专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07360104B2 Redundant voltage distribution system and method for a memory module having multiple external voltages 有权
标题翻译：具有多个外部电压的存储器模块的冗余电压分配系统和方法
公开(公告)号：US07360104B2
公开(公告)日：2008-04-15
申请号：US11047304
申请日：2005-01-31
申请人： Shaun L. Harris , Gary Williams , Eric C. Peterson , Jeffrey Allan Oberski
发明人： Shaun L. Harris , Gary Williams , Eric C. Peterson , Jeffrey Allan Oberski
IPC分类号： G06F1/26
CPC分类号： G11C5/147 , G11C5/04 , G11C11/4074
摘要： A memory assembly module including an on-board voltage regulator for converting an externally supplied voltage into appropriate local voltage levels for powering memory devices of the memory assembly module.
摘要翻译：一种存储器组件模块，包括板上电压调节器，用于将外部提供的电压转换成适当的局部电压电平，为存储器组件模块的存储器件供电。

2. 发明授权

US09450452B2 Transformer coupled current capping power supply topology 有权
标题翻译：变压器耦合限流电源拓扑
公开(公告)号：US09450452B2
公开(公告)日：2016-09-20
申请号：US13438540
申请日：2012-04-03
申请人： Shaun L. Harris , Eric C. Peterson
发明人： Shaun L. Harris , Eric C. Peterson
IPC分类号： H02J1/00 , H02J9/06
CPC分类号： H02J9/061 , H02J7/0052 , H02J9/06 , H02M1/08 , H02M1/4208 , H02M3/33515 , H02M2001/0009 , Y10T307/696
摘要： Described is a technology by which magnetic flux is used to provide backup power. A transformer has a line power source controllably coupled to a first input winding, and secondary power source controllably coupled to a second input winding. A controller monitors the line power and switches to the secondary power source if the line power voltage drops too low, or uses the secondary power source to augment the line power source if the line power current gets too high. Also described is incrementally transitioning from the secondary power source back to the line power source.
摘要翻译：描述了使用磁通来提供备用电力的技术。变压器具有可控地耦合到第一输入绕组的线路电源，以及可控地耦合到第二输入绕组的次级电源。如果线路电源电压降得太低，则控制器监视线路电源并切换到次级电源，或者如果线路电源电流过高，则使用辅助电源来增加线路电源。还描述了从次级电源向线路电源递增地转变。

3. 发明授权

US09348394B2 Managing computational workloads of computing apparatuses powered by renewable resources 有权
标题翻译：管理由可再生资源供电的计算设备的计算工作量
公开(公告)号：US09348394B2
公开(公告)日：2016-05-24
申请号：US12881187
申请日：2010-09-14
申请人： David Tennyson Harper, III , Eric C. Peterson , Shaun L. Harris , Christian L. Belady
发明人： David Tennyson Harper, III , Eric C. Peterson , Shaun L. Harris , Christian L. Belady
IPC分类号： G05D3/12 , G06F1/32
CPC分类号： G06N7/005 , G01W1/10 , G06F1/3206 , G06F1/329 , Y02D10/24
摘要： A method described herein includes an act of receiving data that is indicative of predicted weather conditions for a particular geographic region, wherein the particular geographic region has an energy generation system therein, and wherein the energy generation system utilizes at least one renewable energy resource to generate electrical power. The method also includes the act of scheduling a computational workload for at least one computer in a data center based at least in part upon the data that is indicative of the predicted weather conditions for the particular geographic region.
摘要翻译：本文描述的方法包括接收指示特定地理区域的预测天气条件的数据的动作，其中特定地理区域具有其中的能量生成系统，并且其中能量产生系统利用至少一个可再生能源来产生电力。该方法还包括至少部分地基于指示特定地理区域的预测天气条件的数据来调度数据中心中的至少一个计算机的计算工作负荷的动作。

4. 发明授权

US07280364B2 Apparatus and method for multiprocessor circuit board 失效
标题翻译：多处理器电路板的装置和方法
公开(公告)号：US07280364B2
公开(公告)日：2007-10-09
申请号：US10996722
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/184 , G06F1/185 , G06F1/20 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
摘要翻译：一个实施例包括具有耦合到第二PCB的第一印刷电路板（PCB）的电子组件。第二PCB具有至少两个处理器并且设置在第一PCB上方。散热装置设置在第二PCB的上方，从两个处理器散热，并提供一个气流路径。电力系统与散热装置相邻并且在气流路径的路径中。

