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51. 发明授权

US07407821B2 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US07407821B2
公开(公告)日：2008-08-05
申请号：US10874245
申请日：2004-06-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
IPC分类号： H01L21/66
CPC分类号： H01L21/76849 , C23C18/1608 , C23C18/1675 , C23C18/1692 , C23C18/1879 , H01L21/288 , H01L21/76864 , H01L21/76874 , H01L22/12 , H01L22/20 , H01L2223/54466
摘要： There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate having a metal and an insulating material exposed on its surface in such a manner that a film thickness of the metal, with an exposed surface of the metal as a reference plane, is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal during and/or immediately after processing, and monitoring processing and adjusting processing conditions based on results of this measurement.
摘要翻译：提供了可以根据需要测量和监测在基板上形成的膜的厚度和/或性能的基板处理方法和装置，并且可以快速地校正工艺条件的偏差，因此可以稳定地提供恒定品质的产品。一种基板处理方法，用于处理具有金属和绝缘材料的基板，所述基板以其金属的暴露表面作为基准面的方式选择性地或优先地改变的金属的膜厚度包括测量处理期间和/或紧随其后的金属的膜厚度和/或膜性质的变化，以及基于该测量结果的监测处理和调整处理条件。

52. 发明授权

US06855566B2 Optical semiconductor module and method of producing the same 失效
标题翻译：光半导体模块及其制造方法
公开(公告)号：US06855566B2
公开(公告)日：2005-02-15
申请号：US10381460
申请日：2002-04-06
申请人： Nobuyoshi Tatoh , Daisuke Takagi , Shinya Nishina
发明人： Nobuyoshi Tatoh , Daisuke Takagi , Shinya Nishina
IPC分类号： H01L23/38 , H01L35/32 , H01S5/022 , H01S5/024 , H01L21/00
CPC分类号： H01S5/02415 , H01L23/38 , H01L35/32 , H01L2924/0002 , H01S5/02208 , H01L2924/00
摘要： An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 includes two or more units of electronic cooling element 16 mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts 14a of ceramic feedthrough of the package 11 and a bottom plate 13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package 11 occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.
摘要翻译：即使封装的底板的面积相同，也可以设置具有大的吸热量的电子冷却元件的光学半导体模块。包装11包括安装在其中的两个或更多个电子冷却元件16。电子冷却元件的每个单元通过包装11的陶瓷馈通件的内凸起14a和底板13之间的空间插入并固定到底板。多个单元的电子冷却元件通过一个或多个铜片串联连接。电子冷却元件的两个或多个单元与封装11的底板区域之间的接合面积占底板面积的75％以上。因此，可以增加底板和电子冷却元件之间的整体面积与封装底板的面积的比率。

53. 发明申请

US20050009213A1 Substrate processing method and apparatus 有权
标题翻译：基板加工方法及装置
公开(公告)号：US20050009213A1
公开(公告)日：2005-01-13
申请号：US10874245
申请日：2004-06-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Akira Fukunaga
IPC分类号： G01B21/08 , C23C18/16 , C23C18/31 , C23F1/08 , H01L21/288 , H01L21/3205 , H01L21/66 , H01L21/768 , H01L21/00
CPC分类号： H01L21/76849 , C23C18/1608 , C23C18/1675 , C23C18/1692 , C23C18/1879 , H01L21/288 , H01L21/76864 , H01L21/76874 , H01L22/12 , H01L22/20 , H01L2223/54466
摘要： There is provided a substrate processing method and apparatus which can measure and monitor the thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in the process conditions, and which can therefore stably provide a product of constant quality. A substrate processing method for processing a substrate with a metal and an insulating material exposed on its surface in such a manner that the film thickness of the metal portion with the exposed surface of the metal as a reference plane is selectively or preferentially changed, including measuring a change in the film thickness and/or a film property of the metal portion during and/or immediately after processing, and monitoring the processing and adjusting the processing conditions based on the results of measurement.
摘要翻译：提供了可以根据需要测量和监测在基板上形成的膜的厚度和/或性能的基板处理方法和装置，并且可以快速校正工艺条件的偏差，因此可以稳定地提供恒定的产品质量。一种基板处理方法，用于以金属的暴露表面作为基准面的金属部分的膜厚选择性地或优先地改变的方式处理具有金属和绝缘材料的基板，该金属和绝缘材料暴露在其表面上，包括测量在处理期间和/或紧随其后的金属部分的膜厚度和/或膜特性的变化，并且基于测量结果监视处理和调整处理条件。

