专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明授权

US07285492B2 Method for processing substrate 有权
标题翻译：基板处理方法
公开(公告)号：US07285492B2
公开(公告)日：2007-10-23
申请号：US11039967
申请日：2005-01-24
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka , Tsuyoshi Sahoda
IPC分类号： H01L21/44
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译：基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。

42. 发明申请

US20070034525A1 Electrolytic processing method 审中-公开
标题翻译：电解加工方法
公开(公告)号：US20070034525A1
公开(公告)日：2007-02-15
申请号：US11203545
申请日：2005-08-12
申请人： Masayuki Kumekawa , Norio Kimura , Yukio Fukunaga , Katsuyuki Musaka , Hariklia Deligianni , Emanuel Cooper , Philippe Vereecken
发明人： Masayuki Kumekawa , Norio Kimura , Yukio Fukunaga , Katsuyuki Musaka , Hariklia Deligianni , Emanuel Cooper , Philippe Vereecken
IPC分类号： B23H9/00
CPC分类号： B23H5/08
摘要： An electrolytic processing method is used to remove a metal film formed on a surface of a substrate. The electrolytic processing method includes providing a feeding electrode 31 and a processing electrode 32 on a table 12, providing an insulating member 36 between the feeding electrode and the processing electrode, holding the substrate W by a substrate carrier 11, bringing the substrate into contact with the insulating member, supplying first and second electrolytic processing liquids to gaps between the feeding electrode and the substrate and between the processing electrode and the substrate, respectively, while the first and second electrolytic processing liquids are electrically isolated, applying voltage between the feeding electrode and the processing electrode, and making a relative movement between the substrate carrier and the table to electrically process the metal film.
摘要翻译：使用电解处理方法去除在基板的表面上形成的金属膜。电解处理方法包括在台12上设置馈电电极31和处理电极32，在馈电电极和处理电极之间提供绝缘构件36，通过衬底载体11保持衬底W，使衬底与所述绝缘构件在所述第一和第二电解处理液体被电绝缘的同时，在所述馈电电极和所述衬底之间以及所述处理电极和所述衬底之间的间隙中分别供应第一和第二电解处理液体，处理电极，并且在基板载体和工作台之间进行相对运动以对金属膜进行电加工。

43. 发明申请

US20050155865A1 Electrolytic processing apparatus and method 审中-公开
标题翻译：电解处理装置及方法
公开(公告)号：US20050155865A1
公开(公告)日：2005-07-21
申请号：US10845429
申请日：2004-05-14
申请人： Koji Mishima , Keisuke Namiki , Masao Hodai , Junji Kunisawa , Natsuki Makino , Yukio Fukunaga
发明人： Koji Mishima , Keisuke Namiki , Masao Hodai , Junji Kunisawa , Natsuki Makino , Yukio Fukunaga
IPC分类号： C25D7/12 , C25B9/00 , C25D17/00 , C25D17/02 , C25D19/00 , C25D21/00
CPC分类号： C25D17/00 , C25D17/02
摘要： There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices. An electrolytic processing apparatus according to the present invention includes: an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions; wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.
摘要翻译：提供一种电解处理装置和方法，其能够生产具有提高的生产率的各种规格的产品，从而降低生产成本，并且可以灵活地响应于朝向半导体器件中更精细的互连的移动。根据本发明的电解处理装置包括：电解处理单元，包括用于保持基板的基板保持器和与由基板保持器保持的基板相对设置的对置电极板，所述电解处理单元通过填充电解处理单元进行电解处理在供电的同时由衬底保持器保持的衬底与电极板之间的电解槽的间隔; 以及用于供给不同种类的电解液的多个电解液供给装置; 其中所述电解处理单元可选择性地连接到所述多个电解溶液供应设备中的一个。

