专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US4834148A Reinforcement binding machine 失效
标题翻译：加固装订机
公开(公告)号：US4834148A
公开(公告)日：1989-05-30
申请号：US46321
申请日：1987-05-05
申请人： Hiroshi Muguruma , Hiroshi Toyoda , Takayasu Sawano
发明人： Hiroshi Muguruma , Hiroshi Toyoda , Takayasu Sawano
IPC分类号： B21F15/04 , B21F15/06 , B21F27/08 , B21F31/00 , E04G21/12
CPC分类号： E04G21/122
摘要： A reinforcement binding machine using a steel wire comprises a means for feeding the steel wire into a binding station for binding reinforcements together, a guide means provided with a guide path for guiding the steel wire fed into the binding station along a curve encircling the reinforcements and defining the binding station, a means for twisting the steel wire looped by the guide path and defining a slot through which the steel wire fed into the binding station is capable of passing, and a means for rotating the twisting means about the axis crossing the axis of the loop formed from the steel wire so as to twist the steel wire, the twisting means being provided with a pair of pins opposed to each other through the slot and adapted to be moved relatively in the axial direction with respect to the loop, and a means for normally biasing at least one of the pins toward the other one of the pins such that the end faces of the pins are abutted against each other within the binding station.
摘要翻译：使用钢丝的加固装订机包括用于将钢丝馈送到用于将加强件结合在一起的装订台的装置，设置有引导路径的引导装置，所述导向装置沿着环绕加强件的曲线引导送入装订工位的钢丝绳，限定所述装订台，用于扭转由所述引导路径环绕的所述钢丝并限定供给到所述装订台的钢丝能够通过的狭槽的装置，以及用于使所述扭转装置绕所述轴线交叉的轴线旋转的装置由所述钢丝线形成的所述线圈以使所述钢丝扭曲，所述加捻装置设置有通过所述狭槽彼此相对的一对销，并且相对于所述环相对于轴向相对移动，并且用于将所述销中的至少一个朝向所述另一个销正常偏置的装置，使得所述销的端面在所述装订状态下彼此抵靠 n。

52. 外观设计

USD249160S Face massager 失效
公开(公告)号：USD249160S
公开(公告)日：1978-08-29
申请号：US743255
申请日：1976-11-19
申请人： Hiroshi Toyoda
设计人： Hiroshi Toyoda

53. 发明授权

US4070594A Light source device to be utilized mainly for projection purposes 失效
标题翻译：光源装置主要用于投影用途
公开(公告)号：US4070594A
公开(公告)日：1978-01-24
申请号：US656860
申请日：1976-02-10
申请人： Tsutomu Fuchi , Hiroshi Toyoda
发明人： Tsutomu Fuchi , Hiroshi Toyoda
IPC分类号： F21S4/00 , H01K1/42 , H01K7/00 , F21V21/08 , H01K1/24 , H01R33/08
CPC分类号： H01K7/00 , F21S4/20 , H01K1/42
摘要： The present invention discloses a light source device to be utilized mainly for projection purposes in which a plurality of light-emitting sections and a plurality of non-light-emitting sections are alternately connected. Each light emitting section consisting of a halogen lamp comprising a lamp tube made of quartz and enclosing a coiled filament as a single light emitting element and sealing therein inert gas and halogen while the non-light-emitting section consisting of a supporting member for supporting the halogen lamp, the halogen lamps being electrically interconnected in series.
摘要翻译：本发明公开了主要用于多个发光部和多个非发光部交替连接的投影用的光源装置。每个发光部分由卤素灯组成，包括由石英制成的灯管，并且包围线圈灯丝作为单个发光元件并且在其中密封惰性气体和卤素，而非发光部分由支撑构件卤素灯，卤素灯串联电互连。

