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    • 57. 发明授权
    • Recessed access device for a memory
    • 嵌入式存储设备
    • US08319280B2
    • 2012-11-27
    • US13231554
    • 2011-09-13
    • Kurt D. BeigelJigish D. TrivediKevin G. Duesman
    • Kurt D. BeigelJigish D. TrivediKevin G. Duesman
    • H01L29/66
    • H01L29/66621H01L27/10876
    • Semiconductor memory devices having recessed access devices are disclosed. In some embodiments, a method of forming the recessed access device includes forming a device recess in a substrate material that extends to a first depth in the substrate that includes a gate oxide layer in the recess. The device recess may be extended to a second depth that is greater that the first depth to form an extended portion of the device recess. A field oxide layer may be provided within an interior of the device recess that extends inwardly into the interior of the device recess and into the substrate. Active regions may be formed in the substrate that abut the field oxide layer, and a gate material may be deposited into the device recess.
    • 公开了具有凹陷接入装置的半导体存储器件。 在一些实施例中,形成凹陷进入装置的方法包括在衬底材料中形成器件凹部,该衬底材料延伸到衬底中的第一深度,该第一深度包括凹陷中的栅极氧化物层。 装置凹部可以延伸到大于第一深度的第二深度,以形成装置凹部的延伸部分。 场氧化物层可以设置在器件凹部的内部,其内部延伸到器件凹部的内部并进入衬底。 活性区域可以形成在衬底中,其邻接场氧化物层,并且栅极材料可以沉积到器件凹部中。
    • 58. 发明授权
    • Methods of implanting dopant into channel regions
    • 将掺杂剂注入通道区域的方法
    • US08273619B2
    • 2012-09-25
    • US12848662
    • 2010-08-02
    • Hongmei WangKurt D. BeigelFred D. FishburnRongsheng Yang
    • Hongmei WangKurt D. BeigelFred D. FishburnRongsheng Yang
    • H01L21/8238
    • H01L21/26513H01L21/324H01L21/823412H01L27/0811H01L27/088H01L29/66537H01L29/7833
    • The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.
    • 本发明包括同时形成两个晶体管器件的沟道区域植入物的方法,其中掩模用于阻挡相对于另一个器件之一的较大百分比的沟道区域位置。 本发明还涉及形成电容器结构的方法,其中第一电容器电极通过电介质材料与半导体衬底隔开,第二电容器电极包括半导体材料内的导电掺杂扩散区,电容器通道区位置为 在介电材料的下方并与导电掺杂的扩散区相邻。 形成注入掩模以仅覆盖电容器沟道区位置的第一部分并且留下未覆盖的电容器沟道区位置的第二部分。 当植入掩模就位时,掺杂剂被注入到电容器通道区域位置的未覆盖的第二部分中。
    • 60. 发明授权
    • Methods of implanting dopant into channel regions
    • 将掺杂剂注入通道区域的方法
    • US07767514B2
    • 2010-08-03
    • US11406863
    • 2006-04-18
    • Hongmei WangKurt D. BeigelFred D. FishburnRongsheng Yang
    • Hongmei WangKurt D. BeigelFred D. FishburnRongsheng Yang
    • H01L21/8238
    • H01L21/26513H01L21/324H01L21/823412H01L27/0811H01L27/088H01L29/66537H01L29/7833
    • The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of one of the devices relative to the other. The invention also pertains to methods of forming capacitor structures in which a first capacitor electrode is spaced from a semiconductor substrate by a dielectric material, a second capacitor electrode comprises a conductively-doped diffusion region within the semiconductor material, and a capacitor channel region location is beneath the dielectric material and adjacent the conductively-doped diffusion region. An implant mask is formed to cover only a first portion of the capacitor channel region location and to leave a second portion of the capacitor channel region location uncovered. While the implant mask is in place, dopant is implanted into the uncovered second portion of the capacitor channel region location.
    • 本发明包括同时形成两个晶体管器件的沟道区域植入物的方法,其中掩模用于阻挡相对于另一个器件之一的较大百分比的沟道区域位置。 本发明还涉及形成电容器结构的方法,其中第一电容器电极通过电介质材料与半导体衬底隔开,第二电容器电极包括半导体材料内的导电掺杂扩散区,电容器通道区位置为 在介电材料的下方并与导电掺杂的扩散区相邻。 形成注入掩模以仅覆盖电容器沟道区位置的第一部分并且留下未覆盖的电容器沟道区位置的第二部分。 当植入掩模就位时,掺杂剂被注入到电容器通道区域位置的未覆盖的第二部分中。