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    • 41. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US07982244B2
    • 2011-07-19
    • US12553496
    • 2009-09-03
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • Atsuhiro SatoHiroyuki NittaFumitaka Arai
    • H01L29/68H01L29/417H01L27/105
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。