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    • 53. 发明专利
    • Driving device of semiconductor element and its control method
    • 半导体元件的驱动装置及其控制方法
    • JP2005192394A
    • 2005-07-14
    • JP2005039944
    • 2005-02-17
    • Hitachi Ltd株式会社日立製作所
    • MIYAZAKI HIDEKISUZUKI KATSUNORITATENO KOJISAKANO JUNICHIIWAMURA MASAHIROMORI MUTSUHIRO
    • H02M1/00H02M1/08H02M7/48H03K17/08H03K17/695
    • PROBLEM TO BE SOLVED: To provide a driving device and its control method for suppressing surge voltage generated in a means or in the case of conducting a current through a power semiconductor element. SOLUTION: The driving device of the power semiconductor element conducting or interrupting the main current is provided with a first resistance variable means for changing a first resister in accordance with control voltage, and a second resistance variable means for changing a second resistor in accordance with voltage between first/second terminals. Either one of the voltage of a control power source or the voltage between the first/second terminals is divided by the first/second resistor. Additionally, the divided voltage is applied to a control gate terminal when the main current is conducted or interrupted. COPYRIGHT: (C)2005,JPO&NCIPI
    • 解决的问题:提供一种用于抑制在装置中产生的浪涌电压或者在通过功率半导体元件导通电流的情况下的驱动装置及其控制方法。 解决方案:导通或中断主电流的功率半导体元件的驱动装置设置有用于根据控制电压改变第一电阻器的第一电阻可变装置和用于改变第二电阻器的第二电阻变化装置 根据第一/第二端子之间的电压。 控制电源的电压或第一/第二端子之间的电压中的任一个被第一/第二电阻器分压。 此外,当主电流被导通或中断时,分压电压被施加到控制栅极端子。 版权所有(C)2005,JPO&NCIPI
    • 55. 发明专利
    • Semiconductor device and power conversion device using the same
    • 使用相同的半导体器件和功率转换器件
    • JP2013026365A
    • 2013-02-04
    • JP2011158595
    • 2011-07-20
    • Hitachi Ltd株式会社日立製作所
    • WATANABE SATOSHISHIRAISHI MASAKISUZUKI HIROSHIMORI MUTSUHIRO
    • H01L29/739H01L21/336H01L29/423H01L29/78
    • H01L29/7397H01L29/0696H01L29/407H01L29/66348
    • PROBLEM TO BE SOLVED: To provide an IGBT of low loss, high breakdown voltage, which can easily control dV/dt of output voltage, and can be easily manufactured.SOLUTION: The semiconductor device includes a first semiconductor layer of first conductivity type, a second semiconductor layer of second conductivity type present on the surface of the first semiconductor layer, a trench formed on the surface of the first semiconductor layer, a semiconductor protruding part on the surface of the first semiconductor layer, a third semiconductor layer formed on the surface of the semiconductor protruding part, a fourth semiconductor layer on the surface of the third semiconductor layer, a gate insulating layer provided along an inner wall of the trench, a first interlayer insulating layer provided along the inner wall of the trench, a first conductive layer which faces the fourth semiconductor layer by way of the gate insulating layer, a second conductive layer of the first interlayer insulating layer, a second interlayer insulating layer that covers the surface of the second conductive layer, a third conductive layer which is formed on the surface of the third semiconductor layer and the fourth semiconductor layer and connected electrically to the fourth semiconductor layer, a contact part which connects the third conductive layer and the third semiconductor layer, and a fourth conductive layer formed on the surface of the second semiconductor layer. A part of the surface of the semiconductor protruding part is the first semiconductor layer.
    • 要解决的问题:提供低损耗,高击穿电压的IGBT,其可以容易地控制输出电压的dV / dt,并且可以容易地制造。 解决方案:半导体器件包括第一导电类型的第一半导体层,存在于第一半导体层的表面上的第二导电类型的第二半导体层,形成在第一半导体层的表面上的沟槽,半导体 在第一半导体层的表面上的突出部分,形成在半导体突出部分的表面上的第三半导体层,在第三半导体层的表面上的第四半导体层,沿着沟槽的内壁设置的栅极绝缘层 沿着沟槽的内壁设置的第一层间绝缘层,通过栅极绝缘层面向第四半导体层的第一导电层,第一层间绝缘层的第二导电层,第二层间绝缘层,第二层间绝缘层, 覆盖第二导电层的表面,形成在表面上的第三导电层 并且与第四半导体层电连接,连接第三导电层和第三半导体层的接触部分和形成在第二半导体层的表面上的第四导电层。 半导体突出部的表面的一部分是第一半导体层。 版权所有(C)2013,JPO&INPIT