会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 41. 发明授权
    • Current-perpendicular-to-the-plane (CPP) magnetoresistive sensor with CoFeGe ferromagnetic layers
    • 具有CoFeGe铁磁层的电流垂直平面(CPP)磁阻传感器
    • US07826182B2
    • 2010-11-02
    • US11781576
    • 2007-07-23
    • Matthew J. CareyJeffrey R. ChildressStefan Maat
    • Matthew J. CareyJeffrey R. ChildressStefan Maat
    • G11B5/127
    • H01L43/10B82Y25/00G01R33/093G11B5/3906G11B5/398G11B5/3983
    • A current-perpendicular-to-the-plane spin-valve (CPP-SV) magnetoresistive sensor has a ferromagnetic alloy comprising Co, Fe and Ge in the sensor's free layer and/or pinned layer. The sensor may be a simple pinned structure, in which case the pinned layer may be formed of the CoFeGe ferromagnetic alloy. Alternatively, the sensor may have an AP-pinned layer structure, in which case the AP2 layer may be formed of the CoFeGe ferromagnetic alloy. The Ge-containing alloy comprises Co, Fe and Ge, wherein Ge is present in the alloy in an amount between about 20 and 40 atomic percent, and wherein the ratio of Co to Fe in the alloy is between about 0.8 and 1.2. More particularly, the CoFeGe alloy may consist essentially of only Co, Fe and Ge according to the formula (CoxFe(100-x))(100-y)Gey where the subscripts represent atomic percent, x is between about 45 and 55, and y is between about 23 and 37.
    • 电流垂直于平面的自旋阀(CPP-SV)磁阻传感器在传感器的自由层和/或固定层中具有包含Co,Fe和Ge的铁磁合金。 传感器可以是简单的钉扎结构,在这种情况下,被钉扎层可以由CoFeGe铁磁合金形成。 或者,传感器可以具有AP钉扎层结构,在这种情况下,AP2层可以由CoFeGe铁磁合金形成。 含Ge合金包括Co,Fe和Ge,其中Ge在合金中以约20至40原子%的量存在,并且其中合金中Co与Fe的比率在约0.8和1.2之间。 更具体地说,CoFeGe合金基本上仅由根据式(CoxFe(100-x))(100-y)的Co,Fe和Ge组成,其中下标表示原子百分数,x在约45和55之间, y在约23和37之间。
    • 46. 发明授权
    • CPP read sensor having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers and method of making same
    • CPP读取传感器具有由具有周围的氧化金属子层的光刻定义的导电通孔制成的约束电流路径及其制造方法
    • US07646570B2
    • 2010-01-12
    • US11496604
    • 2006-07-31
    • Hardayal Singh GillJordan Asher KatineAlexander Zeltser
    • Hardayal Singh GillJordan Asher KatineAlexander Zeltser
    • G11B5/39H04R31/00
    • G11B5/398B82Y25/00B82Y40/00G01R33/093G11B5/3906G11B5/3983H01F41/306H01F41/308Y10T29/49046Y10T29/49052
    • Current-perpendicular-to-plane (CPP) read sensors having constrained current paths made of lithographically-defined conductive vias with surrounding oxidized metal sublayers, and methods of making the same, are disclosed. In one illustrative example, at least part of a sensor stack structure which includes an electrically conductive spacer layer is formed. A metal (e.g. Ta) sublayer is then deposited over and adjacent the spacer layer, followed by one of an oxidation process, a nitridation process, and an oxynitridation process, to produce an insulator (e.g. TaOx) from the metal sublayer. The metal sublayer deposition and oxidation/nitridation/oxynitridation processes are repeated as necessary to form the insulator with a suitable thickness. Next, a resist structure which exposes one or more portions of the insulator is formed over the insulator. With the resist structure in place, exposed insulator materials are removed by etching to form one or more apertures through the insulator down to the spacer layer. Electrically conductive materials are subsequently deposited within the one or more apertures to form one or more lithographically-defined conductive vias of a current-constraining structure. Advantageously, the lithographically-defined conductive vias increase the current density of the read sensor in the region of the sensing layers to thereby simultaneously increase its resistance and magnetoresistance. With use of the process of oxidation, nitridation, or oxynitridation on each metal sublayer, degradation of the spacer layer is reduced or eliminated such that the desirable soft magnetics of the sensing layers in the read sensor are maintained.
    • 公开了具有由具有周围氧化金属子层的光刻定义的导电通孔制成的约束电流路径的电流垂直平面(CPP)读取传感器及其制造方法。 在一个说明性示例中,形成包括导电间隔层的传感器堆叠结构的至少一部分。 然后将金属(例如Ta)子层沉积在间隔层上并与其相邻,随后是氧化工艺,氮化工艺和氧氮化工艺中的一种,以从金属子层产生绝缘体(例如TaO x)。 根据需要重复金属亚层沉积和氧化/氮化/氧氮化处理以形成具有合适厚度的绝缘体。 接下来,在绝缘体上形成露出绝缘体的一个或多个部分的抗蚀剂结构。 在抗蚀剂结构就位的情况下,通过蚀刻去除暴露的绝缘体材料,以形成穿过绝缘体的一个或多个孔向下到间隔层。 导电材料随后沉积在一个或多个孔内以形成电流约束结构的一个或多个光刻定义的导电通孔。 有利地,光刻定义的导电通孔增加读取传感器在感测层的区域中的电流密度,从而同时增加其电阻和磁阻。 通过使用在每个金属子层上的氧化,氮化或氧氮化的过程,间隔层的劣化被减少或消除,使得保持读取传感器中感测层的期望的软磁性。