54. 发明申请

US20210277345A1 CELL-CONTAINING CONTAINER, METHOD FOR EVALUATING TEST SUBSTANCE, AND METHOD FOR MANUFACTURING CELL-CONTAINING CONTAINER 有权
公开(公告)号：US20210277345A1
公开(公告)日：2021-09-09
申请号：US17190487
申请日：2021-03-03
申请人： Tomoyuki ARATANI , Daisuke TAKAGI , Hidekazu YAGINUMA , Waka LIN , Shinnosuke KOSHIZUKA , Ryuya MASHIKO , Tomoaki NAKAYAMA , Atsushi MIYAOKA , Takeru SUZUKI , Minoru KO
发明人： Tomoyuki ARATANI , Daisuke TAKAGI , Hidekazu YAGINUMA , Waka LIN , Shinnosuke KOSHIZUKA , Ryuya MASHIKO , Tomoaki NAKAYAMA , Atsushi MIYAOKA , Takeru SUZUKI , Minoru KO
IPC分类号： C12M1/12 , C12M1/32 , C12N5/074
摘要： A cell-containing container includes at least one recessed part accommodating cells, in which the cells adhere to a bottom surface of the recessed part, and a cell density in a first region of the bottom surface is 250 to 20,000 cells/mm2, and a cell density in a second region surrounding a periphery of the first region is less than 250 cells/mm2.

55. 发明授权

US11097544B2 Liquid discharging head and liquid discharging apparatus 有权
公开(公告)号：US11097544B2
公开(公告)日：2021-08-24
申请号：US16672572
申请日：2019-11-04
申请人： Koichi Muramatsu , Takahiko Matsumoto , Shinnosuke Koshizuka , Satoshi Okano , Satoshi Nakazawa , Yuzuru Kuramochi , Ryuya Mashiko , Takeshi Akai , Daisuke Takagi , Tomoaki Nakayama , Hidekazu Yaginuma , Hiroshi Fujie , Manabu Yamanaka
发明人： Koichi Muramatsu , Takahiko Matsumoto , Shinnosuke Koshizuka , Satoshi Okano , Satoshi Nakazawa , Yuzuru Kuramochi , Ryuya Mashiko , Takeshi Akai , Daisuke Takagi , Tomoaki Nakayama , Hidekazu Yaginuma , Hiroshi Fujie , Manabu Yamanaka
IPC分类号： B41J2/14
摘要： Provided is a liquid discharging head including: a membranous member including a discharging port through which a liquid is discharged; and a displacement member disposed at membranous member's one side at which the liquid to be discharged through the discharging port is provided and configured to displace a position of the membranous member to cause the liquid to be discharged through the discharging port.

56. 发明申请

US20190232661A1 LIQUID DROPLET DISCHARGING UNIT, LIQUID DROPLET FORMING DEVICE, AND STIRRING DEVICE 审中-公开
公开(公告)号：US20190232661A1
公开(公告)日：2019-08-01
申请号：US16238570
申请日：2019-01-03
申请人： Takeshi AKAI , Hiroshi Fujie , Keisuke Sugiyama , Daisuke Takagi , Hiroki Somada , Manabu Yamanaka
发明人： Takeshi AKAI , Hiroshi Fujie , Keisuke Sugiyama , Daisuke Takagi , Hiroki Somada , Manabu Yamanaka
IPC分类号： B41J2/165 , B41J2/18
CPC分类号： B41J2/1652 , B01F11/0074 , B05B15/20 , B41J2/175 , B41J2/17596 , B41J2/18 , B41J2/195 , B41J2002/14435 , B41J2202/15 , C12M1/00 , C12M33/00
摘要： Provided is a liquid droplet discharging unit including a liquid droplet discharging port, a liquid retaining section including the liquid droplet discharging port, two tubes disposed in communication with the liquid retaining section, and first and second liquid sucking/ejecting members coupled to the two tubes respectively, wherein while the first liquid sucking/ejecting member is in a sucking or ejecting state, the second liquid sucking/ejecting member is in a non-sucking or non-ejecting state correspondingly.

