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51. 发明授权

US07915057B2 Manufacturing method of a tray, a socket for inspection, and a semiconductor device 有权
标题翻译：托盘的制造方法，检查用插座以及半导体装置
公开(公告)号：US07915057B2
公开(公告)日：2011-03-29
申请号：US12117341
申请日：2008-05-08
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L21/66
CPC分类号： G01R31/2867 , B65D2585/86 , H01L21/67333 , H01L21/6835 , H01L23/544 , H01L24/05 , H01L24/11 , H01L2221/68327 , H01L2221/68354 , H01L2224/02331 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/0401 , H01L2224/05562 , H01L2224/05644 , H01L2224/11849 , H01L2224/13022 , H01L2224/131 , H01L2224/14131 , H01L2224/94 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/00014 , H01L2224/11 , H01L2924/01014 , H01L2224/05552 , H01L2924/00
摘要： The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base for supporting a plurality of bumps of the wafer level CSP and side walls formed around the base. In the step-to-step carriage in the post-production process of the manufacture of wafer level CSPs and on like occasions, the base supports not the organic film but the plurality of solder bumps. For this reason, it is made possible to prevent the organic film from being flawed or coming off and adhering to the product as foreign matter, and as a result the quality and yield of the wafer level CSPs (semiconductor devices) can be improved.
摘要翻译：要提高半导体器件的产量。托盘设置有多个能够容纳晶片级CSP的凹部，并且每个凹部设置有用于支撑晶片级CSP的多个凸起的基部和围绕基部形成的侧壁。在制造晶片级CSP的后期制作过程中，在同样的场合下，基座不支持有机膜而是支持多个焊料凸点。因此，能够防止有机膜发生瑕疵或脱落，作为异物附着在产品上，结果可以提高晶片级CSP（半导体器件）的质量和产率。

52. 发明授权

US07847376B2 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US07847376B2
公开(公告)日：2010-12-07
申请号：US12176477
申请日：2008-07-21
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： H01L21/60
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/4952 , H01L23/49541 , H01L23/49551 , H01L23/49558 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/2919 , H01L2224/29339 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48647 , H01L2224/49052 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/78743 , H01L2224/83102 , H01L2224/83192 , H01L2224/8385 , H01L2224/85181 , H01L2224/85447 , H01L2224/92125 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/48465 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device of a multi-pin structure using a lead frame is provided. The semiconductor device comprises a tab having a chip supporting surface, the chip supporting surface whose dimension is smaller than a back surface of a semiconductor chip, a plurality of leads arranged around the tab, the semiconductor chip mounted over the chip supporting surface of the tab, a plurality of suspending leads for supporting the tab, four bar leads arranged outside the tab so as to surround the tab and coupled to the suspending leads, a plurality of wires for coupling between the semiconductor chip and the leads, and a sealing body for sealing the semiconductor chip and the wires with resin, with first slits being formed respectively in first coupling portions of the bar leads for coupling with the suspending leads.
摘要翻译：提供了使用引线框的多引脚结构的半导体器件。半导体器件包括具有芯片支撑表面的突片，尺寸小于半导体芯片的背面的芯片支撑表面，布置在突片周围的多个引线，安装在突片的芯片支撑表面上的半导体芯片，用于支撑突片的多个悬挂引线，布置在突片外部的四个引脚，以围绕突片并耦合到悬挂引线，用于在半导体芯片和引线之间耦合的多条引线，以及用于用树脂密封半导体芯片和电线，其中第一狭缝分别形成在条引线的第一耦合部分中，用于与悬挂引线耦合。

