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    • 41. 发明授权
    • Power module for multi-chip printed circuit boards
    • 多芯片印刷电路板电源模块
    • US06771507B1
    • 2004-08-03
    • US10355707
    • 2003-01-31
    • Christian L. BeladyShaun L. HarrisGary Wayne WilliamsBrent A. Boudreaux
    • Christian L. BeladyShaun L. HarrisGary Wayne WilliamsBrent A. Boudreaux
    • H05H720
    • H01L23/4338H01L23/4006H01L2924/0002H05K1/0204H01L2924/00
    • A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.
    • 一种用于多芯片印刷电路板的功率模块组件:散热板具有一体地形成在其中的第一和第二接地部分。 插座上装有第一和第二导热销。 功率模块印刷电路板安装在配热板上,并在其中形成有第一和第二间隙孔。 销的第一和第二领域突出穿过第一和第二间隙孔。 多芯片印刷电路板可以安装在功率模块的下方,使得导热针接触第一和第二提供芯片的表面。 提供的芯片在物理上靠近电源模块,并且借助于所提供的芯片和导热引脚之间的接触来提供所提供的芯片的热管理。 多芯片印刷电路板上的空间是保守的。
    • 42. 发明授权
    • Electronic assembly having a removable power supply
    • 具有可拆卸电源的电子组件
    • US06659779B1
    • 2003-12-09
    • US10237317
    • 2002-09-09
    • Shaun L. HarrisEric C. PetersonDavid Fisk
    • Shaun L. HarrisEric C. PetersonDavid Fisk
    • H05K100
    • H05K7/1457G06F1/183G06F1/189H05K1/148H05K3/36H05K3/361
    • An electronic device comprises a first chassis, a second chassis, and at least one flexible circuit extending therebetween. The first chassis is oriented along a first axis and comprises at least one first microprocessor. The second chassis is oriented along a second axis and comprises at least one power generating component. The flexible circuit comprises a first end and a second end, wherein the first end is connectable to the first chassis and the second end is connectable to the second chassis. The first chassis is movable relative to the second chassis between a position wherein the first axis is substantially perpendicular to the second axis and a position wherein the first axis is substantially parallel to the second axis.
    • 电子设备包括第一机架,第二机架以及在它们之间延伸的至少一个柔性电路。 第一底盘沿着第一轴线定向并且包括至少一个第一微处理器。 第二机架沿着第二轴线定向并且包括至少一个发电部件。 柔性电路包括第一端和第二端,其中第一端可连接到第一机架,第二端可连接到第二机架。 第一底盘可相对于第二底盘移动,在第一轴线基本上垂直于第二轴线的位置和第一轴线基本上平行于第二轴线的位置之间。