54. 发明申请

US20080316890A1 Optical Recording Medium, Recording and Reproducing Method Thereof, and Optical Recording Apparatus 失效
标题翻译：光记录介质，记录和再现方法以及光记录装置
公开(公告)号：US20080316890A1
公开(公告)日：2008-12-25
申请号：US11631467
申请日：2005-06-30
申请人： Tohru Yashiro , Yuki Nakamura , Tatsuo Mikami , Ikuo Shimizu , Motoharu Kinugasa , Hiroshi Toyoda
发明人： Tohru Yashiro , Yuki Nakamura , Tatsuo Mikami , Ikuo Shimizu , Motoharu Kinugasa , Hiroshi Toyoda
IPC分类号： G11B3/74 , B32B3/00
CPC分类号： G11B7/246 , G11B7/24 , G11B7/24038 , G11B7/245 , G11B7/2463 , G11B7/2467 , G11B7/2472 , G11B7/248 , G11B7/2492 , G11B7/2531 , G11B7/2532 , G11B7/2533 , G11B7/2534 , G11B7/2535 , G11B7/2542 , G11B7/2548 , G11B7/256 , G11B7/2578 , G11B7/259 , G11B2007/24612 , G11B2007/25417 , G11B2007/25706 , G11B2007/25708 , G11B2007/2571 , G11B2007/25711 , G11B2007/25713 , G11B2007/25715 , G11B2007/25716 , G11B2007/25718
摘要： The present invention relates to an optical recording medium containing a first substrate, a first information layer, an intermediate layer, a second information layer and a second substrate in this order, wherein the first information layer contains a first recording layer disposed on the first substrate and the second information layer contains a reflective layer, a second recording layer containing an organic dye and a protective layer which are disposed on the second substrate in this order; and the second recording layer contains an organic dye which is at least one elected from the group consisting of the specified squarylium metal chelate compounds.
摘要翻译：本发明涉及依次包含第一基板，第一信息层，中间层，第二信息层和第二基板的光学记录介质，其中第一信息层包含设置在第一基板上的第一记录层第二信息层依次包含反射层，含有有机染料的第二记录层和设置在第二基板上的保护层; 并且第二记录层含有至少一种选自指定的方酸金属螯合物的有机染料。

55. 发明申请

US20080237863A1 Semiconductor device and manufacturing method of semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US20080237863A1
公开(公告)日：2008-10-02
申请号：US12081818
申请日：2008-04-22
申请人： Hiroshi Toyoda , Mitsuhiro Nakao , Masahiko Hasunuma , Hisashi Kaneko , Atsuko Sakata , Toshiaki Komukai
发明人： Hiroshi Toyoda , Mitsuhiro Nakao , Masahiko Hasunuma , Hisashi Kaneko , Atsuko Sakata , Toshiaki Komukai
IPC分类号： H01L23/49
CPC分类号： H01L21/76846 , H01L21/76834 , H01L21/76849 , H01L21/76858 , H01L21/76886 , H01L21/76888 , H01L22/32 , H01L23/53233 , H01L23/53238 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05009 , H01L2224/05017 , H01L2224/05082 , H01L2224/05083 , H01L2224/05093 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05546 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05559 , H01L2224/05567 , H01L2224/05605 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/0562 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/1312 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48505 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48747 , H01L2224/48799 , H01L2224/48805 , H01L2224/48811 , H01L2224/48813 , H01L2224/48816 , H01L2224/4882 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/85375 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01327 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/12042 , H01L2924/00014 , H01L2924/04941 , H01L2224/05609 , H01L2924/00 , H01L2224/48744 , H01L2224/48713 , H01L2224/48705 , H01L2224/4872 , H01L2224/48605 , H01L2224/48613 , H01L2224/4862 , H01L2924/00015
摘要： A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.
摘要翻译：一种半导体器件，其由形成在半导体衬底上的铜布线层构成，该电极层与铜布线层电连接并具有合金，所述焊接电极层含有铜和氧化倾向高于铜的金属形成为延伸到底表面，并且具有延伸到焊盘电极层的开口的绝缘保护膜。