53. 发明申请

US20100132333A1 EXHAUST EMISSION CONTROL DEVICE 有权
标题翻译：排气排放控制装置
公开(公告)号：US20100132333A1
公开(公告)日：2010-06-03
申请号：US12529024
申请日：2008-03-13
申请人： Hiroshi Endo , Noriyuki Takahashi
发明人： Hiroshi Endo , Noriyuki Takahashi
IPC分类号： F02D43/00 , F01N3/035 , F01N3/10
CPC分类号： F01N3/2066 , B60K13/04 , F01N3/021 , F01N3/0253 , F01N3/035 , F01N3/106 , F01N13/009 , F01N13/08 , F01N2340/04 , F01N2590/08 , F01N2610/02 , Y02A50/2325 , Y02T10/24
摘要： The invention has its object to realize compact arrangement of particulate filter 5 and selective reduction catalyst 6 for improved mountability on a vehicle while a sufficient reaction time is ensured for generation of ammonia from urea water. In an exhaust emission control device with the filter 5 and the catalyst 6 capable of selectively reacting NOx with ammonia even in the presence of oxygen being incorporated in an exhaust pipe 4, urea water as reducing agent being addible therebetween, the filter 5 is arranged in a fore-and-aft direction of a vehicle and along a frame 10 of the vehicle. The catalyst 6 is arranged in a vicinity of an inlet end of the filter 5 and directed laterally outward of the vehicle. A communication passage 9 is arranged to guide the exhaust gas 3 discharged from an outlet end of the filter 5 to an inlet end of the catalyst 6 in a forwardly fold-back manner. A urea water adding injector 11 (urea water adding means) for addition of urea water is arranged midway of the passage 9.
摘要翻译：本发明的目的是实现颗粒过滤器5和选择还原催化剂6的紧凑布置，以改善车辆的安装性，同时确保从尿素水产生氨足够的反应时间。在具有过滤器5和催化剂6的排气排放控制装置中，即使在存在排气管4的氧的情况下，NOx也可以选择性地反应NOx，因此在其间可以添加作为还原剂的尿素水，过滤器5配置在车辆的前后方向和车辆的车架10。催化剂6布置在过滤器5的入口端附近并且横向向外指向车辆。连通通道9布置成将从过滤器5的出口排出的废气3以向前折回的方式引导到催化剂6的入口端。用于添加尿素水的尿素水添加喷射器11（尿素水添加装置）布置在通道9的中间。

54. 发明申请

US20100075343A1 NOVEL PEPTIDES 审中-公开
标题翻译：新款PEPTIDES
公开(公告)号：US20100075343A1
公开(公告)日：2010-03-25
申请号：US12524036
申请日：2007-11-29
申请人： Motoo Yamasaki , Noriyuki Takahashi , Naoto Minamino , Kazuki Sasaki , Toshifumi Takao , Yoshinori Satomi , Yoichi Ueta
发明人： Motoo Yamasaki , Noriyuki Takahashi , Naoto Minamino , Kazuki Sasaki , Toshifumi Takao , Yoshinori Satomi , Yoichi Ueta
IPC分类号： G01N33/53 , C07K14/00 , C07K7/06 , C07K7/08 , C07H21/00 , C12N15/63 , C12N5/00 , C12P21/00 , C07K16/00 , C12Q1/02
CPC分类号： C07K16/22 , A61K38/00 , C07K14/47 , G01N33/5008
摘要： The present invention provides novel peptides with energy-modulating activity or circulatory function-modulating activity. The peptides of the present invention have energy-modulating activity or circulatory function-modulating activity and thus are useful for treating food consumption disorders and diseases of the circulatory system.
摘要翻译：本发明提供具有能量调节活性或循环功能调节活性的新型肽。本发明的肽具有能量调节活性或循环功能调节活性，因此可用于治疗食物消耗障碍和循环系统的疾病。

55. 发明申请

US20090309213A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090309213A1
公开(公告)日：2009-12-17
申请号：US12481078
申请日：2009-06-09
申请人： Noriyuki TAKAHASHI , Mamoru SHISHIDO
发明人： Noriyuki TAKAHASHI , Mamoru SHISHIDO
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/4334 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/05554 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.
摘要翻译：半导体芯片安装在布线板的通孔内的散热片上，半导体芯片的电极和布线基板的连接端子通过接合线连接，形成密封树脂以覆盖半导体芯片和接合线和焊球形成在布线板的下表面上，从而构成半导体器件。散热器比布线板厚。散热器具有从散热片的侧面突出到外侧的突出部，突出部位于通孔外侧的布线基板的上表面，突出部的下表面与上部接线板表面。当制造半导体器件时，从布线板的上表面侧插入散热片。

56. 发明授权

US07615872B2 Semiconductor device 有权
公开(公告)号：US07615872B2
公开(公告)日：2009-11-10
申请号：US12314209
申请日：2008-12-05
申请人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani, legal representative , Kazuhiro Ichitani, legal representative , Sachiyo Ichitani, legal representative
发明人： Noriyuki Takahashi , Masahiro Ichitani
IPC分类号： H01L23/48 , H01L23/52 , H01L23/40
CPC分类号： H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

57. 发明申请

US20090091031A1 Semiconductor device 有权
公开(公告)号：US20090091031A1
公开(公告)日：2009-04-09
申请号：US12314209
申请日：2008-12-05
申请人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani , Kazuhiro Ichitani , Sachiyo Ichitani
发明人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani , Kazuhiro Ichitani , Sachiyo Ichitani
IPC分类号： H01L23/498
CPC分类号： H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

