also creates a corresponding equalization method on a test chip or as an individual final equalization.
摘要翻译：一种微机械部件，特别是压力传感器，包括具有膜区域的基板，膜区域的周围区域，设置在膜区域中的至少一个测量电阻，并且可以通过膜区域的变形而修改，以及相应的评估电路设在周边地区。测量电阻的干涉效应可以通过评估电路相对于衬底的部件，特别是导体路径的变形来产生。本发明还在测试芯片上或作为单独的最终均衡产生相应的均衡方法。

55. 发明授权

US06204086B1 Method for manufacturing semiconductor components having micromechanical structures 失效
标题翻译：制造具有微机械结构的半导体部件的方法
公开(公告)号：US06204086B1
公开(公告)日：2001-03-20
申请号：US09038777
申请日：1998-03-11
申请人： Joerg Muchow , Helmut Baumann
发明人： Joerg Muchow , Helmut Baumann
IPC分类号： H01L2100
CPC分类号： B81C1/00714 , B81B2201/0264 , B81B2203/0127 , G01L9/0042 , G01L9/0055
摘要： A method for manufacturing semiconductor components having micromechanical structures, micromechanical structures being patterned in a wafer for detecting a physical quantity acting on micromechanical structures, and semiconductor components for converting the physical quantity into an electrical signal proportional to the physical quantity being produced. The semiconductor components and the micromechanical structures are defined in a self-aligning manner by process steps acting on one side of the wafer to produce semiconductor components.
摘要翻译：一种用于制造具有微机械结构的半导体部件的方法，在用于检测作用在微机械结构上的物理量的晶片中图案化的微机械结构以及用于将物理量转换成与正在产生的物理量成比例的电信号的半导体部件。半导体部件和微机械结构通过作用于晶片一侧的工艺步骤以自对准的方式限定，以制造半导体部件。

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