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51. 发明授权

US4780527A Preparation of polyesters from terephthalic acid 失效
标题翻译：由对苯二甲酸制备聚酯
公开(公告)号：US4780527A
公开(公告)日：1988-10-25
申请号：US47421
申请日：1987-05-06
申请人： Shen-Nan Tong , Mei-Sui Chen , Wu-Bin Yuo , Nien-Hsi Chang
发明人： Shen-Nan Tong , Mei-Sui Chen , Wu-Bin Yuo , Nien-Hsi Chang
IPC分类号： C08G63/183 , C08G63/78 , C08G63/82 , C08G63/85 , C08G63/04
CPC分类号： C08G63/82 , C08G63/78
摘要： Poly(butylene terephthalate) is prepared in a two-stage process wherein terephthalic acid and 1,4-butanediol are esterified in the presence of a catalytic amount of a catalyst having an organo-metallic component which is an organo-titanate compound, an organo-tin compound or a combination thereof and a salt component which is an organic acid salt or an inorganic salt. In a second step, the esterification product is subject to polycondensation. By following the foregoing procedure, the formation of tetrahydrofuran is significantly suppressed and the percent conversion of esterification products increased.

52. 发明申请

US20120164918A1 Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity 审中-公开
标题翻译：化学机械抛光过程控制，提高晶片内厚度均匀性
公开(公告)号：US20120164918A1
公开(公告)日：2012-06-28
申请号：US13412260
申请日：2012-03-05
申请人： Shen-Nan Lee , Ying-Mei Lin , Yu-Jen Cheng , Keung Hui , Huan-Just Lin
发明人： Shen-Nan Lee , Ying-Mei Lin , Yu-Jen Cheng , Keung Hui , Huan-Just Lin
IPC分类号： H01L21/302 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of performing chemical mechanical polish (CMP) processes on a wafer includes providing the wafer; determining a thickness profile of a feature on a surface of the wafer; and, after the step of determining the thickness profile, performing a high-rate CMP process on the feature using a polish recipe to substantially achieve a within-wafer thickness uniformity of the feature. The polish recipe is determined based on the thickness profile.
摘要翻译：在晶片上进行化学机械抛光（CMP）工艺的方法包括提供晶片; 确定晶片表面上的特征的厚度分布; 并且在确定厚度分布的步骤之后，使用抛光配方对特征进行高速率CMP处理，以基本上实现特征的晶片内厚度均匀性。根据厚度分布确定抛光配方。

53. 发明授权

US07147178B2 Sequentially stripping-off type adhesive tape set 失效
标题翻译：连续剥离型胶带组
公开(公告)号：US07147178B2
公开(公告)日：2006-12-12
申请号：US10852177
申请日：2004-05-25
申请人： Shen-Nan Kan
发明人： Shen-Nan Kan
IPC分类号： B65H16/00
CPC分类号： B65H35/10 , Y10T428/28
摘要： A sequentially stripping-off type adhesive tape set comprising a sequentially stripping-off type adhesive tape in the form of a reel, a holding member and a seat; the adhesive tape has thereon many layers of adhesive tape pieces cut in strips wound on a hollow axle cylinder. When in cutting the layers of the adhesive tape, they are broken away at one side, and are left with short uncut connecting rims at the other side. When the sequentially stripping-off type adhesive tape is placed on the holding member, it needs only that the adhesive tape is rotated for a circle, the tearing areas on one side of the adhesive tape pieces can be brought out, then the user can tear the adhesive tape pieces in either of two ways until the whole roll of adhesive tape is all used.
摘要翻译：一种顺次剥离型粘合带组，包括卷轴，保持构件和座椅形式的顺序剥离型胶带; 粘合带上有许多层卷绕在空心轴筒上的胶带片。当切割粘合带的层时，它们在一侧被分解，并且在另一侧留下短的未切割的连接边缘。当顺序剥离型粘合带放置在保持构件上时，只需要使胶带旋转一圈，则可以将粘合带片一侧的撕裂区域带出，然后使用者可以撕裂以两种方式中的任一种粘合带片，直到全部使用胶带。