5. 发明授权

US08804313B2 Enclosure power distribution architectures 有权
标题翻译：外壳配电架构
公开(公告)号：US08804313B2
公开(公告)日：2014-08-12
申请号：US13530466
申请日：2012-06-22
申请人： Eric C. Peterson , Shaun L. Harris
发明人： Eric C. Peterson , Shaun L. Harris
IPC分类号： H02B1/26 , H05K1/00 , H05K5/00 , G06F1/18 , G06F1/26 , G06F1/16
CPC分类号： H02B1/015 , H05K1/0263 , H05K1/141 , H05K7/1457 , Y10T307/50 , Y10T307/582 , Y10T307/62
摘要： Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.
摘要翻译：计算机箱可以设计成将电力从电源分配到负载单元（例如，处理器，存储设备或网络路由器）。该架构可能会影响机箱内组件的效率，成本，模块化，可访问性和空间利用率。这里提出的是配电架构，其涉及沿着壳体内的第一（例如，垂直）轴定向的配电板，包括配置成在沿第二（例如，横向）轴定向的一组负载板之间分配功率的功率互连与沿着第三（例如矢状）轴定向的一组负载单元连接，以及一组沿着第三轴定向的电源。该方向可以紧凑地并且靠近配电系统中的电源附近的负载，并且导致相对较低的局部电流，使得能够使用印刷电路板用于配电板和负载板。

6. 发明申请

US20120065788A1 MANAGING COMPUTATIONAL WORKLOADS OF COMPUTING APPARATUSES POWERED BY RENEWABLE RESOURCES 有权
标题翻译：管理由可再生资源供电的计算设备的计算工作量
公开(公告)号：US20120065788A1
公开(公告)日：2012-03-15
申请号：US12881187
申请日：2010-09-14
申请人： David Tennyson Harper, III , Eric C. Peterson , Shaun L. Harris , Christian L. Belady
发明人： David Tennyson Harper, III , Eric C. Peterson , Shaun L. Harris , Christian L. Belady
IPC分类号： G06F1/26 , G06F15/18
CPC分类号： G06N7/005 , G01W1/10 , G06F1/3206 , G06F1/329 , Y02D10/24
摘要： A method described herein includes an act of receiving data that is indicative of predicted weather conditions for a particular geographic region, wherein the particular geographic region has an energy generation system therein, and wherein the energy generation system utilizes at least one renewable energy resource to generate electrical power. The method also includes the act of scheduling a computational workload for at least one computer in a data center based at least in part upon the data that is indicative of the predicted weather conditions for the particular geographic region.
摘要翻译：本文描述的方法包括接收指示特定地理区域的预测天气条件的数据的动作，其中特定地理区域具有其中的能量生成系统，并且其中能量产生系统利用至少一个可再生能源来产生电力。该方法还包括至少部分地基于指示特定地理区域的预测天气条件的数据来调度数据中心中的至少一个计算机的计算工作负荷的动作。

7. 发明授权

US07499281B2 Multi-chip module with power system 有权
标题翻译：带电源系统的多芯片模块
公开(公告)号：US07499281B2
公开(公告)日：2009-03-03
申请号：US11968520
申请日：2008-01-02
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译：实施例包括具有电力系统的多芯片模块的装置，方法和系统。示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。电力系统耦合到并垂直放置在PCB上方。散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。

8. 发明授权

US07336490B2 Multi-chip module with power system 有权
标题翻译：带电源系统的多芯片模块
公开(公告)号：US07336490B2
公开(公告)日：2008-02-26
申请号：US10996721
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
IPC分类号： H05K7/20 , F28F7/00 , F28D15/00
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译：实施例包括具有电力系统的多芯片模块的装置，方法和系统。示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。电力系统耦合到并垂直放置在PCB上方。散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。

9. 发明授权

US07254027B2 Processor module for system board 有权
标题翻译：系统板处理器模块
公开(公告)号：US07254027B2
公开(公告)日：2007-08-07
申请号：US11021504
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K1/0203 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
摘要翻译：实施例包括用于系统板的处理器模块的装置，方法和系统。在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。散热装置通过热交换从处理器散热。第二部分设置在第一部分和系统板之间产生的空间中。第二部分具有用于向处理器提供电力的电力系统板。电源系统板相邻并平行于PCB的第二侧延伸。

10. 发明授权

US07068515B2 Multi-chip module with stacked redundant power 失效
标题翻译：具有堆叠冗余电源的多芯片模块
公开(公告)号：US07068515B2
公开(公告)日：2006-06-27
申请号：US10996478
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
IPC分类号： H05K7/20
CPC分类号： H05K7/1092 , Y10T307/505
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.
摘要翻译：实施例包括具有堆叠冗余电力的多芯片模块的装置，方法和系统。示例性装置具有具有多个处理器的模块。第一电力系统以垂直堆叠的配置耦合到模块以向模块提供电力。第二电力系统向模块提供电力并且以垂直堆叠的配置耦合到第一电力系统。每个电力系统作为一个副本，用于防止一个电力系统故障时模块的故障。散热装置设置在第一和第二电力系统和第一电力系统和模块之间，使得散热装置通过热交换而散热，远离处理器，第一电力系统和第二电力系统。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式