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51. 发明授权

US08550601B2 Use of photoresist material as an interstitial fill for PZT printhead fabrication 有权
标题翻译：使用光致抗蚀剂材料作为PZT打印头制造的间隙填充
公开(公告)号：US08550601B2
公开(公告)日：2013-10-08
申请号：US13069732
申请日：2011-03-23
申请人： Mark A. Cellura , Peter J. Nystrom , Kock-yee Law , John Paul Meyers , Gary Daniel Redding , Yuanjia Zhang
发明人： Mark A. Cellura , Peter J. Nystrom , Kock-yee Law , John Paul Meyers , Gary Daniel Redding , Yuanjia Zhang
IPC分类号： B41J2/045
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2/1645
摘要： An ink jet printhead including a plurality of piezoelectric elements and a photosensitive interstitial layer which fills spaces between each adjacent piezoelectric element. The ink jet printhead can be formed using a simplified method to pattern the photosensitive interstitial layer, and to remove a diaphragm attach material which covers a plurality of openings through a diaphragm using laser ablation.
摘要翻译：一种喷墨打印头，包括多个压电元件和填充每个相邻的压电元件之间的空间的感光间隙层。可以使用简化的方法来形成喷墨打印头以对感光间隙层进行图案化，并且通过使用激光烧蚀去除通过隔膜覆盖多个开口的膜片附着材料。

52. 发明申请

US20130222486A1 USING SATURATED MESH TO CONTROL ADHESIVE BOND LINE QUALITY 有权
标题翻译：使用饱和的网来控制胶粘线质量
公开(公告)号：US20130222486A1
公开(公告)日：2013-08-29
申请号：US13404426
申请日：2012-02-24
申请人： Peter J. Nystrom , Yanjia Zuo
发明人： Peter J. Nystrom , Yanjia Zuo
IPC分类号： B41J2/045 , C09J5/04
CPC分类号： B41J2/1623 , B41J2/161
摘要： In some aspects of the present application, a printhead assembly is disclosed that comprise a plurality of functional plates stacked together; an adhesive confinement structure comprising an adhesive-coated mesh substrate arranged between adjacent functional plates to provide bonding between the plates.
摘要翻译：在本申请的一些方面，公开了一种打印头组件，其包括堆叠在一起的多个功能板; 粘合剂约束结构包括布置在相邻功能板之间的粘合剂涂覆的网格基底，以提供板之间的结合。

53. 发明申请

US20130215197A1 PRINTHEAD FLUID PATHS FORMED WITH SACRIFICIAL MATERIAL PATTERNED USING ADDITIVE MANUFACTURING PROCESSES 有权
标题翻译：使用添加剂制造工艺形成的具有特殊材料的PRINTHEAD FLUID PATHS
公开(公告)号：US20130215197A1
公开(公告)日：2013-08-22
申请号：US13397809
申请日：2012-02-16
申请人： Andrew Wayne Hays , Peter J. Nystrom
发明人： Andrew Wayne Hays , Peter J. Nystrom
IPC分类号： B41J2/14 , B23P17/00
CPC分类号： B41J2/14 , B33Y80/00 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1634 , B41J2/1639 , B41J2/164 , B41J2/1642 , Y10T29/42 , Y10T29/49083 , Y10T29/49126 , Y10T29/49401
摘要： A method for forming an ink jet printhead subassembly can include the use of a sacrificial form to fabricate a printhead subassembly having a plurality of ink channels therethrough. The sacrificial form can be manufactured using one or more described techniques. The completed printhead subassembly can include a single solid structure manufactured from a single material, or can include more than one solid structures assembled together. A printhead subassembly according to the present teachings can have a reduced number of parts and cost, simplified manufacture, and increased yields and lifetime compared to some other printhead subassemblies.
摘要翻译：用于形成喷墨打印头子组件的方法可以包括使用牺牲形式来制造具有穿过其中的多个墨水通道的打印头子组件。可以使用一种或多种所描述的技术来制造牺牲形式。完成的打印头子组件可以包括由单一材料制成的单个固体结构，或者可以包括组装在一起的多于一个固体结构。与其他打印头组件相比，根据本发明的打印头子组件可以具有减少的部件数量和成本，简化制造以及增加的产量和寿命。

54. 发明申请

US20130215185A1 LASER TRANSMISSION LAMINATING OF MATERIALS FOR INK JET PRINTHEADS 有权
标题翻译：喷墨打印材料的激光传输层压材料
公开(公告)号：US20130215185A1
公开(公告)日：2013-08-22
申请号：US13401061
申请日：2012-02-21
申请人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
发明人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
IPC分类号： B41J2/015 , B21D53/76
CPC分类号： B41J2/161 , B41J2/1634 , B41J2002/14403 , Y10T29/49401
摘要： A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
摘要翻译：用于组装诸如喷墨打印头的打印头的方法可以包括使用激光将两个或更多个打印头层粘合在一起。在一个实施例中，激光束被引导通过透明层到能量吸收层，其中能量吸收层被熔化，使得在去除激光束之后，熔融层固化以将能量吸收层粘附到透明层。在另一个实施例中，加热能量吸收层使透明层熔化，从而在除去激光束之后将能量吸收层粘附到透明层。所描述的激光透射层压方法可以产生流体密封，其在基于粘合剂的工艺上需要较少的处理时间和材料。