54. 发明申请

US20050274841A1 Sequentially stripping-off type adhesive tape set 失效
标题翻译：连续剥离型胶带组
公开(公告)号：US20050274841A1
公开(公告)日：2005-12-15
申请号：US10852177
申请日：2004-05-25
申请人： Shen-Nan Kan
发明人： Shen-Nan Kan
IPC分类号： B65H16/06 , B65H35/10
CPC分类号： B65H35/10 , Y10T428/28
摘要： A sequentially stripping-off type adhesive tape set comprising a sequentially stripping-off type adhesive tape in the form of a reel, a holding member and a seat; the adhesive tape has thereon many layers of adhesive tape pieces cut in strips wound on a hollow axle cylinder. When in cutting the layers of the adhesive tape, they are broken away at one side, and are left with short uncut connecting rims at the other side. When the sequentially stripping-off type adhesive tape is placed on the holding member, it needs only that the adhesive tape is rotated for a circle, the tearing areas on one side of the adhesive tape pieces can be brought out, then the user can tear the adhesive tape pieces in either of two ways until the whole roll of adhesive tape is all used.
摘要翻译：一种顺次剥离型粘合带组，包括卷轴，保持构件和座椅形式的顺序剥离型胶带; 粘合带上有许多层卷绕在空心轴筒上的胶带片。当切割粘合带的层时，它们在一侧被分解，并且在另一侧留下短的未切割的连接边缘。当顺序剥离型粘合带放置在保持构件上时，只需要使胶带旋转一圈，则可以将粘合带片一侧的撕裂区域带出，然后使用者可以撕裂以两种方式中的任一种粘合带片，直到全部使用胶带。

55. 发明授权

US4916167A Production of hybrid foam for sound absorption 失效
标题翻译：生产混合泡沫吸音
公开(公告)号：US4916167A
公开(公告)日：1990-04-10
申请号：US250896
申请日：1988-09-29
申请人： Jui-Hsiang Chen , Shih-Jung Tsai , Shen-Nan Tong , Peter T. K. Wu
发明人： Jui-Hsiang Chen , Shih-Jung Tsai , Shen-Nan Tong , Peter T. K. Wu
IPC分类号： C08G18/40 , C08G18/54
CPC分类号： C08G18/542 , C08G18/4027 , C08G2101/0025 , C08G2101/005 , C08G2350/00
摘要： Production of a lightweight, flame retardant, sound absorption composition in the form of a phenol-aldehyde/polyurethane hybrid polymer foam of open cell structure and interconnected continuous porous architecture, by reacting 100 parts by weight phenolic resin, such as a resole resin of an aldehyde and a phenol, e.g. formaldehyde and phenol, having an aldehyde to phenol mole ratio greater than about 1:1; about 50-300 parts by weight aromatic or aliphatic polyisocyanate; about 0-100 parts by weight aliphatic group containing polyol, e.g. a polyether, polyester, polycaprolactone or polybutadiene polyol; and about 0-100 parts by weight filler; in the presence of a catalyst, e.g. a basic and/or metal salt catalyst in an amount of about 0.01-2 parts by weight, and a blowing agent, especially with all reactants but the polyisocyanate being premixed and then combined with the polyisocyanate for reaction in an open mold, e.g. with the resole resin having a pH of about 4.5-9.5, a solid content of about 50-98%, and a viscosity of not greater than about 100,000 cps at 25.degree. C., and optionally with a surfactant being included in the premixed reactants.
摘要翻译：通过使100重量份酚醛树脂如酚醛树脂（例如甲基丙烯酸甲酯）的酚醛树脂反应，制备具有开孔结构和互连的连续多孔结构的酚醛/聚氨酯混合聚合物泡沫体形式的轻质阻燃吸声组合物醛和苯酚，例如甲醛和苯酚，醛与苯酚的摩尔比大于约1:1; 约50-300份（重量）芳族或脂族多异氰酸酯; 约0-100重量份的含脂肪族基团的多元醇，例如聚醚，聚酯，聚己内酯或聚丁二烯多元醇; 和约0-100重量份填料; 在催化剂存在下，例如，约0.01-2重量份的碱性和/或金属盐催化剂和发泡剂，特别是与所有反应物但是多异氰酸酯预混合的发泡剂，然后与多异氰酸酯在开放模具例如反应中反应。其中甲阶酚醛树脂的pH为约4.5-9.5，固体含量为约50-98％，粘度在25℃下不大于约100,000cps，并且任选地含有表面活性剂包括在预混合反应物。

