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51. 发明专利

JP2012156109A Conductive base paint for lithium ion battery 有权
标题翻译：用于锂离子电池的导电底漆
公开(公告)号：JP2012156109A
公开(公告)日：2012-08-16
申请号：JP2011016761
申请日：2011-01-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHIROHIGE MINORU
IPC分类号： H01M4/13 , C09D5/24 , C09D7/12 , C09D201/00 , H01M4/136 , H01M4/66
CPC分类号： Y02E60/122
摘要： PROBLEM TO BE SOLVED: To provide a conductive base paint which reduces contact resistance between a collector and an active material in an electrode for a lithium ion battery, contributes to improve adhesion between the collector and an active material containing layer, and ensures uniform coating with a thickness of 6 μm or less, and to provide an electrode for a lithium ion battery and a lithium ion battery.SOLUTION: A water-based conductive base paint forms a conductive base coat of an electrode for a lithium ion battery including a collector 30 and an active material. The conductive base paint contains thinned graphite 10 having a 50 mass% laser diffraction diameter (X) of 0.3-8 μm, a 50 mass% Stokes diameter (X) of 0.08-3.5 μm, and a thinning index (X/X) of 2.2-5.
摘要翻译：要解决的问题：为了提供降低锂离子电池用电极中的集电体与活性物质之间的接触电阻的导电性底漆，有助于提高集电体与活性物质含有层的粘附性，并且确保厚度为6μm以下的均匀涂布，并提供锂离子电池和锂离子电池用电极。解决方案：水性导电性底漆形成用于包含集电体30和活性物质的锂离子电池用电极的导电性基底涂层。导电性底漆含有0.3-8μm的50质量％的激光衍射直径（X 50dif ）的稀薄石墨10，50质量％的斯托克斯直径（X 50dif / X 50st ）的“POST”> 50st ）2.2-5。版权所有（C）2012，JPO＆INPIT

52. 发明专利

JP2012151118A Dielectric constant conditioner and resin composition 有权
标题翻译：介电常数调节剂和树脂组合物
公开(公告)号：JP2012151118A
公开(公告)日：2012-08-09
申请号：JP2012050126
申请日：2012-03-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MORITA KOJI , TAKANEZAWA SHIN , WATANABE TAKAKO , ASAKAWA YUSUKE
IPC分类号： H01B3/00 , C08K7/22 , C08K9/04 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a dielectric constant conditioner capable of achieving a desired dielectric constant and less in change of resin characteristics and reactivity, and to provide a resin composition including the dielectric constant conditioner.SOLUTION: In a dielectric constant conditioner, an organic material is first filled in a pore of a porous material at 1-99 vol.% of total pore capacity, then a resin for fixing the organic material is filled at 30-100 vol.% of the remaining capacity of the pore capacity. In the dielectric constant conditioner, a mixture in which an organic material and a resin for fixing the organic material are mixed is filled at 5-100 vol.% of the total pore capacity of the porous material. The resin composition includes 1-700 pts. mass of the dielectric constant conditioner dispersed in 100 pts. mass of a resin.
摘要翻译：要解决的问题：提供能够实现所需介电常数并且树脂特性和反应性变化小的介电常数调节剂，并提供包含介电常数调节剂的树脂组合物。解决方案：在介电常数调节剂中，有机材料首先以总容积的1-99体积％填充到多孔材料的孔中，然后将固定有机材料的树脂填充在30-100 剩余容量的孔容量的百分比％。在介电常数调节剂中，将有机材料和用于固定有机材料的树脂混合的混合物填充在多孔材料的总孔隙容量的5-100体积％。树脂组合物包括1-700个点。介电常数调节剂的质量分散在100分。树脂的质量。版权所有（C）2012，JPO＆INPIT

