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51. 发明专利

JPH06203659A MANUFACTURE OF TAPE WIRE FOR HIGH FREQUENCY 失效
公开(公告)号：JPH06203659A
公开(公告)日：1994-07-22
申请号：JP25073692
申请日：1992-08-25
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H01B7/08 , H01B13/00 , H05K1/02 , H05K3/00 , H05K3/46
摘要： PURPOSE:To easily provide a tape wire for high frequency enhanced in density by etching a metal foil layer and an insulator layer provided on a base, and opposing a plurality of the resulting bases to each other followed by integration. CONSTITUTION:The one-side metal foil layer 31 of a base 1 with double metal foil is etched to form a conductor circuit 21. The exposed insulator layer is etched to a desired depth to form a groove part 23. A base with double metal foil having a circuit substantially having the negative-positive relation with this circuit formed on one side is formed. These two bases are stuck and integrated together by use of an adhesive 4 with the conductor circuit 21 surfaces being mutually opposed. Thus, the thickness of the insulator layer can be optionally regulated.

52. 发明专利

JPH0574865A MANUFACTURE OF TAPE CARRIER 失效
公开(公告)号：JPH0574865A
公开(公告)日：1993-03-26
申请号：JP25862791
申请日：1991-09-11
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent a sprocket hole from clogging due to falling of a resist into the sprocket hole or prevent the sprocket hole from expanding during a manufacturing process of a tape carrier, by providing an auxiliary sprocket hole outside the width of a normal tape carrier. CONSTITUTION:Auxiliary sprocket holes 18 are perforated within an auxiliary region (u) at the opposite ends of a composite tape with a continuous press punching machine, using a material tape having a width (t) longer than the width (s) of a tape employed as a normal tape carrier. The auxiliary sprocket holes 18 are used for a rough alignment for positioning when a normal sprocket hole and the other necessary elements formed by using the hole as a reference mark are provided. Since the sprocket hole can be prevented from clogging due to falling of a resist into the sprocket hole, thus, a good and productive application of the resist can be performed.

53. 发明专利

JPH0574864A MANUFACTURE OF TAPE CARRIER 失效
公开(公告)号：JPH0574864A
公开(公告)日：1993-03-26
申请号：JP25862691
申请日：1991-09-11
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To minimize a dimensional error in placement of a sprocket hole itself or a dimensional error between the sprocket holes, by providing an auxiliary sprocket hole having a diameter shorter than one of a normal sprocket hole at a predetermined region before forming the normal sprocket hole. CONSTITUTION:Auxiliary sprocket holes 8 are perforated on both ends of a copper foil tape longitudinally at a given interval with a continuous press punching machine. This is done so that a resist layer is not formed at a position of a normal sprocket hole (a predetermined region 205 of the sprocket hole) and a metal wiring pattern region 203. Then, the predetermined region 205 of the sprocket hole is formed so that the auxiliary sprocket hole 8 is surrounded. For a dimensional error of manufacture of a tape carrier, thus, accuracy can be improved remarkably as compared with a conventional method.

54. 发明专利

JPH04338656A CHIP CARRIER AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04338656A
公开(公告)日：1992-11-25
申请号：JP13946891
申请日：1991-05-16
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60 , H05K1/00
摘要： PURPOSE:To reduce cost by covering a drilled hole at a portion to be bent by a flexible film layer consisting of an adhesive layer. CONSTITUTION:A polyimide film 2 is prepared. A scheduled laying portion as its device hole 1 and a portion to be bent 6 overlapping with metal wiring are punched and processed by a continuous press drilling machine to a corresponding shape. A copper foil applied with an adhesive is bonded by a laminating machine to the polyimide film 2 punched and processed. Then, the adhesive layer is heated and hardened, and a base member is produced by using the adhesive layer as a flexible film 8. And a photoresist at the copper foil side is applied and dried, a predetermined pattern is exposed and developing is performed, the copper foil is etched and then metal wiring 3 is formed.

55. 发明专利

JPH04277421A MANUFACTURE OF DOUBLE LAYER TAB TAPE 失效
公开(公告)号：JPH04277421A
公开(公告)日：1992-10-02
申请号：JP4007291
申请日：1991-03-06
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SEKI OSAMU , OTANI KENICHI , MUGISHIMA TOSHIO
IPC分类号： H01B17/62 , H01B19/00 , H05K3/02
摘要： PURPOSE:To provide a double layer TAB tape by accurately and safely forming an insulating layer of a predetermined pattern on a conductor layer. CONSTITUTION:A pattern having a sprocket hole, an outer lead hole, and a device hole is printed onto a conductor layer 10 made of an electrolytic copper foil by a gravure printing method so as to form a polyimide layer 12. Heat- treatment for a predetermined time is repeated for curing so that a double layer TAB tape having a polyimide insulating layer of a predetermined pattern may be produced.

