专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20080157398A1 Semiconductor device package having pseudo chips 审中-公开
标题翻译：具有伪芯片的半导体器件封装
公开(公告)号：US20080157398A1
公开(公告)日：2008-07-03
申请号：US11819193
申请日：2007-06-26
申请人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Chi-Chen Lee , Wen-Ping Yang
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/06 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2221/68345 , H01L2224/0401 , H01L2224/05553 , H01L2224/05599 , H01L2224/24 , H01L2224/24137 , H01L2224/24227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48157 , H01L2224/48227 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/01026 , H01L2924/00012
摘要： The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first bonding pads and a second die having second bonding pads disposed within the die receiving through holes, respectively; an adhesion material formed in the gap between the first and second die and sidewalls of the die receiving though holes of the first substrate; redistribution lines formed to couple the first contact pads formed on the first substrate to the first bonding pads and the second bonding pads, respectively; and a protection layer formed on the redistribution lines, the first die, the second die and the first substrate.
摘要翻译：本发明提供了一种具有伪芯片结构的半导体器件封装，包括：第一衬底，其具有形成在其上的通孔; 具有第一接合焊盘的第一管芯和分别设置在所述管芯内的第二接合焊盘的第二管芯，形成在所述第一和第二管芯之间的间隙中的粘合材料和所述第一基板的贯穿孔的所述管芯的侧壁; 再分配线被形成为分别将形成在第一基板上的第一接触焊盘耦合到第一接合焊盘和第二接合焊盘; 以及形成在再分配线上的保护层，第一管芯，第二管芯和第一基板。

52. 发明申请

US20080157396A1 Wafer level package with die receiving through-hole and method of the same 有权
标题翻译：晶圆级封装带芯片接收通孔及其方法
公开(公告)号：US20080157396A1
公开(公告)日：2008-07-03
申请号：US11648787
申请日：2007-01-03
申请人： Wen-Kun Yang
发明人： Wen-Kun Yang
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24155 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/15798 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2924/00
摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.
摘要翻译：本发明公开了一种包装体的结构，其特征在于，包括：具有模头的通孔的基板; 基底，其附接在所述基底的下表面上; 模具，设置在模具接收通孔内并附接在基座上; 形成在所述管芯和所述基板上的电介质层; 在所述电介质层上形成并耦合到所述管芯的再分布层（RDL）; 形成在RDL上的保护层; 以及形成在保护层上并耦合到RDL的多个焊盘。 RDL由包含Ti / Cu / Au合金或Ti / Cu / Ni / Au合金的合金制成。

53. 发明申请

US20080157312A1 Semiconductor image device package with die receiving through-hole and method of the same 有权
标题翻译：具有裸片接收通孔的半导体图像器件封装及其方法
公开(公告)号：US20080157312A1
公开(公告)日：2008-07-03
申请号：US11647217
申请日：2006-12-29
申请人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
发明人： Wen-Kun Yang , Jui-Hsien Chang , Tung-Chuan Wang
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/82 , H01L24/97 , H01L27/14627 , H01L27/14685 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2924/01019 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
摘要翻译：本发明公开了一种包装结构，包括：具有模具接收通孔的基板，连接通孔结构和第一接触垫; 具有设置在模具接收通孔内的微透镜区域的模具; 透明盖覆盖微透镜区域; 形成在模具下方并填充在模具和模具的侧壁之间的间隙中的周围材料; 形成在所述管芯和所述基板上的电介质层; 形成在电介质层上并耦合到第一接触焊盘的再分布层（RDL）; 形成在RDL上的保护层; 以及第二接触焊盘，其形成在所述基板的下表面和所述连接通孔结构的下方。

54. 发明申请

US20080105967A1 FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME 有权
标题翻译：风扇式水平包装结构及其方法
公开(公告)号：US20080105967A1
公开(公告)日：2008-05-08
申请号：US11946424
申请日：2007-11-28
申请人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
发明人： Wen-Kun Yang , Wen-Pin Yang , Shih-Li Chen
IPC分类号： H01L23/48
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/15788 , H01L2924/19041 , H01L2224/82 , H01L2924/00
摘要： To pick and place standard dice on a new base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dice with a side by side structure or a stacking structure.
摘要翻译：在新的基础上选择和放置标准骰子，以获得骰子之间适当和更宽的距离，而不是晶片上骰子的原始距离。包装结构具有比通过扇出型包装的模具尺寸更大的球阵列尺寸。此外，管芯可以与被动部件或其他具有并排结构或堆叠结构的管芯封装。

