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    • 53. 发明授权
    • Vibration isolation system for building
    • 建筑隔振系统
    • US07540117B2
    • 2009-06-02
    • US10522765
    • 2003-08-04
    • Hong Yang
    • Hong Yang
    • E04B1/98
    • E04H9/021
    • A vibration isolation system for building, comprising a vibration isolation layer, the vibration isolation layer including: an upper layer structure consisted of upper beams and/or slabs and moveable bases, which is coupled to columns of the building; a lower layer structure consisted of lower beams and/or slabs and fixed bases; and vibration isolation devices and elastic member horizon-resetting devices which are mounted between the upper layer structure and the lower layer structure, in which the vibration isolation devices are mounted between the moveable bases and the fixed bases, respectively, and the elastic member horizon-resetting devices are mounted between the beams and/or slabs of the upper layer structure and the lower layer structure, respectively. Therefore, the above devices do not interfere with each other and convenient to maintain, and positions and functional parameters thereof can be set and selected reasonably.
    • 一种用于建筑物的隔振系统,包括隔振层,所述隔振层包括:上层结构,其由上梁和/或板坯和可移动基座组成,所述上层结构与所述建筑物的塔架联接; 下层结构由下梁和/或板坯和固定基座组成; 以及安装在上层结构和下层结构之间的隔振装置和弹性构件水平重置装置,其中隔振装置分别安装在可移动基座和固定基座之间,弹性构件水平 - 复位装置分别安装在上层结构和下层结构的梁和/或板之间。 因此,上述装置不会彼此干扰并且维护方便,并且可以合理地设置和选择其位置和功能参数。
    • 58. 发明申请
    • Device for changing the original engine sound of a vehicle
    • 用于改变车辆的原始发动机声音的装置
    • US20070068719A1
    • 2007-03-29
    • US11234933
    • 2005-09-26
    • Hong Yang
    • Hong Yang
    • B60T7/16
    • A63H17/34
    • There is disclosed a device for changing an original engine sound from an exhaust pipe of a vehicle such as a car and a motorcycle. The device includes a control module in which various engine sounds from the exhaust pipes of vehicles are recorded. A selection module is connected to the control module. The selection module is installed near the steering wheel or handle of the vehicle. A sensing module is connected to the control module. The sensing module senses the motion of the accelerator of the vehicle. An amplifier is connected to an output terminal of the control module. A speaker is connected to the amplifier. A muffling module is connected to the control module. The muffling module muffles the original engine sound from the exhaust pipe of the vehicle. With the selection module, a user can select one from the various engine sounds. With the muffling module, the user can muffle the original engine sound of the vehicle. The selected engine sound and the signal related to the motion of the accelerator are transmitted to the control module. The selected engine sound is generated in a manner corresponding to the manner the vehicle is driven. The fun in driving the vehicle is increased.
    • 公开了一种用于从诸如汽车和摩托车的车辆的排气管改变原始发动机声音的装置。 该装置包括控制模块,其中记录了来自车辆排气管的各种发动机声音。 选择模块连接到控制模块。 选择模块安装在车辆方向盘或手柄附近。 传感模块连接到控制模块。 感测模块​​感测车辆的加速器的运动。 放大器连接到控制模块的输出端子。 扬声器连接到放大器。 消音模块连接到控制模块。 消音模块将来自车辆排气管的原始发动机声音消失。 使用选择模块,用户可以从各种引擎声音中选择一个。 使用消音模块,用户可以消除车辆的原始发动机声音。 所选择的发动机声音和与加速器的运动相关的信号被发送到控制模块。 所选择的发动机声音以与车辆被驱动的方式对应的方式产生。 驾驶车辆的乐趣增加。
    • 60. 发明授权
    • Solder bar for high power flip chips
    • 焊接棒用于大功率倒装芯片
    • US07057292B1
    • 2006-06-06
    • US09575298
    • 2000-05-19
    • Peter EleniusHong Yang
    • Peter EleniusHong Yang
    • H01L23/48H01L23/52H01L29/40
    • H01L23/5386H01L21/4853H01L23/49816H01L23/49838H01L2224/0401H01L2224/05552H01L2224/13012H01L2224/14051H01L2924/01322H01L2924/01327H01L2924/10253H05K3/341H05K3/3436H01L2924/00H01L2924/00012
    • A solder bar compatible with conventional flip chip technology fabrication methods for high power/high current applications includes first and second generally circular solder pads of diameter D formed upon a substrate and connected by a solder bar pad of width BW. The centers of the generally circular solder pads are spaced apart by distance BL (bar length). A mass of solder having volume VB is formed over the first and second generally circular solder pads and over the solder bar pad to form a dog-bone shaped solder bar. The solder bar reaches height H1 above the centers of the first and second generally circular solder pads, and reaching height H2 above the midpoint of the solder bar pad. The values for diameter D, bar length BL, bar width BW, and solder volume VB are selected in such manner that H1 and H2 are approximately equal. Conventional circular (as viewed from above) solder bumps can be formed upon the same substrate; in this case, heights H1 and H2 are made approximately equal to the height of the conventional solder bumps.
    • 与用于高功率/高电流应用的常规倒装芯片技术制造方法兼容的焊料棒包括直径为D的第一和第二通常为圆形的焊盘,其形成在基板上并且通过宽度为BW的焊条焊盘连接。 大致圆形焊盘的中心间隔距离BL(条长度)。 具有体积VB的焊料块形成在第一和第二大致圆形的焊盘之上并且在焊料条焊盘上形成,以形成狗骨形焊料条。 焊料棒在第一和第二大致圆形焊盘的中心之上达到高度H 1,并且在焊料条焊盘的中点之上达到高度H 2。 以H 1和H 2近似相等的方式选择直径D,条长度BL,条宽BW和焊料体积VB的值。 常规的圆形(如上所述)可以在相同的基板上形成焊料凸块; 在这种情况下,H 1和H 2的高度大致等于常规焊料凸块的高度。