56. 发明专利

JPH04217386A MANUFACTURE OF CIRCUIT 失效
公开(公告)号：JPH04217386A
公开(公告)日：1992-08-07
申请号：JP41130190
申请日：1990-12-18
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H01L21/60 , H05K3/06
摘要： PURPOSE:To provide a method thereby to prepare easily a microcircuit which is excellent in terms of reliability and electric properties on an insulation board. CONSTITUTION:As illustrated in Fig. 1(a), a groove is formed on a section which serves as a circuit on an insulation board 1. Copper 3 is sputtered to the surface of the insulation board 1 which includes this groove so as to provide electrical conductivity as illustrated in Fig. 1(b). Then, electrolytic plating is applied to the insulation board which contains the groove so that the groove section may be filled with a conductor 4 as illustrated in Fig. 1(c), and then an unnecessary part of a surface conducting layer is etched and removed so that the conductor upper part of he groove section may be exposed as illustrated in Fig. 1(d). Then, the thickness of the insulation board 1 is reduced by etching at least partially so that the conductor in the groove section may be exposed from the surface of the insulation board 1 by a required height, thereby forming a circuit as illustrated in Fig. 1(e).

57. 发明专利

JPH04215448A PRODUCTION OF CHIP CARRIER 失效
公开(公告)号：JPH04215448A
公开(公告)日：1992-08-06
申请号：JP41064190
申请日：1990-12-14
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To reduce the cost by covering the surface on the opening side of a metal thin film with another insulating flexible layer thicker than a flexible film member and forming metal wiring by etching the metal thin film. CONSTITUTION:For a base film 2, an area 6 which forms the thin part on a part to be bent is punched out to form an opening using an adhesive polyimide film. Copper foil is laminated on the base film 2 and a metal thin film is formed. An area surrounded by the circumference including the opening is coated with urethane ultraviolet hardening resin and a resin layer 11 is formed. Then, photoresist is coated on the copper foil side, dried, exposed and developed by a prescribed pattern. Resist is coated on the whole plane on the base film 2 side, the copper foil is etched and metal wiring 3 is formed. Then, the resist films on the both planes are removed, tin plated and a chip carrier which has a thin part 6 composed of the resin layer 11 on the part to be bent is produced.

58. 发明专利

JPS63307608A THIN-WALL INSULATED WIRE 失效
公开(公告)号：JPS63307608A
公开(公告)日：1988-12-15
申请号：JP14139787
申请日：1987-06-08
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NISHIYAMA HIDEMI , OTANI KENICHI
IPC分类号： H01B3/30 , H01B3/44
摘要： PURPOSE:To enable a thin-wall insulated wire, which is excellent in the characteristics, such as abrasion resistance and the like, and inexpensive in the material cost, to be obtained by using as the coating material a resin composition substance, in which styrene resin and ethylene-vinyl acetate copolymer are combined with polyurethane resin having the Shore 'D' hardness of 60 or more. CONSTITUTION:A conductor is coated with a resin composition substance, which is comprised of 50-90% by weight of polyurethane resin having the Shore 'D' hardness of not less than 60 and 5-45% by weight of ethylene-vinyl acetate copolymer, to the thickness of not more than 0.3mm. Hereupon, it is desirable that not less than 60% by weight of polyurethane resin having the Shore 'D' hardness of not less than 60 is combined therewith. Thereby, it is made possible to obtain a thin-wall insulated wire which is thin in its coating thickness, and excellent in such characteristics as abrasion resistance and the like, and moreover, equal in the cost to vinyl-chloride-resin insulated wires.

59. 发明专利

JPS6369105A THIN INSULATED WIRE 失效
公开(公告)号：JPS6369105A
公开(公告)日：1988-03-29
申请号：JP21344986
申请日：1986-09-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NISHIYAMA HIDEMI , OTANI KENICHI
IPC分类号： H01B3/30

60. 发明专利

JPS633931A MANUFACTURE OF CROSSLINKED POLYOLEFIN EXTRUDED ITEM 失效
公开(公告)号：JPS633931A
公开(公告)日：1988-01-08
申请号：JP14613386
申请日：1986-06-24
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIRAMATSU EIJI , OTANI KENICHI
IPC分类号： B29C47/00 , B29C47/78 , B29K23/00 , B29K105/24 , C08F255/00
摘要： PURPOSE:To obtain a highly crosslinked product with no bubble by a method wherein a cooling zone is provided between an extruder and a forming head so as to uniformize the temperature of kneaded resin under molten state in a method for manufactureing a silane crosslinked polyolefin extruded item. CONSTITUTION:A cooling zone 11 consisting of a static type mixer-agitator, an extruder, a gear pump and the like is provided between an extruder 3 and a crosshead 6. A compound consisting of polyolefin pellets, various fillers and silanol condensation catalyst is charged from the hopper 4 of the extruder 3, and a graft reaction agent such as unsaturated alkylsilane and peroxide and the like is charged from the lower part of the hopper into a cylinder 8 by means of a pouring pump 2 so as to cause, a silicon grafting reaction and, after that, the temperature of the molten resin in uniformized in the cooling zone 11 in order to extrude the molten resin from a forming head 6 after cooling down of the molten resin. Thus, a product with high degree of crosslinking and with no bubble can be easily manufactured by the single stage method.

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