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    • 43. 发明授权
    • Electrochromic device
    • 电致变色装置
    • US09001408B2
    • 2015-04-07
    • US13449150
    • 2012-04-17
    • Kenji YamadaShinjiro OkadaKazuya Miyazaki
    • Kenji YamadaShinjiro OkadaKazuya Miyazaki
    • G02F1/15C07D495/14C07D333/16C07D333/32C07D409/04C07D491/056C07D495/04C07D277/56C07F7/08
    • G02F1/15C07D277/56C07D333/16C07D333/32C07D409/04C07D491/056C07D495/04C07D495/14C07F7/0816G02F1/1521
    • There is provided an EC device having stability against redox reaction cycles, high transparency, i.e., the EC device does not absorb light in the visible region in a bleached state, and having excellent response speed. The electrochromic device includes a pair of electrodes and a composition arranged between the pair of electrodes, the composition containing an electrolyte and an organic electrochromic compound, in which the organic electrochromic compound includes an electrochromic portion that exhibits electrochromic properties and an aromatic ring directly bonded to the electrochromic portion, the electrochromic portion forms one conjugated plane, an atom of the aromatic ring and adjacent to an atom bonded to the electrochromic portion has a substituent having a volume equal to or larger than the volume of a methyl group, and a cathodically electrochromic organic compound is further contained in addition to the organic electrochromic compound.
    • 提供了一种对氧化还原反应循环具有稳定性的EC装置,高透明度,即EC装置在漂白状态下不​​吸收可见区域中的光,并具有良好的响应速度。 该电致变色装置包括一对电极和组合物,该组合物布置在该对电极之间,该组合物含有电解质和有机电致变色化合物,其中有机电致变色化合物包括显示电致变色性能的电致变色部分和直接键合到 电致变色部分,电致变色部分形成一个共轭平面,芳环的原子并且与键合到电致变色部分的原子相邻,具有体积等于或大于甲基体积的取代基,阴极电致变色 除了有机电致变色化合物之外还含有有机化合物。
    • 45. 发明申请
    • WAFER DIVIDING METHOD
    • 波分方法
    • US20120003816A1
    • 2012-01-05
    • US13166984
    • 2011-06-23
    • Makoto ShimotaniKazuya MiyazakiHisaki Ikebata
    • Makoto ShimotaniKazuya MiyazakiHisaki Ikebata
    • H01L21/78
    • H01L21/78
    • A method of dividing a wafer having devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern on a surface of the wafer, along the streets and into the individual devices. The wafer dividing method includes the steps of: forming grooves from the face side of the wafer along the streets and in a depth corresponding to the finished thickness of the devices; coating the surface of the wafer with an acrylic liquid resin curable by irradiation with UV rays to fill the grooves with the acrylic liquid resin and disposing a protective film on the acrylic liquid resin; performing irradiation with UV rays from the protective film side so as to cure the acrylic liquid resin; grinding the back side of the wafer so as to expose the grooves on the back side and divide the wafer into the individual devices; adhering the back side of the wafer to a surface of an adhesive tape adhered to an annular frame; and peeling the acrylic resin from the surface of the wafer together with the protective film.
    • 一种分割晶片的方法,所述晶片具有形成于多个区域中的多个区域,所述多个区域由沿着所述街道的所述晶片表面上形成的格栅图案划分的多个街道划分成单个设备。 晶片分割方法包括以下步骤:沿着街道从晶片的表面侧形成凹槽,并且对应于器件的最终厚度; 通过用紫外线照射固化的丙烯酸液体树脂涂覆晶片的表面以用丙烯酸液体树脂填充凹槽,并在丙烯酸液体树脂上设置保护膜; 从保护膜侧进行紫外线的照射,使丙烯酸系液态树脂固化; 研磨晶片的背面以露出背面的凹槽并将晶片分成各个装置; 将晶片的背面粘附到粘附到环形框架上的粘合带的表面; 并与保护膜一起从晶片的表面剥离丙烯酸树脂。