55. 发明授权

US08455271B2 Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads 有权
标题翻译：高度集成的晶片粘合MEMS器件，具有无释放膜制造用于高密度打印头
公开(公告)号：US08455271B2
公开(公告)日：2013-06-04
申请号：US11693209
申请日：2007-03-29
申请人： Peter J. Nystrom , Peter M. Gulvin , Paul W. Browne
发明人： Peter J. Nystrom , Peter M. Gulvin , Paul W. Browne
IPC分类号： H01L21/00 , B41J2/135
CPC分类号： B41J2/14314 , B41J2/16 , B41J2/1623 , B41J2/1629 , B41J2/1632 , B41J2/1639
摘要： A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.
摘要翻译：公开了制造MEMS喷墨型打印头的方法和所得到的装置。该方法包括提供驱动器部件并且单独地提供可致动的膜部件，可致动的膜部件在不存在去除牺牲层的酸蚀刻的情况下形成。单独提供的致动膜部件被结合到驱动器部件，并且在接合之后将喷嘴板附接到可致动膜部件。单独制造组件不需要先前为相对于驱动器部件形成可致动膜所需的牺牲层的氢氟酸蚀刻去除。

56. 发明申请

US20130120505A1 BONDED SILICON STRUCTURE FOR HIGH DENSITY PRINT HEAD 有权
标题翻译：用于高密度打印头的粘结硅结构
公开(公告)号：US20130120505A1
公开(公告)日：2013-05-16
申请号：US13293235
申请日：2011-11-10
申请人： Peter J. Nystrom , Bijoyraj Sahu
发明人： Peter J. Nystrom , Bijoyraj Sahu
IPC分类号： B41J2/045 , H01L21/306
CPC分类号： B41J2/1629 , B41J2/161 , B41J2/1631 , B41J2/1642 , B41J2/1646 , B41J2002/14241
摘要： A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.
摘要翻译：可以使用半导体器件制造技术形成包括喷射堆叠的打印头。可以在诸如半导体晶片或晶片部分的半导体衬底上形成覆盖金属层，覆盖层压电元件层和覆盖层导电层。压电元件层和覆盖层导电层可以被图案化以分别提供多个换能器压电元件和顶电极，而金属层形成用于多个换能器的底电极。随后，可以对半导体衬底进行图案化以形成用于打印头喷射叠层的主体板。使用半导体器件制造技术形成打印头喷射堆叠可以提供具有小特征尺寸的高分辨率设备。

57. 发明申请

US20130100212A1 Process for Adding Thermoset Layer to Piezoelectric Printhead 有权
标题翻译：将热固性层添加到压电打印头的工艺
公开(公告)号：US20130100212A1
公开(公告)日：2013-04-25
申请号：US13279778
申请日：2011-10-24
申请人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
发明人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
IPC分类号： B41J2/045 , B23P17/00
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634
摘要： Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.
摘要翻译：公开了一种用于制备喷墨打印头的方法，其包括：（a）提供具有多个压电换能器的隔膜板，（b）将具有填充接头的电路板与压电换能器对准并将电路板临时附接到压电换能器，从而形成在隔膜板，压电换能器和电路板之间具有间隙的层叠结构 ; （c）通过填充接头施加热固性聚合物并允许其通过毛细管作用填充间隙空间; 和（d）固化热固性聚合物以形成间隙聚合物层。

58. 发明申请

US20120274708A1 HIGH DENSITY ELECTRICAL INTERCONNECT FOR PRINTING DEVICES USING FLEX CIRCUITS AND DIELECTRIC UNDERFILL 有权
标题翻译：使用柔性电路和电介质印刷设备的高密度电气互连
公开(公告)号：US20120274708A1
公开(公告)日：2012-11-01
申请号：US13097182
申请日：2011-04-29
申请人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
发明人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
IPC分类号： B41J2/045 , H01L41/22
CPC分类号： B41J2/14233 , B41J2002/14491
摘要： A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.
摘要翻译：用于形成喷墨打印头的方法可以包括将多个压电元件附接到喷射堆叠子组件的隔膜，将柔性电路电连接到多个压电元件，然后在柔性电路和喷射之间分配电介质底部填充物堆栈子组件。在安装柔性电路之后使用底部填料消除了从压电元件的顶部图案化去除间隙材料的需要，并且消除了对图案化间隔层的要求。在一个实施例中，柔性电路和压电元件之间的电接触通过柔性电路的凸起电极与压电元件之间的物理接触来建立，而不使用单独的导体，从而消除了由于误插入引起的电气短路的可能性指挥

59. 发明授权

US08182069B2 Method for modular arrangement of a silicon based array and modular silicon based array 有权
标题翻译：硅基阵列和模块化硅基阵列的模块化布置方法
公开(公告)号：US08182069B2
公开(公告)日：2012-05-22
申请号：US13246170
申请日：2011-09-27
申请人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
发明人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要翻译：一种硅基模块，包括：基板; 第一芯片组件，其固定到所述基板，所述第一芯片组件包括第一硅芯片和具有电路的第一驱动器芯片; 以及固定到所述基板的第二芯片组件，所述第二芯片组件包括第二硅芯片和具有电路的第二驱动器芯片。第一和第二芯片组件的部分在基板的纵向方向上排列; 并且所述第一和第二硅芯片的部分在与所述纵向正交的宽度方向上排列。硅基模块的形成方法。

60. 发明授权

US08132892B2 Maintainable coplanar front face for silicon die array printhead 有权
标题翻译：用于硅芯片阵列打印头的可维护的共面正面
公开(公告)号：US08132892B2
公开(公告)日：2012-03-13
申请号：US12536196
申请日：2009-08-05
申请人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
发明人： Peter J. Nystrom , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译：提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。

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