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1. 发明授权

US08513096B2 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US08513096B2
公开(公告)日：2013-08-20
申请号：US13166984
申请日：2011-06-23
申请人： Makoto Shimotani , Kazuya Miyazaki , Hisaki Ikebata
发明人： Makoto Shimotani , Kazuya Miyazaki , Hisaki Ikebata
IPC分类号： H01L21/78
CPC分类号： H01L21/78
摘要： A method of dividing a wafer having devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern on a surface of the wafer, along the streets and into the individual devices. The wafer dividing method includes the steps of: forming grooves from the face side of the wafer along the streets and in a depth corresponding to the finished thickness of the devices; coating the surface of the wafer with an acrylic liquid resin curable by irradiation with UV rays to fill the grooves with the acrylic liquid resin and disposing a protective film on the acrylic liquid resin; performing irradiation with UV rays from the protective film side so as to cure the acrylic liquid resin; grinding the back side of the wafer so as to expose the grooves on the back side and divide the wafer into the individual devices; adhering the back side of the wafer to a surface of an adhesive tape adhered to an annular frame; and peeling the acrylic resin from the surface of the wafer together with the protective film.
摘要翻译：一种分割晶片的方法，所述晶片具有形成于多个区域中的多个区域，所述多个区域由沿着所述街道的所述晶片表面上形成的格栅图案划分的多个街道划分成单个设备。晶片分割方法包括以下步骤：沿着街道从晶片的表面侧形成凹槽，并且对应于器件的最终厚度; 通过用紫外线照射固化的丙烯酸液体树脂涂覆晶片的表面以用丙烯酸液体树脂填充凹槽，并在丙烯酸液体树脂上设置保护膜; 从保护膜侧进行紫外线的照射，使丙烯酸系液态树脂固化; 研磨晶片的背面以露出背面的凹槽并将晶片分成各个装置; 将晶片的背面粘附到粘附到环形框架上的粘合带的表面; 并与保护膜一起从晶片的表面剥离丙烯酸树脂。

2. 发明申请

US20120003816A1 WAFER DIVIDING METHOD 有权
标题翻译：波分方法
公开(公告)号：US20120003816A1
公开(公告)日：2012-01-05
申请号：US13166984
申请日：2011-06-23
申请人： Makoto Shimotani , Kazuya Miyazaki , Hisaki Ikebata
发明人： Makoto Shimotani , Kazuya Miyazaki , Hisaki Ikebata
IPC分类号： H01L21/78
CPC分类号： H01L21/78
摘要： A method of dividing a wafer having devices formed in a plurality of regions demarcated by a plurality of streets formed in a grid pattern on a surface of the wafer, along the streets and into the individual devices. The wafer dividing method includes the steps of: forming grooves from the face side of the wafer along the streets and in a depth corresponding to the finished thickness of the devices; coating the surface of the wafer with an acrylic liquid resin curable by irradiation with UV rays to fill the grooves with the acrylic liquid resin and disposing a protective film on the acrylic liquid resin; performing irradiation with UV rays from the protective film side so as to cure the acrylic liquid resin; grinding the back side of the wafer so as to expose the grooves on the back side and divide the wafer into the individual devices; adhering the back side of the wafer to a surface of an adhesive tape adhered to an annular frame; and peeling the acrylic resin from the surface of the wafer together with the protective film.
摘要翻译：一种分割晶片的方法，所述晶片具有形成于多个区域中的多个区域，所述多个区域由沿着所述街道的所述晶片表面上形成的格栅图案划分的多个街道划分成单个设备。晶片分割方法包括以下步骤：沿着街道从晶片的表面侧形成凹槽，并且对应于器件的最终厚度; 通过用紫外线照射固化的丙烯酸液体树脂涂覆晶片的表面以用丙烯酸液体树脂填充凹槽，并在丙烯酸液体树脂上设置保护膜; 从保护膜侧进行紫外线的照射，使丙烯酸系液态树脂固化; 研磨晶片的背面以露出背面的凹槽并将晶片分成各个装置; 将晶片的背面粘附到粘附到环形框架上的粘合带的表面; 并与保护膜一起从晶片的表面剥离丙烯酸树脂。

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