53. 发明专利

JP2012151087A Negative electrode material for lithium ion secondary battery, method for manufacturing the same, negative electrode for lithium ion secondary battery, and lithium ion secondary battery 有权
标题翻译：用于锂离子二次电池的负极电极材料，其制造方法，用于锂离子二次电池的负极和锂离子二次电池
公开(公告)号：JP2012151087A
公开(公告)日：2012-08-09
申请号：JP2011208195
申请日：2011-09-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTADO KATSUNORI , SUMIYA KEIJI , ISHII YOSHITO
IPC分类号： H01M4/587 , H01M4/36
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide a negative electrode material for a lithium ion secondary battery enabling high density and excellent in electrolyte permeability.SOLUTION: A negative electrode material for a lithium ion secondary battery contains a carbon particle mixture made of at least two kinds of carbon particle groups having different average fracture strengths. Selected from all the carbon particle groups before mixing to constitute the carbon particle mixture, a first carbon particle group has the lowest average fracture strength and a second carbon particle group has the highest average fracture strength. The ratio of the average fracture strength of the second carbon particle group to that of the first carbon particle group is in the range of 1.5 to 50.
摘要翻译：解决的问题：提供一种能够实现高密度和优异的电解质渗透性的锂离子二次电池用负极材料。解决方案：用于锂离子二次电池的负极材料包含由至少两种平均断裂强度不同的碳粒子组成的碳粒子混合物。从混合前的全部碳粒子群中选择构成碳粒子混合物，第一碳粒子群具有最低的平均断裂强度，第二碳粒子组具有最高的平均断裂强度。第二碳粒子群的平均断裂强度与第一碳粒子群的平均断裂强度的比例在1.5〜50的范围内。版权所有（C）2012，JPO＆INPIT

54. 发明专利

JP2012146988A Circuit connection material, connection structure and manufacturing method therefor 有权
标题翻译：电路连接材料，连接结构及其制造方法
公开(公告)号：JP2012146988A
公开(公告)日：2012-08-02
申请号：JP2012029822
申请日：2012-02-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAKAZAWA TAKASHI , ARIFUKU MASAHIRO , KOJIMA KAZUYOSHI , MOCHIZUKI AKIOMI
IPC分类号： H05K1/14 , C09J4/00 , C09J11/06 , C09J201/00 , H01B1/22 , H01L21/60 , H05K3/32
CPC分类号： H05K3/323 , H01B1/22 , H01B1/24 , H01L24/29 , H01L24/83 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/16 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/8388 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/361 , H05K2203/122 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： PROBLEM TO BE SOLVED: To provide a circuit connection material which can be cured in a short time under low temperature, and exhibits excellent storage stability.SOLUTION: A circuit connection material is used for connecting a first circuit member, where a first circuit electrode is formed on the principal surface of a first substrate, and a second circuit member, where a second circuit electrode is formed on the principal surface of a second substrate, in a state where the first circuit electrode and the second circuit electrode are placed to face each other. The circuit connection material contains a hardener generating free radicals, a radical polymerization material, and a thiol group level 2, where the molecular weight of a compound having a thiol group level 2 is 400 or more and less than 2000.
摘要翻译：要解决的问题：提供一种可以在短时间内在低温下固化的电路连接材料，并且表现出优异的储存稳定性。解决方案：电路连接材料用于连接第一电路部件，其中在第一基板的主表面上形成第一电路电极和第二电路部件，其中在主体上形成第二电路电极在第一电路电极和第二电路电极相对配置的状态下的第二基板的表面。电路连接材料包含产生自由基，自由基聚合材料和巯基等级2的固化剂，其中硫醇基2级的化合物的分子量为400以上且小于2000。权利要求：（C）2012，JPO＆INPIT

