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    • 51. 发明授权
    • Circuit for electrostatic discharge (ESD) protection
    • 静电放电(ESD)保护电路
    • US07692907B2
    • 2010-04-06
    • US11717948
    • 2007-03-13
    • Shih-Hung ChenMing-Dou Ker
    • Shih-Hung ChenMing-Dou Ker
    • H02H9/00H02H3/20H02H9/04H02H3/22H01C7/12H02H1/00H02H1/04
    • H01L27/0251H01L27/0292
    • A circuit capable of providing electrostatic discharge (ESD) protection, the circuit comprising a first set of power rails comprising a first high power rail and a first low power rail, a first interface circuit between the first set of power rails, the first interface circuit having at least one gate electrode, a first ESD device comprising a terminal coupled to the at least one gate electrode of the first interface circuit, and a second ESD device comprising a terminal coupled to the at least one gate electrode of the first interface circuit, the first ESD device and the second ESD device being configured to maintain a voltage level at the at least one gate electrode of the first interface circuit at approximately a ground level when ESD occurs.
    • 一种能够提供静电放电(ESD)保护的电路,所述电路包括包括第一高功率轨道和第一低功率轨道的第一组电力轨道,所述第一组电力轨道之间的第一接口电路,所述第一接口电路 具有至少一个栅电极,第一ESD器件,其包括耦合到所述第一接口电路的所述至少一个栅电极的端子,以及包括耦合到所述第一接口电路的所述至少一个栅电极的端子的第二ESD器件, 第一ESD器件和第二ESD器件被配置为当ESD发生时将第一接口电路的至少一个栅电极的电压电平保持在大致的接地电平。
    • 52. 发明申请
    • CARD FIXER
    • 卡片固定器
    • US20090117763A1
    • 2009-05-07
    • US12211062
    • 2008-09-15
    • Shih-Hung Chen
    • Shih-Hung Chen
    • H01R13/44
    • H05K5/0265H05K5/0282Y10S439/945
    • A card fixer is suitable to assist a card to be fixed in a slot of an electronic device. The card fixer includes a body and a clipping structure, wherein the body has a first side and a second side parallel to the first side. A hook is disposed on the first side of the body. The clipping structure extends out of the second side of the body for clipping the card thereon. When the clipping structure of the card fixer clips the card and the assembly of the card fixer with the card is inserted into the slot, the hook is locked on an inside wall of the slot.
    • 卡固定器适合于帮助卡固定在电子设备的槽中。 卡定位器包括主体和夹持结构,其中主体具有平行于第一侧的第一侧和第二侧。 钩体设置在身体的第一侧。 剪辑结构从身体的第二侧延伸出来,以将卡夹在其上。 当卡片固定器的剪辑结构夹住卡时,卡片固定器与卡的组合被插入到插槽中,钩被锁定在插槽的内壁上。
    • 53. 发明申请
    • SELF-ALIGNED STRUCTURE AND METHOD FOR CONFINING A MELTING POINT IN A RESISTOR RANDOM ACCESS MEMORY
    • 自对准结构和方法,用于在电阻随机访问存储器中配置熔点
    • US20090020746A1
    • 2009-01-22
    • US12235773
    • 2008-09-23
    • Erh-Kun LaiChiaHua HoKuang Yeu HsiehShih-Hung Chen
    • Erh-Kun LaiChiaHua HoKuang Yeu HsiehShih-Hung Chen
    • H01L45/00
    • H01L45/06G11C11/5678G11C13/0004H01L27/2436H01L45/1233H01L45/1246H01L45/144H01L45/148H01L45/1666
    • A process in the manufacturing of a resistor random access memory with a confined melting area for switching a phase change in the programmable resistive memory. The process initially formed a pillar comprising a substrate body, a first conductive material overlying the substrate body, a programmable resistive memory material overlying the first conductive material, a high selective material overlying the programmable resistive memory material, and a silicon nitride material overlying the high selective material. The high selective material in the pillar is isotropically etched on both sides of the high selective material to create a void on each side of the high selective material with a reduced length. A programmable resistive memory material is deposited in a confined area previously occupied by the reduced length of the poly, and the programmable resistive memory material is deposited into an area previously occupied by the silicon nitride material.
