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    • 58. 发明申请
    • SPUTTERING APPARATUS
    • 溅射装置
    • US20140102890A1
    • 2014-04-17
    • US13782083
    • 2013-03-01
    • YoungJae JUNGHun Jung YIEun-Ju SONG
    • YoungJae JUNGHun Jung YIEun-Ju SONG
    • C23C14/34
    • C23C14/3407
    • A sputtering apparatus includes a substrate, a sputtering target disposed to face the substrate and formed of a sputtering material to be deposited on the substrate, wherein the sputtering target collides with an ionized gas particle and the sputtering material is separated from the sputtering target by the collision of the ionized gas particle with the sputtering target is deposited on the substrate, a supporter that supports a lower surface and a side surface of the sputtering target, and an insulating cover that covers an upper surface of the supporter supporting the side surface of the sputtering target. The insulating cover includes a plurality of recesses recessed downwardly from an upper surface of the insulating cover and a plurality of protrusions protruding upwardly between the recesses.
    • 溅射装置包括:基板,设置成面对基板并由溅射材料形成的溅射靶,沉积在基板上,其中溅射靶与电离气体粒子碰撞,溅射材料与溅射靶分离, 电离气体粒子与溅射靶的碰撞沉积在基板上,支撑溅射靶的下表面和侧面的支撑体以及覆盖支撑着支撑体的侧面的支撑体的上表面的绝缘盖 溅射靶。 绝缘盖包括从绝缘盖的上表面向下凹陷的多个凹部和在凹部之间向上突出的多个突起。