55. 发明专利

JP2012146976A Polishing solution and substrate polishing method using polishing solution 审中-公开
标题翻译：抛光溶液和抛光方法使用抛光溶液
公开(公告)号：JP2012146976A
公开(公告)日：2012-08-02
申请号：JP2011282060
申请日：2011-12-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YOSHIKAWA SHIGERU , TANAKA TAKAAKI , TAKIZAWA TOSHIO , OTA MUNEHIRO , MATSUMOTO TAKAAKI , YOSHIKAWA TAKAHIRO , SHINODA TAKASHI
IPC分类号： H01L21/304 , B24B37/00 , C09K3/14
CPC分类号： H01L21/31055 , B24B37/044 , C09G1/02 , C09K3/1463 , H01L21/30625 , H01L21/31053
摘要： PROBLEM TO BE SOLVED: To provide a polishing solution which can improve a polishing speed of a film to be polished and improve surface flatness after polishing in a CMP technology for flattening an interlayer insulation film and the film to be polished such as a BPSG film, an STI film, and the like.SOLUTION: A polishing solution for CMP contains a cerium oxide particle, a malic acid, a high-molecular compound B having a carboxylic acid group or carboxylate salt group, and water. A content of the malic acid is 0.001-1 wt% of total mass of the polishing solution. A content of the high-molecular compound B is 0.01-0.50 wt% of total mass of the polishing solution and pH is 4.0 or more and 7.0 or less.
摘要翻译：解决的问题：提供一种可以提高抛光膜的抛光速度的抛光溶液，并且在用于平坦化层间绝缘膜和待抛光的膜的CMP技术中提高抛光后的表面平整度，例如 BPSG膜，STI膜等。解决方案：用于CMP的抛光溶液含有氧化铈颗粒，苹果酸，具有羧酸基或羧酸盐基的高分子化合物B和水。苹果酸的含量为抛光液总质量的0.001-1重量％。高分子化合物B的含量为研磨液的总质量的0.01-0.50重量％，pH为4.0以上且7.0以下。版权所有（C）2012，JPO＆INPIT

56. 发明专利

JP2012146975A Polishing solution and substrate polishing method using polishing solution 审中-公开
标题翻译：抛光溶液和抛光方法使用抛光溶液
公开(公告)号：JP2012146975A
公开(公告)日：2012-08-02
申请号：JP2011282055
申请日：2011-12-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKIZAWA TOSHIO , SHINODA TAKASHI , OTA MUNEHIRO , YOSHIKAWA SHIGERU , TANAKA TAKAAKI , YOSHIKAWA TAKAHIRO , MATSUMOTO TAKAAKI
IPC分类号： H01L21/304 , B24B37/00 , C09K3/14
CPC分类号： H01L21/31055 , B24B37/044 , C09G1/02 , C09K3/1463 , H01L21/30625 , H01L21/31053
摘要： PROBLEM TO BE SOLVED: To provide a polishing solution which can improve a polishing speed of a film to be polished and improve surface flatness after polishing in a CMP technology for flattening an interlayer insulation film and the film to be polished such as a BPSG film, an STI film, and the like.SOLUTION: A polishing solution for CMP contains a cerium oxide particle, a maleic acid, a high-molecular compound B having a carboxylic acid group or carboxylate salt group, and water. A content of the maleic acid is 0.001-1 wt% of total mass of the polishing solution. A content of the high-molecular compound B is 0.01-0.50 wt% of total mass of the polishing solution and pH is 4.0 or more and 7.0 or less.
摘要翻译：解决的问题：提供一种可以提高抛光膜的抛光速度的抛光溶液，并且在用于平坦化层间绝缘膜和待抛光的膜的CMP技术中提高抛光后的表面平坦度，例如 BPSG膜，STI膜等。解决方案：用于CMP的抛光溶液含有氧化铈颗粒，马来酸，具有羧酸基或羧酸盐基的高分子化合物B和水。马来酸的含量为抛光液总质量的0.001-1重量％。高分子化合物B的含量为研磨液的总质量的0.01-0.50重量％，pH为4.0以上且7.0以下。版权所有（C）2012，JPO＆INPIT