56. 发明申请

US20200294821A1 POST CMP CLEANING APPARATUS AND POST CMP CLEANING METHODS 审中-公开
公开(公告)号：US20200294821A1
公开(公告)日：2020-09-17
申请号：US16353029
申请日：2019-03-14
申请人： Chen-Hao WU , Chu-An LEE , Chun-Hung LIAO , Shen-Nan LEE , Teng-Chun TSAI , Huang-Lin CHAO , Chih-Hung CHEN
发明人： Chen-Hao WU , Chu-An LEE , Chun-Hung LIAO , Shen-Nan LEE , Teng-Chun TSAI , Huang-Lin CHAO , Chih-Hung CHEN
IPC分类号： H01L21/67 , H01L21/687 , H01L21/02 , B08B3/02 , B08B3/04 , B08B3/10 , B08B1/00 , B08B3/08 , B08B1/02
摘要： A post CMP cleaning apparatus is provided. The post CMP cleaning apparatus includes a cleaning stage. The post CMP cleaning apparatus also includes a rotating platen disposed in the cleaning stage, and the rotating platen is configured to hold and rotate a semiconductor wafer. The post CMP cleaning apparatus further includes a vibrating device disposed over the rotating platen. The post CMP cleaning apparatus further includes a solution delivery module disposed near the vibrating device and configured to deliver a cleaning fluid to the semiconductor wafer. The vibrating device is configured to provide the cleaning fluid with a specific frequency which is at least greater than 100 MHz while the rotating platen is rotating the semiconductor wafer, so that particles on the semiconductor wafer are removed by the cleaning fluid.

57. 发明授权

US08153526B2 High planarizing method for use in a gate last process 有权
标题翻译：用于门最后工艺的高平面化方法
公开(公告)号：US08153526B2
公开(公告)日：2012-04-10
申请号：US12499439
申请日：2009-07-08
申请人： Shen-Nan Lee , Huan-Just Lin , Shih-Chang Chen
发明人： Shen-Nan Lee , Huan-Just Lin , Shih-Chang Chen
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： B24B37/042 , H01L21/28079 , H01L21/31053 , H01L21/3212 , H01L21/823807 , H01L21/823828 , H01L29/66545 , H01L29/7843
摘要： A method for performing a chemical-mechanical polishing (CMP) is provided. The method includes processing a semiconductor substrate to form a dummy gate structure on the substrate, to form a hard mask on the dummy gate structure, and to form a contact etch stop layer (CESL) and an interlayer dielectric (ILD) layer on the hard mask, performing a first CMP process with a first slurry to modify a non-planar topography of the ILD layer, performing a second CMP process with a second slurry to remove the hard mask, and performing a third CMP process with a third slurry to remove an interfacial layer that forms between the dummy gate and hard mask during semiconductor processing.
摘要翻译：提供了一种用于进行化学机械抛光（CMP）的方法。该方法包括处理半导体衬底以在衬底上形成虚拟栅极结构，以在虚拟栅极结构上形成硬掩模，并在硬的基底上形成接触蚀刻停止层（CESL）和层间电介质（ILD）层用第一浆料进行第一CMP处理以修饰ILD层的非平面形貌，用第二浆料进行第二CMP处理以除去硬掩模，以及用第三浆料进行第三CMP处理以除去在半导体处理期间在虚拟栅极和硬掩模之间形成的界面层。

58. 发明申请

US20090309106A1 LIGHT-EMITTING DEVICE MODULE WITH A SUBSTRATE AND METHODS OF FORMING IT 审中-公开
标题翻译：具有基板的发光器件模块及其形成方法
公开(公告)号：US20090309106A1
公开(公告)日：2009-12-17
申请号：US11916011
申请日：2006-05-22
申请人： Shen-Nan Tong
发明人： Shen-Nan Tong
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , G02B6/4232 , H01L25/0753 , H01L33/62 , H01L33/648 , H01L2224/48091 , H01L2924/00014
摘要： A light-emitting device module comprising a substrate, a light-emitting device chip and a heat-dissipating unit. The substrate has a cavity formed in the surface, has an insulator layer and metal layers, with layers of metal on the top and bottom surfaces. The light-emitting device chip is placed inside the cavity and is bonded onto the top metal layer of the substrate. The electrodes of the device chip are wired-bonded to electrodes formed on the top metal layer of the substrate. The cavity is filled with an encapsulating material to encapsulate the device chip. A heat-dissipating unit is bonded onto the bottom metal layer of the substrate.
摘要翻译：一种发光器件模块，包括衬底，发光器件芯片和散热单元。衬底在表面形成有空腔，具有绝缘体层和金属层，在顶部和底部表面具有金属层。发光器件芯片放置在腔内并结合到衬底的顶部金属层上。器件芯片的电极被布线接合到形成在衬底的顶部金属层上的电极。空腔填充有封装材料以封装器件芯片。散热单元结合到基板的底部金属层上。