55. 发明申请

US20080020511A1 Structure of image sensor module and a method for manufacturing of wafer level package 审中-公开
公开(公告)号：US20080020511A1
公开(公告)日：2008-01-24
申请号：US11790717
申请日：2007-04-27
申请人： Wen-Kun Yang , Wen Pin Yang
发明人： Wen-Kun Yang , Wen Pin Yang
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/19 , H01L24/97 , H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L2224/05001 , H01L2224/05023 , H01L2224/05026 , H01L2224/05147 , H01L2224/05166 , H01L2224/05548 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/12105 , H01L2224/24137 , H01L2224/24226 , H01L2224/32145 , H01L2224/32245 , H01L2224/73267 , H01L2224/94 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/83 , H01L2224/82 , H01L2924/00014 , H01L2224/214
摘要： The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.

56. 发明授权

US07238602B2 Chip-size package structure and method of the same 有权
标题翻译：芯片尺寸的封装结构和方法相同
公开(公告)号：US07238602B2
公开(公告)日：2007-07-03
申请号：US10973557
申请日：2004-10-26
申请人： Wen Kun Yang
发明人： Wen Kun Yang
IPC分类号： H01L21/44
CPC分类号： H01L24/19 , H01L23/49816 , H01L23/5389 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2224/83 , H01L2224/82 , H01L2224/03
摘要： The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.
摘要翻译：该方法包括在基座上挑选和放置标准好的骰子以在骰子之间获得适当且更宽的距离，而不是晶片上的骰子的原始距离的步骤。芯片尺寸封装的方法包括以下步骤：将晶片上的骰子分离，并将骰子拾取并放置在基座上，并将基底上的第一材料层填充到基座上的骰子之间的空间中。具有第一开口的电介质层被图案化以暴露裸片的导电线的一部分。导电材料被填充到第一开口和电介质层上。随后，形成第二材料层以具有暴露导电材料的第二开口，然后将焊球焊接在第二开口上。

57. 发明授权

US07117122B2 Field maintenance tool 有权
标题翻译：现场维护工具
公开(公告)号：US07117122B2
公开(公告)日：2006-10-03
申请号：US11007876
申请日：2004-12-09
申请人： Martin Zielinski , Daniel E. Vande Vusse , Kun Yang , Alan R. Dewey , Alden C. Russell, III
发明人： Martin Zielinski , Daniel E. Vande Vusse , Kun Yang , Alan R. Dewey , Alden C. Russell, III
IPC分类号： G06F11/30
CPC分类号： G05B9/02 , G05B19/409 , G05B2219/24028 , G05B2219/34481 , G05B2219/36159
摘要： An improved field maintenance tool is provided. The tool is operable with process communication loops in accordance with a plurality of process industry standard protocols. Aspects of the invention include hardware features such as an infrared port; removable memory module; and an expansion memory module. Additional aspects of the invention include protocol-specific diagnostic methods executable with the improved field maintenance tool.
摘要翻译：提供了一个改进的现场维护工具。该工具可根据多个工艺工业标准协议与过程通信环路一起操作。本发明的方面包括诸如红外端口的硬件特征; 可移动存储模块; 和扩展存储器模块。本发明的另外的方面包括可通过改进的现场维护工具执行的特定于协议的诊断方法。

58. 发明申请

US20060105594A1 Method for package burn-in testing 审中-公开
标题翻译：封装老化测试方法
公开(公告)号：US20060105594A1
公开(公告)日：2006-05-18
申请号：US11318552
申请日：2005-12-28
申请人： Wen-Kun Yang
发明人： Wen-Kun Yang
IPC分类号： H05K1/00
CPC分类号： G01R31/2863 , G01R1/0483
摘要： The present invention discloses a contact method of burn-in and test after packaging. The method comprises providing a print circuit board. A solder join socket is engaged with a first fixed plate, the solder join socket with contact spring located in the solder join socket. An adhesive material is formed onto pads area of the print circuit board. The solder join socket is attached to the adhesive material. A second fixed plate is engaged with the first fixed plate and the solder join socket. A third fixed plate is inserted into the solder join socket following up the second fixed plate. A contact ball of a ball grid array (BGA) package is coupled with the contact spring for performing testing. Between the contact ball and the contact spring may keep an approximately constant pressure by utilizing the surface of the third fixed plate contacting with the surface of the ball grid array (BGA) package.
摘要翻译：本发明公开了包装后的老化和测试的接触方法。该方法包括提供打印电路板。焊接连接插座与第一固定板接合，焊料接合插座具有位于焊料连接插座中的接触弹簧。粘合剂材料形成在印刷电路板的焊盘区域上。焊接连接插座连接到粘合剂材料。第二固定板与第一固定板和焊料接合插座接合。将第三固定板插入跟随第二固定板的焊料接合插座中。球栅阵列（BGA）封装的接触球与接触弹簧耦合以进行测试。在接触球和接触弹簧之间可以通过利用与球栅阵列（BGA）封装的表面接触的第三固定板的表面来保持近似恒定的压力。

