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    • 47. 发明授权
    • Double-surface printing apparatus
    • 双面印刷装置
    • US06330425B1
    • 2001-12-11
    • US09558041
    • 2000-04-26
    • Yoshio OhuchiAkira ShimizuNobuaki FukasawaMichio SumiyoshiSatoshi NaritaKiminori Takada
    • Yoshio OhuchiAkira ShimizuNobuaki FukasawaMichio SumiyoshiSatoshi NaritaKiminori Takada
    • G03G1500
    • G03G15/234
    • A double-surface printing apparatus, which is small-sized and has a simple construction to make it impossible to take out a sheet, of which one surface has been subjected to printing, from outside. The apparatus includes a paper discharge tray, to which sheets having been subjected to printing are discharged; a sheet reversing mechanism including a reversal/temporary storage unit for guiding a sheet in a direction different from a discharge direction toward the paper discharge tray, once exposing the sheet outside of the apparatus, and rotating conveying rollers in an opposite direction to thereby reverse the sheet; and a protective cover, which covers the sheet conveyed to the reversal/temporary storage unit so that a sheet, of which one-surface has been subjected to printing, cannot be taken out from outside.
    • 一种双面打印装置,其尺寸小并且具有简单的结构,使得不可能从外部取出其表面已经被印刷的片材。 该设备包括排纸托盘,已经印刷的纸张被排出到该排纸托盘; 纸张反转机构,其包括用于将片材沿着与排出方向不同的方向朝向排纸盘引导的反转/临时存储单元,一旦暴露出设备外部的片材,并且使相反方向的输送辊转动, 片; 以及保护盖,其覆盖输送到反转/临时存储单元的纸张,使得其中一个表面已被印刷的纸张不能从外部取出。
    • 48. 发明授权
    • Method for fabricating CMOS transistors by implanting into polysilicon
    • 通过植入多晶硅制造CMOS晶体管的方法
    • US6001677A
    • 1999-12-14
    • US65334
    • 1998-04-23
    • Akira Shimizu
    • Akira Shimizu
    • H01L21/28H01L21/265H01L21/8238H01L27/092
    • H01L21/823842
    • A method for fabricating MOS transistors comprises the steps of forming a polysilicon layer, having an underlying gate oxide layer on the major surface of a silicon substrate, providing a mask to cover a predetermined portion except the portion for an N-type polysilicon layer to be formed, doping the polysilicon layer uncovered by the first mask with N-type ions, providing a second mask to cover a predetermined portion except the portion for a P-type polysilicon layer to be formed, doping the polysilicon layer uncovered by the second mask with boron ions, subjecting the polysilicon layer to a patterning process to define gate electrodes of an NMOS and PMOS transistors, providing a third mask to cover a predetermined portion except the portion for an NMOS transistor to be formed, doping N-type ions into substrate portion for the NMOS transistor to be formed using the third mask and the gate electrodes as a mask to thereby form a source and a drain of the NMOS transistor, forming a silicon oxide layer over each of the gate electrodes, providing a fourth mask to cover a predetermined portion except the portion for a PMOS transistor to be formed, and doping BF.sub.2 ions into substrate portion for PMOS transistors to be formed using the fourth mask and gate electrodes overlaid by the silicon oxide layer as a mask, to thereby form source and drain regions of the PMOS transistors.
    • 一种用于制造MOS晶体管的方法包括以下步骤:在硅衬底的主表面上形成具有下面的栅氧化层的多晶硅层,提供掩模以覆盖除了用于N型多晶硅层的部分之外的预定部分 形成,用N型离子掺杂由第一掩模未覆盖的多晶硅层,提供第二掩模以覆盖除了待形成的P型多晶硅层的部分之外的预定部分,将由第二掩模未覆盖的多晶硅层掺杂 硼离子,对多晶硅层进行图形化处理以限定NMOS和PMOS晶体管的栅电极,提供第三掩模以覆盖除了要形成的NMOS晶体管的部分之外的预定部分,将N型离子掺杂到衬底部分 为了使用第三掩模和栅电极作为掩模形成NMOS晶体管,从而形成NMOS晶体管的源极和漏极,形成硅 在每个栅电极上的氧化物层上,提供第四掩模以覆盖除了要形成的PMOS晶体管的部分之外的预定部分,并且将BF 2离子掺杂到使用第四掩模和栅电极形成的PMOS晶体管的衬底部分 由氧化硅层覆盖作为掩模,从而形成PMOS晶体管的源区和漏区。