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    • 41. 发明申请
    • SEMICONDUCTOR APPARATUS
    • US20130058173A1
    • 2013-03-07
    • US13607306
    • 2012-09-07
    • Shuuichi SENOUKenjyu ShimogawaSusumu TakanoToshihiko FunakiHideaki Arima
    • Shuuichi SENOUKenjyu ShimogawaSusumu TakanoToshihiko FunakiHideaki Arima
    • G11C7/22
    • G11C7/22G06F3/0635G06F13/4022
    • A semiconductor apparatus according to an aspect of the present invention includes first and second bus-interface circuits, a mode information storage unit that stores first and second mode information, the first and second mode information being able to be set through the first bus-interface circuit, a first memory core that operates based on the first mode information, the first memory core being connected to the first bus-interface circuit and supplied with a first clock signal, a second memory core, the second memory core being supplied with a second clock signal and a select circuit that selectively connects the second memory core to the first or second bus-interface circuit based on predetermined switching information, in which the second memory core operates based on the second mode information when the second memory core is connected to the second bus-interface circuit.
    • 根据本发明的一个方面的半导体装置包括第一和第二总线接口电路,存储第一和第二模式信息的模式信息存储单元,能够通过第一总线接口设置的第一和第二模式信息 电路,基于第一模式信息操作的第一存储器核心,第一存储器核心连接到第一总线接口电路并被提供有第一时钟信号,第二存​​储器内核,第二存储器核心被提供有第二存储器核心 时钟信号和选择电路,其基于预定的切换信息选择性地将第二存储器核心连接到第一或第二总线接口电路,其中当第二存储器核心连接到第二存储器核心时,第二存储器核心基于第二模式信息操作 第二总线接口电路。
    • 48. 发明授权
    • Dynamic random access memory having stacked type capacitor and
manufacturing method therefor
    • 具有层叠型电容器的动态随机存取存储器及其制造方法
    • US5381365A
    • 1995-01-10
    • US91675
    • 1993-06-30
    • Natsuo AjikaHideaki ArimaAtsushi Hachisuka
    • Natsuo AjikaHideaki ArimaAtsushi Hachisuka
    • H01L27/108H01L29/68H01L27/10
    • H01L27/10817
    • The DRAM according to the present invention comprises so-called cylindrical stacked type capacitors. Each of the cylindrical stacked type capacitors comprises a base portion extending flat on an insulation layer and a surface of a substrate, and a cylindrical portion extending vertically and upwardly from the base portion. Then, the cylindrical portion vertically and upwardly protrudes from an outermost peripheral position of the base portion. As a result, an area where electrodes of the capacitor and capacitance of the capacitor can be increased. Furthermore, with a bit line located below an electrode layer of the capacitor, adjacent capacitors above the bit line can be isolated. Accordingly, it is possible to prevent the bit line contact from defining an isolation distance between the capacitors. Furthermore, an isolating layer patterned by etching is used as an isolating region between the capacitors and a lower electrode of the capacitor is formed along a surface of the isolating layer to form an isolation region between the adjacent capacitors. In addition, the lower electrode of the cylindrical stacked type capacitor is integrally formed by using a step formed in the insulation layer. As a result, the manufacturing step is simplified.
    • 根据本发明的DRAM包括所谓的圆柱形堆叠型电容器。 每个圆柱形堆叠型电容器包括在绝缘层和基板的表面上平坦延伸的基部,以及从基部垂直和向上延伸的圆柱形部分。 然后,圆筒部从基部的最外周位置向上方突出。 结果,可以增加电容器的电极和电容器的电容的区域。 此外,通过位于电容器的电极层下方的位线,可以隔离位线上方的相邻电容器。 因此,可以防止位线接触限定电容器之间的隔离距离。 此外,通过蚀刻图案化的隔离层用作电容器之间的隔离区域,并且电容器的下电极沿着隔离层的表面形成,以在相邻的电容器之间形成隔离区域。 此外,圆柱形堆叠型电容器的下电极通过使用形成在绝缘层中的台阶整体地形成。 结果,简化了制造步骤。