57. 发明专利

JP2012145581A Method for manufacturing support unit for microfluid system 审中-公开
标题翻译：用于制造微流控系统的支持单元的方法
公开(公告)号：JP2012145581A
公开(公告)日：2012-08-02
申请号：JP2012006146
申请日：2012-01-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： AKAI KUNIHIKO , KAWAZOE HIROSHI , HOSOYA KEN
IPC分类号： G01N30/88 , B01J19/00 , B81C99/00 , G01N30/60 , G01N35/08 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing support units for microfluid system which does not restrict number of steps or quantity of reaction or analysis, and which are manufactured easily.SOLUTION: A method for manufacturing support units for microfluid system comprises at least: a process (1) for fixing at least one hollow filament into an arbitrary shape to a first support body; a process (2) for filling a monolithic precursor in the whole or a part of an inside of the hollow filament; and a process (3) for bringing the whole or a part of the monolithic precursor into reaction to prepare monolithic structure.
摘要翻译：要解决的问题：提供一种制造微流体系统的支撑单元的方法，该方法不限制步骤数量或反应或分析的数量，并且易于制造。解决方案：一种用于制造用于微流体系统的支撑单元的方法至少包括：用于将至少一个中空细丝固定成任意形状的方法（1）到第一支撑体; 用于在中空丝的内部的整个或一部分中填充整体式前体的方法（2）; 以及使全部或一部分整体式前体进行反应以制备整体结构的方法（3）。版权所有（C）2012，JPO＆INPIT

58. 发明专利

JP2012138610A Thermosetting resin composition for light reflection, and optical semiconductor element mounting substrate using the same, optical semiconductor device, and method of manufacturing those 有权
标题翻译：用于光反射的热固化树脂组合物和使用其的光学半导体元件安装基板，光学半导体器件及其制造方法
公开(公告)号：JP2012138610A
公开(公告)日：2012-07-19
申请号：JP2012060714
申请日：2012-03-16
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTANI ISATO , URASAKI NAOYUKI , YUASA KANAKO , NAGAI AKIRA , HAMADA MITSUYOSHI
IPC分类号： H01L33/60 , C08G59/42 , C08L63/00 , H01L21/56 , H01L23/08 , H01L23/28 , H01L33/50 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection having a high reflectance ratio from visible light to near-ultraviolet light and an excellent thermal deterioration resistance and an excellent tablet molding property after setting, and by which burrs are less likely generated in transfer molding, and to provide an optical semiconductor element mounting substrate using the resin composition, an optical semiconductor device, and a method of manufacturing those.SOLUTION: A thermosetting resin composition for light reflection is provided that contains (A) epoxy resin, (B) a hardener, (C) a hardening accelerator, (D) an inorganic filler, (E) white pigment, and (F) a coupling agent. A length of burrs generated when transfer molding is performed under a condition in which a molding temperature is 100-200°C, a molding pressure is 20 MPa or less, and a period is 60-120 seconds, is 5 mm or less, and a light reflectance ratio for 350-800 nm of wavelength after thermosetting is 80% or more. An optical semiconductor element mounting substrate using the resin composition, an optical semiconductor device, and a method of manufacturing those, are also provided.
摘要翻译：要解决的问题：提供一种具有从可见光到近紫外光的高反射率的光反射用热固性树脂组合物，并且具有优异的耐热劣化性和在凝固后具有优异的压片成型性，并且毛刺是在传递模塑中产生的可能性较小，并且使用该树脂组合物提供光学半导体元件安装基板，光学半导体器件及其制造方法。解决方案：提供一种用于光反射的热固性树脂组合物，其包含（A）环氧树脂，（B）硬化剂，（C）硬化促进剂，（D）无机填料，（E）白色颜料和（ F）偶联剂。在成型温度为100-200℃，成型压力为20MPa以下，周期为60〜120秒的条件下进行传递成型时产生的毛刺长度为5mm以下，热固化后的350-800nm的光反射率为80％以上。还提供了使用该树脂组合物的光半导体元件安装基板，光半导体器件及其制造方法。版权所有（C）2012，JPO＆INPIT