    • 制造具有用于切换可编程电阻存储器中的相位变化的限定熔化区域的电阻器随机存取存储器的过程。 该工艺最初形成了一个支柱,该支柱包括衬底主体,覆盖衬底主体的第一导电材料,覆盖第一导电材料的可编程电阻性存储器材料,覆盖在可编程电阻性存储器材料上的高选择性材料, 选择性材料。 柱中的高选择性材料在高选择性材料的两侧进行各向同性蚀刻,以在长度较小的高选择性材料的每侧产生空隙。 可编程电阻式存储器材料沉积在先前由多晶硅长度减小的限制区域中,并且可编程电阻式存储器材料沉积到先前由氮化硅材料占据的区域中。
    • 55. 发明申请
    • Multi-Layer Electrode Structure
    • 多层电极结构
    • US20080142984A1
    • 2008-06-19
    • US11611428
    • 2006-12-15
    • Shih-Hung Chen
    • Shih-Hung Chen
    • H01L23/48H01L21/44
    • H01L45/144H01L45/06H01L45/1233H01L45/126H01L45/16
    • An electrode structure including two parallel electrical paths. A plurality of electrode layers, generally tabular in form is formed in a stack, the outermost layers providing electrical contacts, and defining a first electrical current path through the stack. Two sidewall conductor layers are formed to abut either end of the electrode layer stack, two sidewall conductor layers defining a second electrical current path. The ends of the sidewall conduction layers lie in the same planes as the electrode layer electrical contacts, such that electrode structure electrical contacts are each formed from one set of sidewall layer ends and an electrode layer electrical contact.
    • 一种包括两个平行电路的电极结构。 多个电极层通常以叠片的形式形成在堆叠中,最外层提供电触点,并且限定穿过叠层的第一电流路径。 形成两个侧壁导体层以邻接电极层堆叠的任一端,限定第二电流路径的两个侧壁导体层。 侧壁导电层的端部位于与电极层电接触相同的平面中,使得电极结构电触头各自由一组侧壁层端部和电极层电接触形成。
    • 56. 发明申请
    • Self-Aligned Structure and Method for Confining a Melting Point in a Resistor Random Access Memory
    • 用于限制电阻随机存取存储器中的熔点的自对准结构和方法
    • US20080121861A1
    • 2008-05-29
    • US11465094
    • 2006-08-16
    • Erh-Kun LaiChiaHua HoKuang Yeu HsiehShih-Hung Chen
    • Erh-Kun LaiChiaHua HoKuang Yeu HsiehShih-Hung Chen
    • H01L45/00
    • H01L45/06G11C11/5678G11C13/0004H01L27/2436H01L45/1233H01L45/1246H01L45/144H01L45/148H01L45/1666
    • A process in the manufacturing of a resistor random access memory with a confined melting area for switching a phase change in the programmable resistive memory. The process initially formed a pillar comprising a substrate body, a first conductive material overlying the substrate body, a programmable resistive memory material overlying the first conductive material, a high selective material overlying the programmable resistive memory material, and a silicon nitride material overlying the high selective material. The high selective material in the pillar is isotropically etched on both sides of the high selective material to create a void on each side of the high selective material with a reduced length. A programmable resistive memory material is deposited in a confined area previously occupied by the reduced length of the poly, and the programmable resistive memory material is deposited into an area previously occupied by the silicon nitride material.
    • 制造具有用于切换可编程电阻存储器中的相位变化的限定熔化区域的电阻器随机存取存储器的过程。 该工艺最初形成了一个支柱,该支柱包括衬底主体,覆盖衬底主体的第一导电材料,覆盖第一导电材料的可编程电阻性存储器材料,覆盖在可编程电阻性存储器材料上的高选择性材料, 选择性材料。 柱中的高选择性材料在高选择性材料的两侧进行各向同性蚀刻,以在长度较小的高选择性材料的每侧产生空隙。 可编程电阻式存储器材料沉积在先前由多晶硅长度减小的限制区域中,并且可编程电阻式存储器材料沉积到先前由氮化硅材料占据的区域中。
    • 57. 发明申请
    • ESD PROTECTION CIRCUIT USING SELF-BIASED CURRENT TRIGGER TECHNIQUE AND PUMPING SOURCE MECHANISM
    • 使用自偏移电流触发技术和泵浦源机制的ESD保护电路
    • US20080062598A1
    • 2008-03-13
    • US11740904
    • 2007-04-26
    • Shih-Hung ChenMing-Dou Ker
    • Shih-Hung ChenMing-Dou Ker
    • H02H9/04
    • H01L27/0266
    • A circuit capable of providing electrostatic discharge (ESD) protection includes a first transistor including a first gate and a first source, the first gate being connected to a conductive pad, an impedance device between the first source and a first power rail capable of providing a resistor, a second transistor including a second gate and a second source, the second source being connected to the first power rail through the impedance device, and a clamp device between the first power rail and a second power rail, wherein the clamp device is capable of conducting a first portion of an ESD current and the second transistor is capable of conducting a second portion of the ESD current as the conductive pad is relatively grounded.
    • 能够提供静电放电(ESD)保护的电路包括:第一晶体管,包括第一栅极和第一源极,第一栅极连接到导电焊盘,第一源极与能够提供 电阻器,包括第二栅极和第二源极的第二晶体管,所述第二源极通过所述阻抗器件连接到所述第一电力轨道,以及在所述第一电力轨道和第二电力轨道之间的夹紧装置,其中所述夹紧装置能够 导电ESD电流的第一部分,并且当导电焊盘相对接地时,第二晶体管能够导通ESD电流的第二部分。