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41. 发明申请

US20060262506A1 Heat sink assembly 有权
标题翻译：散热器组件
公开(公告)号：US20060262506A1
公开(公告)日：2006-11-23
申请号：US11244916
申请日：2005-10-05
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
摘要翻译：散热器组件包括散热器（10），从吊具延伸的多个散热片（12），紧固件（20）和固定到紧固件的固定套管（30）。紧固件包括具有螺纹底端（208）的头部（200）和轴（204）。套筒包括圆柱形壁（302），上开口端（304）和下开口端（306）。套筒还具有与壁垂直连接并在下开口端延伸的环形基座（308）。头部被接收在墙壁上并接触基座。轴延伸穿过吊具。压头弹簧（22）在头部和吊具之间提供，用于向下推动吊具以与发热电子装置接合。

42. 发明授权

US08245765B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08245765B2
公开(公告)日：2012-08-21
申请号：US12200874
申请日：2008-08-28
申请人： Shi-Wen Zhou , Chun-Chi Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/00 , H05K7/20 , F25D23/12
CPC分类号： H01L23/467 , F28D15/0233 , F28D15/0275 , F28F1/20 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.
摘要翻译：从发热电子元件散热的散热装置包括：填充有相变工作流体的罐;密封地固定在罐顶部并与罐连通的外壳;位于罐顶部上方的风扇; 壳体，包括容纳在壳体中的驱动构件和延伸穿过驱动构件的中心的轴的叶轮。轴具有向下延伸穿过壳体的底部的下端到罐的顶部的中心，并且上端向上延伸穿过壳体的顶部以接合风扇。工作流体被发热电子元件加热并蒸发到壳体中以与驱动构件接合以旋转并驱动风扇同步旋转。

43. 发明授权

US07967059B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07967059B2
公开(公告)日：2011-06-28
申请号：US12241063
申请日：2008-09-30
申请人： Yi-Jiun Li , Shi-Wen Zhou , Chun-Chi Chen
发明人： Yi-Jiun Li , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.
摘要翻译：散热装置包括底座，翅片组，连接基座和翅片组的多个热管，覆盖翅片组的风扇盖和位于风扇盖侧面的风扇。热管接收在基座中并延伸穿过翅片组。热管被容纳在翅片组的两个相对侧并且夹在风扇盖和翅片组之间。风扇盖包括主体和从主体延伸的一对侧壁。侧壁各自包括形成在其外表面上的多个散热片，用于增加散热装置的散热面。

44. 发明授权

US07916469B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07916469B2
公开(公告)日：2011-03-29
申请号：US12436786
申请日：2009-05-07
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F2215/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
摘要翻译：适于冷却安装在印刷线路板上的电子装置的散热装置包括热接触电子装置的散热器，包括多个散热片的散热片组件，将翅片组件和散热器互连的第一热管和多个插入翅片组件中的支撑柱。

45. 发明授权

US07755894B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07755894B2
公开(公告)日：2010-07-13
申请号：US11309344
申请日：2006-07-28
申请人： Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F2210/10 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.
摘要翻译：散热装置包括具有平坦顶面的第一基板，多个平坦化的热管，位于热管上方的散热片组件和形成在热管和散热片组件之间的导热层。导热层具有与热管接触的平坦表面。热管被支撑在第一基板的顶表面上。第一底板具有用于与电子包装件接合的平坦底面。每个热管包括蒸发部分和从蒸发部分弯曲的冷凝部分，并且热管的蒸发部分彼此并排地邻接。

46. 发明授权

US07447025B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07447025B2
公开(公告)日：2008-11-04
申请号：US11163820
申请日：2005-11-01
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.
摘要翻译：散热装置（1）包括散热器（10），风扇（20）和空气冷却部件（30）。通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

47. 发明申请

US20080121370A1 HEAT DISSIPATION DEVICE WITH A HEAT PIPE 审中-公开
标题翻译：带散热管的散热装置
公开(公告)号：US20080121370A1
公开(公告)日：2008-05-29
申请号：US11564274
申请日：2006-11-28
申请人： Wen-Li Luo , Shi-Wen Zhou , Chun-Chi Chen
发明人： Wen-Li Luo , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat spreader (20), a heat sink (10) attached to the heat spreader (20), a sleeve (40) and a heat pipe (30). The heat spreader (20) is for contacting a heat-generating electronic device. The heat sink (10) includes a base (12) and a plurality of fins (14, 15) extending from the base (12). The sleeve (40) is inserted into a through hole (16) defined in the fins (14, 15). The heat pipe (30) includes an evaporating portion (31) sandwiched between the heat spreader (20) and the base (12), and a condensing portion (33) received in the sleeve (40).
摘要翻译：散热装置包括散热器（20），附接到散热器（20）的散热器（10），套筒（40）和热管（30）。散热器（20）用于接触发热电子设备。散热器（10）包括基部（12）和从基部（12）延伸的多个散热片（14,15）。套筒（40）插入到限定在翅片（14,15）中的通孔（16）中。热管（30）包括夹在散热器（20）和基座（12）之间的蒸发部分（31）和容纳在套筒（40）中的冷凝部分（33）。

48. 发明申请

US20080017351A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
标题翻译：带热管的散热装置
公开(公告)号：US20080017351A1
公开(公告)日：2008-01-24
申请号：US11309305
申请日：2006-07-24
申请人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.
摘要翻译：散热装置用于与发热电子装置接触以从电子装置移除热量。散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。

49. 发明申请

US20070159798A1 HEAT DISSIPATION DEVICE HAVING PHASE-CHANGEABLE MEDIUM THEREIN 失效
标题翻译：具有相变介质的热释放装置
公开(公告)号：US20070159798A1
公开(公告)日：2007-07-12
申请号：US11306700
申请日：2006-01-09
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F2215/10 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.
摘要翻译：散热装置包括散热体和与散热装置热结合的导热体。散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。每个翅片在其一端分支多个部分。导热体包括热嵌合在散热体的中心部分的通孔中的柱。在该散热体的中心部分之间限定空腔。空腔中含有相变介质，一旦该塔从发热电子设备中吸收热量，该腔就变成蒸汽。

50. 发明授权

US07218522B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07218522B2
公开(公告)日：2007-05-15
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

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