59. 发明专利

JP2012134204A Method for manufacturing led package 有权
标题翻译：制造LED封装的方法
公开(公告)号：JP2012134204A
公开(公告)日：2012-07-12
申请号：JP2010282705
申请日：2010-12-20
申请人： Hitachi Chem Co Ltd , Kyushu Institute Of Technology , 国立大学法人九州工業大学 , 日立化成工業株式会社
发明人： ISHIHARA MASAMICHI , TOYOSHIMA TSUTOMU , SUGIMURA YUKINOBU , NAKAMURA KUNIHIKO , YOKOZAWA SHUNYA , MATSUURA YOSHITSUGU
IPC分类号： H01L33/48
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To improve a thermal characteristic of an LED package and form a reflective surface capable of exhibiting reflective performance at low costs.SOLUTION: An LED package substrate is a laminated body in which metal foils are bonded each other on a flat metal plate with an insulating layer sandwiched therebetween and consisting of polyimide or polyamide-imide resin layer. In the metal foil, a pair of wiring enlarged parts insulated each other by a slit, a pair of external electrode connection parts, and a wiring part to interconnect therebetween are integrally formed, and the wiring enlarged part having a width in the slit direction being larger than that of the wiring part is configured that its width is wider than the length of the long side of an LED chip. A top part of the wiring enlarged part is subjected to a metallic surface treatment acting as a reflective member. Connection electrodes are connected to each of wiring enlarged parts by mounting LED chips. A transparent resin is filled so as to contain at least LED chips and their electrode connection parts.
摘要翻译：要解决的问题：为了提高LED封装的热特性并形成能够以低成本呈现反射性能的反射表面。解决方案：LED封装基板是层压体，其中金属箔彼此粘合在平坦的金属板上，绝缘层夹在其间并由聚酰亚胺或聚酰胺酰亚胺树脂层组成。在金属箔中，通过狭缝彼此绝缘的一对布线扩大部分，一对外部电极连接部分和互连的布线部分被一体地形成，并且沿狭缝方向具有宽度的布线扩大部分是大于布线部分的宽度被构造成其宽度比LED芯片的长边的长度宽。布线扩大部分的顶部经受用作反射构件的金属表面处理。连接电极通过安装LED芯片连接到每个布线扩大部分。填充透明树脂以便至少包含LED芯片及其电极连接部件。版权所有（C）2012，JPO＆INPIT

60. 发明专利

JP2012129302A Manufacturing method of component for semiconductor device and manufacturing method of the semiconductor device 审中-公开
标题翻译：半导体器件的元件制造方法及半导体器件的制造方法
公开(公告)号：JP2012129302A
公开(公告)日：2012-07-05
申请号：JP2010278087
申请日：2010-12-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KIMURA KOICHI , FUJII SHINJIRO
IPC分类号： H01L27/14 , H01L23/02 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of components for a semiconductor device which suppresses contamination in a semiconductor element region, and to provide a manufacturing method of the semiconductor device.SOLUTION: A manufacturing method of components for a semiconductor device 10 of this invention includes: an adhesive layer formation process in which a photosensitive adhesive layer 2 is formed on a light transmissive substrate 1; a patterning process in which an adhesive pattern 2A having multiple hollow parts H in which semiconductor element regions C are housed is formed by exposing and developing the photosensitive adhesive layer 2; and a chip process in which multiple light transmissive chips 1B, each of which forms an adhesive parts 2B having the hollow part H, are formed.
摘要翻译：解决的问题：提供抑制半导体元件区域中的污染的半导体器件的部件的制造方法，并提供半导体器件的制造方法。解决方案：本发明的半导体器件10的部件的制造方法包括：在透光性基板1上形成感光性粘接层2的粘合剂层形成工序; 通过曝光和显影感光性粘接剂层2，形成具有容纳半导体元件区域C的多个中空部分H的粘合剂图案2A的图案化工序; 以及形成有形成具有中空部H的粘接部2B的多个透光性芯片1B的芯片工序。版权所有（C）2012，JPO＆INPIT

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