59. 发明申请

US20060000711A1 IN-SITU CORROSION CONTROLLING SYSTEM FOR CHEMICAL VESSELS OR TANKS 审中-公开
标题翻译：化工船舶或油罐的现场腐蚀控制系统
公开(公告)号：US20060000711A1
公开(公告)日：2006-01-05
申请号：US10907917
申请日：2005-04-20
申请人： Hung-Hsiang Lin , Kun-Yang Lin , Shun-Li Hong , Yuh-Lang Lee , Yu-Zen Shen
发明人： Hung-Hsiang Lin , Kun-Yang Lin , Shun-Li Hong , Yuh-Lang Lee , Yu-Zen Shen
IPC分类号： G01N27/26
CPC分类号： G01N27/205 , G01N17/00
摘要： An in-situ and real-time corrosion controlling system for chemical vessels, tanks or reactors is disclosed. The chemical vessels, tanks or reactors are employed to contain high-purity corrosive chemicals such as acids, alkaline liquids or the like. The controlling system encompasses a vessel including a conductive shell and insulating interior lining coated therein. A robust detection electrode is dipped into the chemical liquid contained by the vessel. The detection electrode is electrically connected to a measurement means such as an ohmmeter that is mounted outside the vessel. The measurement means is further electrically connected to the conductive shell. When the interior lining is pitted due to the chemical attack by the chemical liquid and the chemical liquid contacts the conductive shell, the measurement means promptly receives a corresponding signal. According to one preferred embodiment, the measurement means is further connected to a controller unit that can control a semiconductor-processing unit.
摘要翻译：公开了用于化学容器，罐或反应器的原位和实时腐蚀控制系统。使用化学容器，罐或反应器来容纳高纯度的腐蚀性化学物质，例如酸，碱性液体等。该控制系统包括一个容器，该容器包括导电壳体和涂覆在其中的绝缘内衬。将坚固的检测电极浸入容器所含的化学液体中。检测电极电连接到诸如安装在容器外部的欧姆计的测量装置。测量装置进一步电连接到导电外壳。当内衬由于化学液体的化学侵蚀而引起内部化学液体接触导电外壳时，测量装置会迅速接收相应的信号。根据一个优选实施例，测量装置还连接到可控制半导体处理单元的控制器单元。

60. 发明申请

US20050242418A1 Structure of package 有权
标题翻译：包装结构
公开(公告)号：US20050242418A1
公开(公告)日：2005-11-03
申请号：US10835571
申请日：2004-04-30
申请人： Wen-Kun Yang
发明人： Wen-Kun Yang
IPC分类号： H01L23/12 , H01L23/02 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/50 , H01L23/52
CPC分类号： H01L23/3114 , H01L23/3192 , H01L24/05 , H01L24/13 , H01L2224/02351 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/05548 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： The present invention discloses a structure of wafer level packaging. The structure comprises a first patterned isolation layer, a conductive layer and a second patterned isolation layer. The first patterned isolation layer is formed with a passivation layer of an IC (Integrated Circuit). The conductive layer is configured to have a curved or winding conductive pattern. The second patterned isolation layer is formed over the conductive layer to have a plurality of openings, and contact metal balls can be formed on the openings to electrically couple to a print circuit board.
摘要翻译：本发明公开了一种晶片级封装的结构。该结构包括第一图案化隔离层，导电层和第二图案化隔离层。第一图案化隔离层由IC（集成电路）的钝化层形成。导电层被配置为具有弯曲或绕组导电图案。第二图案化隔离层形成在导电层上方以具有多个开口，并且接触金属球可以形成在开口上以电耦合到印刷电路板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式