59. 发明授权

US07407601B2 Polymeric particle slurry system and method to reduce feature sidewall erosion 有权
标题翻译：聚合物颗粒浆体系和减少壁面侵蚀的方法
公开(公告)号：US07407601B2
公开(公告)日：2008-08-05
申请号：US10423569
申请日：2003-04-24
申请人： Shen-Nan Lee , Ying-Ho Chen , Syun-Ming Jang , Tzu-Jen Chou
发明人： Shen-Nan Lee , Ying-Ho Chen , Syun-Ming Jang , Tzu-Jen Chou
IPC分类号： C09K5/00
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/3212
摘要： A slurry system for a chemical mechanical polishing (CMP) process and a method for using the same wherein the slurry system includes an aqueous dispersion comprising at least abrasive polymer containing particles in an alkaline solution having a pH of less than about 9.5; and wherein the method includes providing a semiconductor wafer process surface including a oxide containing material and metal filled semiconductor features; providing the system; and, polishing in a CMP process the semiconductor wafer process surface using the slurry system to remove at least a portion of the oxide containing material and the metal comprising the metal filled semiconductor features.
摘要翻译：用于化学机械抛光（CMP）方法的浆料系统及其使用方法，其中所述浆料系统包括含有至少含有在pH小于约9.5的碱性溶液中的含有颗粒的磨料聚合物的水分散体; 并且其中所述方法包括提供包括含氧化物材料和金属填充半导体特征的半导体晶片工艺表面; 提供系统; 并且在CMP工艺中使用浆料系统在半导体晶片工艺表面上抛光以去除含氧化物材料的至少一部分和包含金属填充的半导体特征的金属。

60. 发明申请

US20070092676A1 Peelable confidential security adhesive tape structure 审中-公开
标题翻译：剥皮机密安全胶带结构
公开(公告)号：US20070092676A1
公开(公告)日：2007-04-26
申请号：US11258239
申请日：2005-10-26
申请人： Shen-Nan Kan
发明人： Shen-Nan Kan
IPC分类号： B32B33/00
CPC分类号： G09F3/0292 , Y10T428/14 , Y10T428/2848
摘要： A peelable confidential security adhesive tape structure comprises an adhesive tape and a thrust runner for receiving said tape; wherein said thrust runner is provided with two opposite stoppers on the upper side of said thrust runner; wherein said tape contains a plurality of individual confidential security films, wherein each film has its bottom surface provided with an adhesive-free manual part, wherein manual parts on the adjacent upper and lower layers are stacked alternately over the front and rear. When the outermost film of the adhesive tape is peeled off upwardly from the manual part, the glue on the bottom surface of the film can pull the manual part of the underlying film upwardly and places the manual part on the stopper for lifting successively those underlying films. Further, when said film stuck on an object is peeled away, warning character or pattern can be displayed. Said peelable confidential security adhesive tape is useful as a confidential security adhesive tape and its individual films can be peeled successively.
摘要翻译：一种可剥离的机密安全胶带结构包括胶带和用于接收所述胶带的推力滑轮; 其中所述推力滑轮在所述推力滑轮的上侧设置有两个相对的止动件; 其中所述带包含多个单独的机密安全膜，其中每个胶片的底表面设置有无粘合剂的手动部件，其中相邻的上层和下层上的手动部件交替地堆叠在前后。当粘合带的最外面的胶片从手动部分向上剥离时，胶片底部的胶水可以向上拉动下面的胶片的手动部分，并将手动部件放在止动器上，以连续地提升下面的胶片。此外，当粘贴在物体上的所述胶片被剥离时，可以显示警告字符或图案。所述可剥离的机密安全胶带作为机密的安全胶带是有用的，并且其各个胶片可以相继剥离。

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