44. 发明授权

US06419462B1 Positive displacement type liquid-delivery apparatus 失效
标题翻译：正排量型送液装置
公开(公告)号：US06419462B1
公开(公告)日：2002-07-16
申请号：US09627779
申请日：2000-07-28
申请人： Kuniaki Horie , Yukio Fukunaga , Akihisa Hongo , Kiwamu Tsukamoto , Kenji Kamoda , Hirotake Yamagishi , Shinya Uemura
发明人： Kuniaki Horie , Yukio Fukunaga , Akihisa Hongo , Kiwamu Tsukamoto , Kenji Kamoda , Hirotake Yamagishi , Shinya Uemura
IPC分类号： F04B4310
CPC分类号： F04B13/00 , F04B43/02 , F04B43/073 , F04B43/113 , F04B53/143 , F04B2205/07
摘要： A positive displacement liquid-delivery apparatus includes a positive displacement pump 110 and a differential pressure control unit 142. The positive displacement pump 110 includes a liquid-delivery chamber 128 having a watertight housing 122 with one part formed of a flexible diaphragm 124, and a diaphragm driver 136 linked to the diaphragm 124 for deforming the same to discharge fluid from the liquid-delivery chamber 128. The differential pressure control unit 142 uniformly controls the differential pressure inside and outside the diaphragm 124 during the pumping process.
摘要翻译：正排量输送装置包括容积泵110和差压控制单元142.正排量泵110包括具有防水外壳122的液体输送室128，其中一部分由柔性膜片124形成，膜片驱动器136连接到隔膜124，用于使其变形以从液体输送室128排出流体。差压控制单元142在泵送过程期间均匀地控制膜片124内部和外部的压差。

45. 发明授权

US4911470A Hydraulic circuit for actively controlled automotive suspension system 失效
标题翻译：液压回路用于主动控制汽车悬架系统
公开(公告)号：US4911470A
公开(公告)日：1990-03-27
申请号：US331653
申请日：1989-03-31
申请人： Yukio Fukunaga
发明人： Yukio Fukunaga
IPC分类号： B60G17/00 , B60G17/015 , B60G17/017 , B60G23/00 , F16F9/50
CPC分类号： B60G17/017 , B60G17/0152 , B60G2202/41 , B60G2400/104 , B60G2400/106 , B60G2400/204 , B60G2400/252 , B60G2400/30 , B60G2400/41 , B60G2600/07 , B60G2600/08 , B60G2800/012 , Y10S280/01
摘要： An actively controlled suspension system includes a hydraulic circuit connecting a pressure source unit to a pressure control valve unit which controls working fluid pressure in a working chamber of a hydraulic cylinder serving as principle component of a suspension system for supporting a vehicle body on a suspension member. The hydraulic circuit includes a supply line for supplying a pressurized fluid to the pressure control valve and a drain line for draining the pressurized fluid from the pressure control valve. A one-way check valve is disposed between the pressure source and the pressure control valve for presenting surge flow of the working fluid from the pressure control valve unit to the pressure source. An operational one-way check valve is disposed in the drain line for preventing surge flow from the pressure source to the pressure control valve unit. The operational one-way check valve is connected to the supply line downstream of the one-way check valve as a pilot pressure so as to permit fluid flow from the pressure control valve unit to the pressure source unit when the working fluid pressure in the drain line is higher than the pilot pressure.
摘要翻译：主动控制的悬挂系统包括将压力源单元连接到压力控制阀单元的液压回路，所述压力控制阀单元控制作为用于将车身支撑在悬挂构件上的悬架系统的主要部件的液压缸的工作室中的工作流体压力。液压回路包括用于向加压控制阀供给加压流体的供给管线和用于从压力控制阀排出加压流体的排出管线。单向止回阀设置在压力源和压力控制阀之间，用于使工作流体从压力控制阀单元涌入压力源。在排水管路中设置有一个可操作的单向止回阀，用于防止从压力源到压力控制阀单元的喘振流。操作单向止回阀作为先导压力连接到单向止回阀下游的供给管线，以便当排水管中的工作流体压力流过压力源单元时，流体从压力控制阀单元流向压力源单元线高于先导压力。