58. 发明申请

US20090087049A1 MEDICAL REPORTING SYSTEM, APPARATUS AND METHOD 有权
标题翻译：医疗报告系统，装置和方法
公开(公告)号：US20090087049A1
公开(公告)日：2009-04-02
申请号：US12212863
申请日：2008-09-18
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： G06K9/74
CPC分类号： G06F19/321 , A61B5/055 , A61B6/03 , A61B6/463 , A61B6/468 , G06F19/00 , G16H15/00
摘要： A medical reporting system includes a display panel for displaying plural CT images. A ROI setting unit designates a region of interest in the CT images. A group setting unit sets a group of specific CT images having the region of interest among the CT images, to generate group information of the group. A report editor displays a note area for inputting a note related to the specific CT images. A memory stores a text location of the note area assigned to the group information, and stores location information of the region of interest in the specific CT images. Furthermore, a first terminal device has the report editor, the ROI setting unit and the group setting unit. A second terminal device communicates with the first terminal device on line. A reporting display panel displays at least the specific CT images and the note.
摘要翻译：医疗报告系统包括用于显示多个CT图像的显示面板。 ROI设置单元指定CT图像中的感兴趣区域。组设定单元在CT图像之间设置具有感兴趣区域的一组特定CT图像，以生成组的组信息。报告编辑器显示用于输入与特定CT图像有关的音符的音符区域。存储器存储分配给组信息的笔记区域的文本位置，并将感兴趣区域的位置信息存储在特定CT图像中。此外，第一终端装置具有报告编辑器，ROI设置单元和组设置单元。第二终端设备在线上与第一终端设备通信。报告显示面板至少显示特定的CT图像和音符。

59. 发明授权

US07479705B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07479705B2
公开(公告)日：2009-01-20
申请号：US10927106
申请日：2004-08-27
申请人： Noriyuki Takahashi , Rumiko Ichitani, legal representative , Kazuhiro Ichitani, legal representative , Sachiyo Ichitani, legal representative
发明人： Masahiro Ichitani
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.
摘要翻译：一种半导体器件，包括：封装基板，其具有布置在其主表面的周边区域中的多个接合电极和连接到各个接合电极并无电镀的布线; 安装在所述封装基板上的半导体芯片; 连接半导体芯片的焊盘和接合电极的多根导线; 用于用树脂密封半导体芯片和电线的密封体; 以及布置在所述封装衬底上的多个焊球。布线仅形成在封装基板的主表面上的多个接合电极的内侧，并且在多个接合电极的外侧不形成阻焊膜。通过这种布置，可以最小化接合电极外部的区域，并且可以在不改变安装在其上的芯片的尺寸的情况下小型化半导体器件。

60. 发明申请

US20090007939A1 METHOD OF CLEANING STORAGE CASE 有权
标题翻译：清洁存储盒的方法
公开(公告)号：US20090007939A1
公开(公告)日：2009-01-08
申请号：US11839626
申请日：2007-08-16
申请人： Shu SHIMADA , Noriyuki TAKAHASHI , Hiroyuki NAKAJIMA , Hiroko TANAKA , Nobuyuki KANDA
发明人： Shu SHIMADA , Noriyuki TAKAHASHI , Hiroyuki NAKAJIMA , Hiroko TANAKA , Nobuyuki KANDA
IPC分类号： B08B5/00
CPC分类号： B08B7/0071 , G03F1/66 , G03F1/82
摘要： The present invention provides a method of cleaning a storage case to be used for storing or transporting mask substrates such as photomasks and photomask blanks, semiconductor substrates such as semiconductor wafers, pellicles, or the like. The present invention: facilitates a regular cleaning operation, can be used also for a storage case of a complicated shape, does not require a large scale equipment or an expensive equipment to facilitate an environmental countermeasure, and provides high cleaning effect. The method of cleaning a storage case polluted by adhesion of a foreign substance of an organic material, an ionic foreign substances or an ionic crystal foreign substance physically absorbed, comprises a step of placing the storage case still in air flow of cleaned air or an inert gas in a temperature range from room temperature to 80° C. for desorbing and removing the foreign substance adhered to the storage case.
摘要翻译：本发明提供了一种清洁用于存放或传送诸如光掩模和光掩模坯料的掩模基板，诸如半导体晶片，薄膜等半导体基板的存储盒的方法。本发明：便于定期的清洁操作，也可以用于复杂形状的储存盒，不需要大型设备或昂贵的设备来促进环境对策，并且提供高清洁效果。清洁被有机材料的异物，物理吸收的离子性异物或离子性异物的附着物污染的储存箱的方法包括将储存箱放置在清洁空气的空气流中或惰性气体的步骤气体在室温至80℃的温度范围内，用于解吸和除去粘附到储存盒的异物。

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