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    • 52. 发明申请
    • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    • 印刷电路板及其制造方法
    • US20120048603A1
    • 2012-03-01
    • US13117159
    • 2011-05-27
    • FENG-YAN HUANG
    • FENG-YAN HUANG
    • H05K1/09H05K3/10H05K1/11
    • H05K1/0259H05K1/0218H05K3/281H05K3/323H05K2201/029H05K2201/0715
    • A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth structure comprises an anisotropic conductive adhesive connected to the connecting pad, an insulating layer, and a metallic deposition layer arranged between the anisotropic conductive adhesive and the insulating layer. The shielding structure comprises a shielding metal layer, an adhesive matrix, and a number of electrically conductive particles electrically connected to the shielding metal layer. The insulating layer defines a number of through holes corresponding to the particles, the particles is arranged in the through holes respectively and electrically connected the metallic deposition layer and the shielding metal layer. A method for manufacturing the above PCB is also provided.
    • 印刷电路板包括电路基板,导电布结构和屏蔽结构。 电路基板包括形成在接地电路层上的基极层,接地电路层和连接焊盘。 布结构包括连接到连接垫的各向异性导电粘合剂,绝缘层和布置在各向异性导电粘合剂和绝缘层之间的金属沉积层。 屏蔽结构包括屏蔽金属层,粘合剂基质和电连接到屏蔽金属层的多个导电颗粒。 绝缘层限定了与颗粒相对应的多个通孔,颗粒分别布置在通孔中并电连接金属沉积层和屏蔽金属层。 还提供了制造上述PCB的方法。