46. 发明授权

US4625822A Rear wheel steering control for vehicle 失效
标题翻译：车辆后轮转向控制
公开(公告)号：US4625822A
公开(公告)日：1986-12-02
申请号：US703593
申请日：1985-02-20
申请人： Kenji Nakamura , Yasuji Shibahata , Yukio Fukunaga , Yasumasa Tsubota , Namio Irie , Junsuke Kuroki
发明人： Kenji Nakamura , Yasuji Shibahata , Yukio Fukunaga , Yasumasa Tsubota , Namio Irie , Junsuke Kuroki
IPC分类号： B62D7/14 , B62D6/00 , B62D7/15 , B62D101/00 , B62D113/00 , B62D137/00 , B62D15/00
CPC分类号： B62D7/159
摘要： A rear wheel steering control system which determines a target rear wheel steering angle in accordance with a steering angle of front wheels of the vehicle and steers the rear wheels so that the rear wheel steering angle is maintained equal to the target rear wheel steering angle, and is arranged not to decrease the difference between the target angle and the actual rear wheel steering angle immediately to zero, but to decrease the difference gradually in accordance with a distance traveled by the vehicle, in order to prevent the rear wheels from being steered too much in a direction opposite to a steered direction of the front wheels especially when the vehicle speed is low, and thereby prevent the rear of the vehicle from bumping against an object lying alongside the vehicle.
摘要翻译：一种后轮转向控制系统，其根据车辆的前轮的转向角确定目标后轮转向角，并且使后轮转向，使得后轮转向角保持与目标后轮转向角相等，以及被设置为不将目标角度和实际的后轮转向角之间的差减小到零，而是根据车辆行进的距离逐渐减小差距，以防止后轮转向太多特别是当车速低时，与前轮的转向相反的方向，从而防止车辆的后部碰撞在车辆旁边的物体。

47. 发明授权

US4421960A Steering wheel with switch assembly 失效
标题翻译：带开关总成的方向盘
公开(公告)号：US4421960A
公开(公告)日：1983-12-20
申请号：US287944
申请日：1981-07-29
申请人： Sumitsugu Arima , Hiroshi Tsuda , Yukio Fukunaga
发明人： Sumitsugu Arima , Hiroshi Tsuda , Yukio Fukunaga
IPC分类号： B60K37/00 , B60R16/02 , B60R16/027 , B60R16/03 , B62D1/04 , B62D1/16 , H01H9/00 , H01R39/00
CPC分类号： B60R16/027 , B60K37/00 , B62D1/04
摘要： A steering mechanism for a steerable vehicle such as an automotive vehicle, wherein a switch support structure positioned internally of the rim portion of a steering wheel and having incorporated therein a switch assembly including various electric switch units to be manually actuated is retained in position independently of the steering wheel and held against rotation with respect to a steering column tube fixed with respect to the body structure of the vehicle and wherein an optical display unit associated with the switch units or some of the switch units is securely supported in position in front of the steering wheel. The switch units are connected to electrically operated vehicular instruments through wire harnesses including those which are passed through the switch support structure and those which are passed through a member secured to the steering column tube.
摘要翻译：一种用于诸如机动车辆的可转向车辆的转向机构，其中定位在方向盘的轮缘部分内部的开关支撑结构并且其中并入有包括要手动致动的各种电动开关单元的开关组件保持在与所述方向盘相对于相对于所述车辆的车身结构固定的转向柱管被保持，并且其中与所述开关单元或所述开关单元中的一些相关联的光学显示单元被牢固地支撑在方向盘。开关单元通过线束连接到电动车辆仪器，线束包括通过开关支撑结构的那些，以及通过固定到转向柱管的构件的线束。