57. 发明申请

US20140375725A1 LIQUID EJECTION HEAD, AND IMAGE FORMING APPARATUS USING THE LIQUID EJECTION HEAD 有权
标题翻译：液体喷射头和使用液体喷射头的图像形成装置
公开(公告)号：US20140375725A1
公开(公告)日：2014-12-25
申请号：US14291478
申请日：2014-05-30
申请人： Tatsuya Sameshima , Shinichi Kakuda , Hisashi Habashi , Takashi Mori , Kaname Morita , Daisuke Takagi , Hitoshi Usami , Tomoyuki Aratani
发明人： Tatsuya Sameshima , Shinichi Kakuda , Hisashi Habashi , Takashi Mori , Kaname Morita , Daisuke Takagi , Hitoshi Usami , Tomoyuki Aratani
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2/14233 , B41J2/1606
摘要： A liquid ejection head is provided. The liquid ejection head includes a nozzle substrate to eject a droplet of a liquid from a nozzle thereof; a surface treatment layer, which is located on the surface of the nozzle substrate and which is an oxide layer including silicon (Si) and a transition metal capable of forming a passive layer; and an organic liquid repellent layer located on the surface treatment layer.
摘要翻译：提供液体喷射头。液体喷射头包括喷嘴基板，用于从喷嘴喷射液滴; 表面处理层，其位于喷嘴基板的表面上，并且是包含硅（Si）和能够形成钝化层的过渡金属的氧化物层; 以及位于表面处理层上的有机液体排斥层。

58. 发明申请

US20110156425A1 PICK-UP STYLE UTILITY VEHICLE WITH EXPANDABLE CARGO BED 有权
标题翻译：具有可扩展性的货架的拾起风格的实用车辆
公开(公告)号：US20110156425A1
公开(公告)日：2011-06-30
申请号：US12649839
申请日：2009-12-30
申请人： Manabu KOKAWA , Satoshi Morotomi , Daisuke Takagi , Naohisa Masuda , Shigeru Yamashita , Masahiro Kawahara , Hirokazu Morita , Masashi Sakata , Hideyuki Kato
发明人： Manabu KOKAWA , Satoshi Morotomi , Daisuke Takagi , Naohisa Masuda , Shigeru Yamashita , Masahiro Kawahara , Hirokazu Morita , Masashi Sakata , Hideyuki Kato
IPC分类号： B62D33/08 , B60N2/02
CPC分类号： B62D33/08 , B60N2/24 , B60N2/36 , B60P3/423 , B62D33/0273 , B62D47/003
摘要： A pick-up style utility vehicle according to the present invention has a front seat and a rear seat surrounded by a cabin frame, and a cargo bed in this order from front, a screen shield partitioning the cargo bed and a riding space in front of the cargo bed, and the cargo bed being changeable between an expanded state in which the cargo bed is expanded to the riding space of the rear seat and a non-expanded state not occupying the riding space of the rear seat. The screen shield is supported by the upper portion of the cabin frame and is changeable between an expanded position in which the cargo bed in the expanded state and the riding space in front of the cargo bed are partitioned and a non-expanded position in which the cargo bed in the non-expanded state and the riding space in front of the cargo bed are partitioned without being detached from the cabin frame.
摘要翻译：根据本发明的拾取式多功能车具有前座椅和后座椅，其包括由客舱框架和从前面顺序的货物床，分隔货舱的屏蔽罩和前面的乘坐空间货物床和货物床可以在货舱扩展到后座椅的乘坐空间的扩张状态和不占据后座的乘坐空间的未扩张状态之间变化。屏蔽罩由机舱框架的上部支撑，并且在膨胀状态的货舱与货舱前面的乘坐空间被分隔开的展开位置和非展开位置之间是可变的，其中，处于非膨胀状态的货物床和货物舱前面的乘坐空间被分隔而不与车厢框架分离。