56. 发明授权

US07368224B2 Photopolymerizable composition 失效
标题翻译：可光聚合组合物
公开(公告)号：US07368224B2
公开(公告)日：2008-05-06
申请号：US10508528
申请日：2003-04-03
申请人： Tsuguo Yamaoka , Ikuo Shimizu , Hiroshi Toyoda , Motoharu Kinugasa , Masanori Ikuta , Kyoko Katagi
发明人： Tsuguo Yamaoka , Ikuo Shimizu , Hiroshi Toyoda , Motoharu Kinugasa , Masanori Ikuta , Kyoko Katagi
IPC分类号： G03C1/735 , G03F7/028 , C07D261/06 , C07D231/10
CPC分类号： C07D417/08 , C07D231/22 , C07D261/12 , C07D403/08 , C07D413/06 , C07D413/08 , C08F2/50 , G03F7/029 , Y10S430/117 , Y10S430/12 , Y10S430/121 , Y10S430/122 , Y10S430/124 , Y10S430/126 , Y10S430/127
摘要： The invention provides a photopolymerizable composition having a high photosensitivity, which comprises a metal complex of a squarylium compound, a radical generator, and a compound having at least one ethylenically unsaturated double bond.The photopolymerizable composition of the present invention is advantageously used for a visible laser recording material such as a PS (Presensitized Plate) for laser direct plate-making, a dry film resist, a digital proof, a hologram, or the like, a panchromatic sensitive material (e.g., a sensitive material for a color hologram and a sensitive material used for full-color display and containing a photopolymerizable composition in a microcapsule), paints, adhesives, and so on.
摘要翻译：本发明提供具有高光敏性的可光聚合组合物，其包含方酸化合物的金属络合物，自由基产生剂和具有至少一个烯属不饱和双键的化合物。本发明的光聚合性组合物有利地用于可见激光记录材料，例如用于激光直接制版的PS（致敏板），干膜抗蚀剂，数字证明，全息图等，全色敏感材料（例如，用于彩色全息图的敏感材料和用于全色显示并在微胶囊中含有可光聚合组合物的敏感材料），油漆，粘合剂等。

57. 发明申请

US20080074005A1 PIEZOELECTRIC THIN FILM DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20080074005A1
公开(公告)日：2008-03-27
申请号：US11946913
申请日：2007-11-29
申请人： Kenya SANO , Ryoichi Ohara , Naoko Yanase , Takaaki Yasumoto , Kazuhiko Itaya , Takashi Kawakubo , Hiroshi Toyoda , Masahiko Hasunuma , Toshihiko Nagano , Kazuhide Abe , Michihiko Nishigaki , Hironobu Shibata
发明人： Kenya SANO , Ryoichi Ohara , Naoko Yanase , Takaaki Yasumoto , Kazuhiko Itaya , Takashi Kawakubo , Hiroshi Toyoda , Masahiko Hasunuma , Toshihiko Nagano , Kazuhide Abe , Michihiko Nishigaki , Hironobu Shibata
IPC分类号： H01L41/047
CPC分类号： H03H9/02015 , H01H2057/006 , H01L41/0477 , H01L41/094 , H01L41/316 , H01L41/319 , H03H3/02 , H03H9/02094 , H03H9/173 , H03H9/174 , H03H9/175 , H03H9/542 , H03H9/582 , H03H9/605 , H03H2003/021 , H03H2003/023 , H03H2003/025 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49005 , Y10T29/49117 , Y10T29/49155
摘要： A piezoelectric thin film device includes an amorphous metal film disposed on a substrate and a piezoelectric film disposed on the amorphous metal. One of crystal axis of the piezoelectric film is aligned in a direction perpendicular to a surface of the amorphous metal.

58. 发明申请

US20070148424A1 Photocatalyst sheet and methods of welding and manufacturing the same 有权
标题翻译：光触媒片和焊接与制造方法相同
公开(公告)号：US20070148424A1
公开(公告)日：2007-06-28
申请号：US10583779
申请日：2004-12-10
申请人： Hiroshi Toyoda , Kazuhiro Abe , Takayuki Nakata
发明人： Hiroshi Toyoda , Kazuhiro Abe , Takayuki Nakata
IPC分类号： B01J31/00 , D04H13/00 , B32B5/16 , B32B27/00 , B32B25/04
CPC分类号： B32B27/18 , B01J21/063 , B01J35/004 , B01J37/0219 , B32B27/12 , Y10T428/19 , Y10T428/2438 , Y10T428/249924 , Y10T428/2991 , Y10T428/3154 , Y10T428/31826 , Y10T428/3183
摘要： The present invention provides the photocatalyst sheet and the methods of welding and manufacturing the same, by which the substrate and resin of the photocatalyst-containing layer are not decomposed by photocatalyst particles, mutual welding of sheets is easy, and the photo-redox effect of a photocatalyst can be obtained. A photocatalyst sheet (1b) comprises a substrate (2) such as fiber and coated layers (3) on both sides of the substrate (2), and the coated layer (3) constitutes the photocatalyst-containing layer in which apatite-coated photocatalyst particles (4) are dispersed and fixed with resin. Here, the coated photocatalyst particles (4) on the surface of the photocatalyst-containing layer are so fixed as to have the parts exposed from the surface of the photocatalyst-containing layer. In case that photocatalyst sheets (1b) are mutually welded, the photocatalyst-containing layer of each photocatalyst sheet (1b) is not removed, and its surface is mutually held, and welded together by thermal welding or others.
摘要翻译：本发明提供了光催化剂片及其制造方法，光催化剂层的基材和树脂不被光催化剂粒子分解，容易进行片的相互熔接，光氧化还原效果可以获得光催化剂。光催化剂片（1b）在基材（2）的两面上包含基材（2）如纤维和涂层（3），涂层（3）构成含有磷灰石涂层的光催化剂层光催化剂颗粒（4）用树脂分散和固定。这里，含光催化剂层的表面上的被覆光催化剂粒子（4）固定，使得从含有光催化剂层的表面露出的部分。在光催化剂片（1b）相互焊接的情况下，每个光催化剂片（1b）的光催化剂层不被除去，其表面相互保持，并通过热焊接等焊接在一起。

