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51. 发明授权

US07387717B2 Method of performing electrolytic treatment on a conductive layer of a substrate 失效
标题翻译：在基板的导电层上进行电解处理的方法
公开(公告)号：US07387717B2
公开(公告)日：2008-06-17
申请号：US10631726
申请日：2003-08-01
申请人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
发明人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
IPC分类号： C25D7/12
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.
摘要翻译：用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。密封材料90接触表面的周缘部分，以水密的方式密封该部分。阴极电极88在与基板接触时通过电流。阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。因此，电镀处理和附带的处理可以通过单个单元进行。

52. 发明申请

US20070272645A1 Artificial Nipple, Infant Feeding Device, and Artificial Nipple Manufacturing Method 有权
标题翻译：人造乳头，婴儿喂养装置和人造乳头制造方法
公开(公告)号：US20070272645A1
公开(公告)日：2007-11-29
申请号：US11572526
申请日：2005-07-28
申请人： Kazumasa Ito , Mitsuo Tashiro , Norio Kimura , Nobuyasu Endo
发明人： Kazumasa Ito , Mitsuo Tashiro , Norio Kimura , Nobuyasu Endo
IPC分类号： A61J11/00
CPC分类号： A61J11/02 , A61J11/0015 , A61J11/005 , A61J11/006 , A61J11/0065 , A61J11/04 , A61J11/045
摘要： An artificial nipple can include a nipple body portion connected to a mounting structure that is configured for mounting the nipple on an infant feeding bottle 11. A mammary papilla leading end portion 140 can be disposed at the leading end portion of a mammary papilla portion 130 and have a leading end opening portion 141. The wall from the nipple body portion to the mammary papilla leading end portion is made of a soft material. The inner layer on the inner side of the wall is formed of a shape holding layer made of a material having a rigidity capable of holding the wall shape. The outer layer on the surface side of the wall is formed of a tongue abutting layer having a smooth face for allowing a peristalsis motion by a tongue. Between the shape holding layer and the tongue abutting layer there is disposed a deformation absorbing layer which is made of a material having a lower rigidity than that of the material of the shape holding layer and the tongue abutting layer. The deformation absorbing layer can be made thicker than the shape holding layer and the tongue abutting layer.
摘要翻译：人造乳头可以包括连接到安装结构的乳头主体部分，其被配置为将乳头安装在婴儿喂养瓶11上。乳房乳头前端部140可以设置在乳头乳头部130的前端部，并且具有前端开口部141。从乳头主体部分到乳房乳头前端部的壁由软质材料制成。壁内侧的内层由具有能够保持壁形状的刚性的材料形成的形状保持层形成。壁的表面侧的外层由具有平滑面的舌接触层形成，用于允许舌头的蠕动运动。在形状保持层和舌片抵接层之间设置变形吸收层，该变形吸收层由具有比形状保持层和舌接触层的材料刚性低的材料制成。变形吸收层可以形成为比形状保持层和舌片抵接层更厚。

53. 发明授权

US07279408B2 Semiconductor device, method for manufacturing the same, and plating solution 有权
标题翻译：半导体装置及其制造方法以及电镀液
公开(公告)号：US07279408B2
公开(公告)日：2007-10-09
申请号：US11254790
申请日：2005-10-21
申请人： Hiroaki Inoue , Norio Kimura , Xinming Wang , Moriji Matsumoto , Makoto Kanayama
发明人： Hiroaki Inoue , Norio Kimura , Xinming Wang , Moriji Matsumoto , Makoto Kanayama
IPC分类号： H01L21/44
CPC分类号： H01L21/76843 , C23C18/1608 , C23C18/1632 , C23C18/1653 , C23C18/32 , C23C18/48 , C23C18/50 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76849 , H01L21/76864 , H01L21/76874 , H01L21/76877 , H01L21/76883 , H01L23/53238 , H01L23/53252 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of a semiconductor substrate, and also has a protective film formed on surfaces of exposed interconnects that define the interconnect structure, to protect the interconnects. The protective film has a flattened surface.
摘要翻译：半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法。半导体器件具有嵌入式互连结构，其中诸如铜或银的电导体嵌入形成在半导体衬底的表面中的细小凹槽中，并且还具有形成在暴露的互连件的表面上的保护膜，所述互连限定了互连结构，保护互连。保护膜具有平坦的表面。

54. 发明授权

US07208074B2 Substrate processing apparatus and substrate plating apparatus 失效
标题翻译：基板处理装置和基板电镀装置
公开(公告)号：US07208074B2
公开(公告)日：2007-04-24
申请号：US10742390
申请日：2003-12-22
申请人： Koji Mishima , Junji Kunisawa , Natsuki Makino , Norio Kimura , Hiroaki Inoue , Kenji Nakamura , Moriji Matsumoto , Takahiro Nanjo , Mitsuko Odagaki
发明人： Koji Mishima , Junji Kunisawa , Natsuki Makino , Norio Kimura , Hiroaki Inoue , Kenji Nakamura , Moriji Matsumoto , Takahiro Nanjo , Mitsuko Odagaki
IPC分类号： C25C28/00 , C25D5/10
CPC分类号： H01L21/67109 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67778 , H01L21/681
摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.
摘要翻译：基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人底物处理单元。装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。装载/卸载单元具有可水平旋转的旋转台，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。