59. 发明申请

US20110148146A1 PICK-UP STYLE UTILITY VEHICLE WITH EXPANDABLE CARGO BED 有权
标题翻译：具有可扩展性的货架的拾起风格的实用车辆
公开(公告)号：US20110148146A1
公开(公告)日：2011-06-23
申请号：US12646041
申请日：2009-12-23
申请人： Satoshi TAKAYA , Masafumi Inoue , Shinichi Tanba , Daisuke Takagi , Masahiro Koga , Yoshitaka Nishikawa , Takao Kawabata , Dave Reinke
发明人： Satoshi TAKAYA , Masafumi Inoue , Shinichi Tanba , Daisuke Takagi , Masahiro Koga , Yoshitaka Nishikawa , Takao Kawabata , Dave Reinke
IPC分类号： B60N2/36 , B60N2/30
CPC分类号： B60N2/36 , B60N2/3011 , B60N2/3065 , B60N2002/363
摘要： The present invention is a pick-up style utility vehicle with an expandable cargo bed, including a front seat, a rear seat, a stationary bottom plate serving as a bottom face of the cargo bed, an expansion bottom plate for expanding the bottom face of the cargo bed, and a shared linkage mechanism for holding the rear seat at a use position where the rear seat is positioned on the upper side of the stationary bottom plate and a shunting position where the rear seat is shunted into a rear leg room provided on the front lower side of the stationary bottom plate, and also for holding the expansion bottom plate at a storage position where the expansion bottom plate is placed out of the upper side of the leg room and an expansion position where the expansion bottom plate is positioned on the upper side of the leg room.
摘要翻译：本发明是一种具有可膨胀货物床的拾取式多用途车，包括前排座椅，后座椅，用作货物底面的固定底板，膨胀底板，用于将底面扩张货舱，以及用于将后座椅保持在后座位于固定底板上侧的使用位置的共用连杆机构以及后排座椅分流到设置在其上的后腿房间的分流位置固定底板的前下侧，还用于将膨胀底板保持在扩张底板放置在腿部房间上侧的存放位置和膨胀底板位于其上的展开位置腿部房间的上侧。

60. 发明授权

US07649270B2 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode 有权
标题翻译：集体基板，半导体元件安装件，半导体器件，成像器件，发光二极管元件和发光二极管
公开(公告)号：US07649270B2
公开(公告)日：2010-01-19
申请号：US10589747
申请日：2005-07-21
申请人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
发明人： Kenjiro Higaki , Daisuke Takagi , Sadamu Ishidu , Yasushi Tsuzuki
IPC分类号： H01L23/29
CPC分类号： H01L33/62 , H01L23/49827 , H01L24/97 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/01046 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/16195 , H01L2924/3025 , H05K1/0306 , H05K3/0052 , H05K3/403 , H05K2201/09181 , H05K2201/09827 , H01L2924/00014 , H01L2924/00
摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).
摘要翻译：通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。通孔（11）各自具有包括锥形表面（11b，11c）的内表面，锥形表面（11b，11c）具有从主表面（21）和外部连接表面（22）朝向最小尺寸孔逐渐减小的开口尺寸的锥形部分（11a）。锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）形成钝角θ1，θ2。半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。成像装置（PE2）包括安装在被框架（4）包围的区域中的成像元件（PE1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL）封闭。发光二极管部件（LE2）包括安装在绝缘构件（2）的主表面（21）上的发光元件（LE1），其中通孔的最小尺寸孔部分（11a）填充有电导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。发光二极管（LE3）包括安装在封装（7）中的发光二极管部件（LE2）。

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