59. 发明申请

US20060063864A1 Filters of electronic displays 失效
标题翻译：电子显示屏过滤器
公开(公告)号：US20060063864A1
公开(公告)日：2006-03-23
申请号：US10516749
申请日：2003-07-03
申请人： Ikuo Shimizu , Motoharu Kinugasa , Hiroshi Toyoda , Masanori Ikuta , Kyoko Katagi
发明人： Ikuo Shimizu , Motoharu Kinugasa , Hiroshi Toyoda , Masanori Ikuta , Kyoko Katagi
IPC分类号： C08K5/34
CPC分类号： C07D207/335 , C07D209/14 , C07D403/08 , G02B5/223 , H01J2211/44 , Y10T428/1041
摘要： The present invention provides a filter of an electronic display device which selectively blocks light with wavelengths that degrade color purity and can provide a clear image, the filter comprising a squarylium compound represented by general formula (I): [wherein R1 represents a hydrogen atom, an alkyl group, or the like; R2, R3 and R4 each represent a hydrogen atom, a halogen atom, an alkyl group, or the like; and X represents a group represented by formula (A): (wherein R5, R6, R7, and R8 represent a hydrogen atom, a halogen atom, an alkyl group, or the like; and R9 and R10 represent a hydrogen atom, an alkyl group, or the like), or the like].
摘要翻译：本发明提供了一种电子显示装置的滤光器，其选择性地阻挡具有降低色纯度的波长并可提供清晰图像的光，该滤光片包括由通式（I）表示的方酸化合物：

60. 发明申请

US20050272258A1 Method of manufacturing a semiconductor device and semiconductor device 审中-公开
标题翻译：制造半导体器件和半导体器件的方法
公开(公告)号：US20050272258A1
公开(公告)日：2005-12-08
申请号：US11143449
申请日：2005-06-03
申请人： Toshiyuki Morita , Hiroshi Toyoda , Yoshitaka Matsui , Fumitoshi Ikegaya , Atsuko Sakata , Tomio Katata , Seiichi Omoto
发明人： Toshiyuki Morita , Hiroshi Toyoda , Yoshitaka Matsui , Fumitoshi Ikegaya , Atsuko Sakata , Tomio Katata , Seiichi Omoto
IPC分类号： H01L21/285 , H01L21/288 , H01L21/768 , H01L31/00
CPC分类号： H01L21/2885 , H01L21/2855 , H01L21/76801 , H01L21/76802 , H01L21/76807 , H01L21/76835 , H01L21/76877 , H01L2924/0002 , H01L2924/00
摘要： According to one aspect of the present invention, provided is a method of manufacturing a semiconductor device, including: forming a first metal film on a substrate having a recessed portion in a surface thereof, by a plating method so as to bury the first metal film in at least part of the recessed portion; forming a second metal film on the first metal film by a film deposition method different from the plating method, the second metal film including, as a main component, a metal that is a main component of the first metal film and containing an impurity whose concentration is lower than concentration of an impurity contained in the first metal film; heat-treating the first and second metal films; and removing the first and second metal films except portions buried in the recessed portion.
摘要翻译：根据本发明的一个方面，提供一种制造半导体器件的方法，包括：通过电镀方法在其表面具有凹陷部分的基板上形成第一金属膜，以便将第一金属膜在所述凹部的至少一部分中; 通过不同于镀覆方法的成膜方法在第一金属膜上形成第二金属膜，第二金属膜以第一金属膜的主要成分为主成分，含有浓度为低于第一金属膜中所含杂质的浓度; 热处理第一和第二金属膜; 以及去除除了隐藏在凹部中的部分之外的第一和第二金属膜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式