55. 发明授权

US07055535B2 Holding unit, processing apparatus and holding method of substrates 失效
标题翻译：保持单元，加工设备和基板的保持方法
公开(公告)号：US07055535B2
公开(公告)日：2006-06-06
申请号：US10629678
申请日：2003-07-30
申请人： Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
发明人： Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
IPC分类号： B08B3/08 , B25B11/00 , H01L21/306
CPC分类号： H01L21/6838 , Y10S134/902 , Y10T279/11
摘要： A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.
摘要翻译：保持单元保持基板以使得能够处理基板的表面。该单元具有与基板的表面的周边部分接触并吸附基板的真空吸附构件。处理装置稳定地保持晶片，并且允许晶片的边缘，斜面部分和/或背面被处理。

56. 发明授权

US06969305B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06969305B2
公开(公告)日：2005-11-29
申请号：US10357473
申请日：2003-02-04
申请人： Norio Kimura , Tadakazu Sone , Tomohiko Akatsuka , Tatsuya Sasaki
发明人： Norio Kimura , Tadakazu Sone , Tomohiko Akatsuka , Tatsuya Sasaki
IPC分类号： B24B49/16 , B24B53/007 , B24B53/017 , B24B1/00
CPC分类号： B24B53/017 , B24B49/16
摘要： A polishing apparatus for polishing a substrate comprises a turntable having a polishing surface, a substrate holder for holding a substrate and bringing the substrate into contact under pressure with the polishing surface, a dresser including a dresser tool adapted to be brought into contact under a pressure with the polishing surface to dress or condition the polishing surface and a pressure device connected to the dresser for moving the dresser between a raised position where the dresser is spaced away from the polishing surface and a dressing position where the dresser rests on the polishing surface such that the dresser tool is in contact with the polishing surface under a pressure exerted by the weight of the dresser itself, the dresser comprising a follow-up mechanism allowing each one of dressing element to move up and down relative to a flange portion so as to follow a contour of the polishing surface of the turntable.
摘要翻译：用于抛光衬底的抛光装置包括具有抛光表面的转盘，用于保持衬底并使衬底在压力下与抛光表面接触的衬底保持器，包括修整器工具的修整器，其适于在压力下接触抛光表面用于打磨或调理抛光表面，以及连接到修整器的压力装置，用于在修整器与抛光表面间隔开的升高位置和修整器搁置在抛光表面上的修整位置之间移动修整器，修整器工具在由修整器本身的重量施加的压力下与抛光表面接触，该修整器包括随动装置，其允许每个修整元件相对于凸缘部分上下移动，以便遵循转盘抛光表面的轮廓。

57. 再颁专利

USRE38854E1 Apparatus for and method for polishing workpiece 有权
公开(公告)号：USRE38854E1
公开(公告)日：2005-10-25
申请号：US10142980
申请日：2002-05-13
申请人： Masamichi Nakashiba , Norio Kimura , Isamu Watanabe , Kaori Yoshida
发明人： Masamichi Nakashiba , Norio Kimura , Isamu Watanabe , Kaori Yoshida
IPC分类号： B24B5/00 , B24B37/04 , B24B49/16
CPC分类号： B24B37/042 , B24B37/30 , B24B49/16
摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

58. 发明授权

US06939208B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06939208B2
公开(公告)日：2005-09-06
申请号：US09787121
申请日：2001-01-22
申请人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
发明人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
IPC分类号： B24B53/00 , B24B53/007 , B24B53/017 , H01L21/306
CPC分类号： B24B53/017 , B24B29/005 , B24B53/003 , H01L21/30625
摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间，并以预定压力按压以抛光工件。抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

59. 发明授权

US06722964B2 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US06722964B2
公开(公告)日：2004-04-20
申请号：US09824644
申请日：2001-04-04
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
摘要翻译：抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属电影。抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光用于抛光衬底的外周部分的机构。

60. 发明授权

US06645053B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06645053B1
公开(公告)日：2003-11-11
申请号：US09622638
申请日：2000-11-08
申请人： Norio Kimura , You Ishii , Yoshikuni Tateyama
发明人： Norio Kimura , You Ishii , Yoshikuni Tateyama
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B53/02
摘要： A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.
摘要翻译：抛光装置具有安装有抛光布的转台和用于在一定压力下将待抛光的工件保持并压在抛光布上的顶环。抛光装置还具有第一修整单元，其具有接触型修整器，用于通过使接触型修整器与抛光布接触来修整抛光布;以及第二修整单元，具有用于修整抛光布的非接触式修整器其中流体喷射从其施加到抛光布上。接触式修整器包括钻石修整器或SiC修整器。

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