48. 发明授权

US4313584A Structure for mounting a meter on an instrument panel of motor vehicles 失效
标题翻译：将仪表安装在机动车辆仪表板上的结构
公开(公告)号：US4313584A
公开(公告)日：1982-02-02
申请号：US77111
申请日：1979-09-19
申请人： Yukio Fukunaga
发明人： Yukio Fukunaga
IPC分类号： B60K35/00 , G12B9/00
CPC分类号： B60K37/04 , B60K35/00 , B60K2350/941 , B60K2350/946
摘要： A structure for mounting a meter includes an instrument panel having a wall recessed on the instrument panel, a meter inserted in the recessed wall through the opening of the instrument panel, means for supporting the meter on the bottom of the recessed wall, the supporting means including a first projection formed on the bottom of the meter, the first projection being in contact with the bottom of the recessed wall, means for positioning the meter at the front portion of the recessed wall, and means for locking the meter in the recessed wall at the top thereof, the locking means including a second projection provided on the top of the meter and an engaging member which can be resiliently deformed when the meter becomes engaged with or disengaged from the second projection.
摘要翻译：用于安装仪表的结构包括：具有在仪表板上凹入的壁的仪表板，通过仪表板的开口插入到凹壁中的仪表，用于将仪表支撑在凹壁的底部上的装置，支撑装置包括形成在所述仪表的底部上的第一突起，所述第一突起与所述凹壁的底部接触，用于将所述仪表定位在所述凹陷壁的前部的装置，以及用于将所述仪表锁定在所述凹壁中的装置在其顶部，锁定装置包括设置在仪表顶部的第二突起和接合构件，当仪表与第二突起接合或脱离时，该弹性变形。

49. 发明申请

US20100105154A1 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：US20100105154A1
公开(公告)日：2010-04-29
申请号：US12685820
申请日：2010-01-12
申请人： XINMING WANG , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
发明人： XINMING WANG , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari , Yukiko Nishioka
IPC分类号： H01L21/66 , H01L21/46
CPC分类号： H01L21/02068 , C23C18/1632 , C23C18/1689 , C23C18/1844 , H01L21/02074 , H01L21/288 , H01L21/67028 , H01L21/76849 , H01L21/76874 , H01L21/76883
摘要： A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
摘要翻译：基板处理方法可以通过在贱金属（例如互连）的暴露表面上通过无电解电镀牢固地形成金属膜，具有增加的生产量并且在母材中不形成空隙。基板处理方法包括：用包含含羧基的有机酸或其盐和表面活性剂的水溶液作为添加剂的清洗溶液清洗在表面形成的基体金属的基材的表面; 使清洗后的基板的表面与包含清洗液和含有催化剂金属离子的溶液的混合物的处理溶液接触，从而将催化剂施加到基板的表面; 以及通过在基板的催化剂涂覆表面上通过无电镀形成金属膜。

50. 发明授权

US07498261B2 Method and apparatus for forming metal film 有权
标题翻译：用于形成金属膜的方法和装置
公开(公告)号：US07498261B2
公开(公告)日：2009-03-03
申请号：US11219777
申请日：2005-09-07
申请人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari
发明人： Xinming Wang , Daisuke Takagi , Akihiko Tashiro , Yukio Fukunaga , Akira Fukunaga , Akira Owatari
IPC分类号： H01L21/44
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1669 , C23C18/32 , H01L21/76846 , H01L21/76849 , H01L21/76874
摘要： A metal film-forming method of the present invention can form a metal film having different film qualities in the thickness direction, in a continuous manner using a single processing solution. The metal film-forming method including: providing a substrate having embedded interconnects formed in interconnect recesses provided in a surface of the substrate; and forming a metal film, having different film qualities in the thickness direction, on surfaces of the interconnects in a continuous manner by changing the flow state of a processing solution relative to the surface of the substrate while keeping the surface of the substrate in contact with the processing solution.
摘要翻译：本发明的金属成膜方法可以使用单一的处理液以连续的方式形成厚度方向的膜质量不同的金属膜。所述金属成膜方法包括：提供具有形成在所述基板的表面中的互连凹槽中的嵌入式互连的基板; 并且通过在保持基板的表面与基板的表面接触的同时改变处理液相对于基板的表面的流动状态，以连续的方式在相互连接的表面上形成在厚度方向上具有不同膜质量的金属膜处理方案。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式