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1. 发明授权

US06855566B2 Optical semiconductor module and method of producing the same 失效
标题翻译：光半导体模块及其制造方法
公开(公告)号：US06855566B2
公开(公告)日：2005-02-15
申请号：US10381460
申请日：2002-04-06
申请人： Nobuyoshi Tatoh , Daisuke Takagi , Shinya Nishina
发明人： Nobuyoshi Tatoh , Daisuke Takagi , Shinya Nishina
IPC分类号： H01L23/38 , H01L35/32 , H01S5/022 , H01S5/024 , H01L21/00
CPC分类号： H01S5/02415 , H01L23/38 , H01L35/32 , H01L2924/0002 , H01S5/02208 , H01L2924/00
摘要： An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A package 11 includes two or more units of electronic cooling element 16 mounted therein. Each unit of the electronic cooling element is inserted through the space between inner juts 14a of ceramic feedthrough of the package 11 and a bottom plate 13, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the package 11 occupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.
摘要翻译：即使封装的底板的面积相同，也可以设置具有大的吸热量的电子冷却元件的光学半导体模块。包装11包括安装在其中的两个或更多个电子冷却元件16。电子冷却元件的每个单元通过包装11的陶瓷馈通件的内凸起14a和底板13之间的空间插入并固定到底板。多个单元的电子冷却元件通过一个或多个铜片串联连接。电子冷却元件的两个或多个单元与封装11的底板区域之间的接合面积占底板面积的75％以上。因此，可以增加底板和电子冷却元件之间的整体面积与封装底板的面积的比率。

2. 发明授权

US06506624B2 Method of manufacturing an optical semiconductor module 失效
公开(公告)号：US06506624B2
公开(公告)日：2003-01-14
申请号：US09945809
申请日：2001-09-05
申请人： Nobuyoshi Tatoh , Shinya Nishina
发明人： Nobuyoshi Tatoh , Shinya Nishina
IPC分类号： H01L2150
CPC分类号： H01S5/02415 , H01L2924/0002 , H01S5/02216 , H01S5/02284 , H01L2924/00
摘要： A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.

3. 发明授权

US06600223B2 Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure 失效
标题翻译：用于外壳光电半导体器件的密封外壳和包含外壳的光电半导体模块
公开(公告)号：US06600223B2
公开(公告)日：2003-07-29
申请号：US10178520
申请日：2002-06-25
申请人： Nobuyoshi Tatoh , Koji Nishi , Shinya Nishina
发明人： Nobuyoshi Tatoh , Koji Nishi , Shinya Nishina
IPC分类号： H01L2306
CPC分类号： H01L31/02002 , H01L23/10 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.
摘要翻译：用于容纳光电半导体器件的气密密封外壳，其减少陶瓷端子构件上的布线条中产生的热量，与常规外壳相比，增加了布线条的允许电流，同时保持了低功耗，并稳定了输出的设备。还提供了包含外壳的光电半导体模块。陶瓷端子构件设置有包括多个布线条并穿过陶瓷端子构件的第一布线层; 两个第二布线层，每个第二布线层包括至少一个布线条，其中一个布线条在外壳的外侧连接到第一布线层，另一布线条在内侧连接到第一布线层; 以及包括至少一个布线条并且连接所述两个第二布线层的至少一个第三布线层。

4. 发明授权

US4411863A Low-carat corrosion-resistant gold alloy with the skin of the alloy not being blacked upon casting 失效
标题翻译：低合金耐腐蚀金合金与合金的皮肤在铸造时不被黑化
公开(公告)号：US4411863A
公开(公告)日：1983-10-25
申请号：US391941
申请日：1982-06-24
申请人： Masasuke Otsuka , Hideyo Maniwa , Shinya Nishina
发明人： Masasuke Otsuka , Hideyo Maniwa , Shinya Nishina
IPC分类号： C22C5/06 , A61K6/04 , B22D25/02 , C22C30/00 , H01H1/023
CPC分类号： A61K6/046 , C22C30/00 , H01H1/023
摘要： A low-carat corrosion-resistant gold alloy which is not blacked in its skin surface color upon being cast is provided. The alloy is used as cast alloy for reparation of tooth crowns, as general decorative articles, or as contact alloy used in electrical apparatus. The alloy is composed essentially of gold, palladium and silver, with addition thereto of indium in place of copper contained in the conventional alloys, and necessary amounts of zinc or tin as deoxidant. Copper contents have been desired in view of improving the castability and mechanical strength of the alloy but the skin surface of the cast alloy may thereby be blacked to detract from aesthetic effects thus making it necessary to wash off the blacked oxide film by use of strong acid washing agents. The indium added in place of copper affords necessary mechanical properties to the alloy while providing aesthetically desirable silver to gray skin color and making the washing with strong acids unnecessary.
摘要翻译：提供了一种低克拉耐腐蚀金合金，其在铸造时不会在其皮肤表面上变黑。该合金用作用于修复牙冠的铸造合金，作为通用装饰制品，或用作电气设备中的接触合金。该合金基本上由金，钯和银组成，其中添加了铟代替常规合金中所含的铜，以及必需量的锌或锡作为脱氧剂。考虑到提高合金的铸造性和机械强度，期望铜含量，但铸造合金的表皮表面可能因此被黑化而损害美观效果，从而需要通过使用强酸来洗去黑色氧化物膜洗涤剂。添加了铜的铟为合金提供必要的机械性能，同时提供美观的银色至灰色的皮肤颜色，并且不需要用强酸进行洗涤。

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