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1. 发明授权

US07218522B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07218522B2
公开(公告)日：2007-05-15
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

2. 发明申请

US20060018096A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060018096A1
公开(公告)日：2006-01-26
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

3. 发明申请

US20060032617A1 Heat sink electronic components 审中-公开
标题翻译：散热器电子元件
公开(公告)号：US20060032617A1
公开(公告)日：2006-02-16
申请号：US11012958
申请日：2004-12-14
申请人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Chi Liang , Meng Fu
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0275 , F28F3/02 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.
摘要翻译：一种用于电子部件的散热器包括基座，耦合到基座的第一散热构件，嵌入在基座中的热管和耦合到基座的第二散热构件。基座由第一金属材料制成，并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。第一散热构件由第二金属材料制成并且联接到基座的吸热部分。第二散热构件由第二金属材料制成并且连接到基座的导热部分。第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。

4. 发明授权

US07365978B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07365978B2
公开(公告)日：2008-04-29
申请号：US11135593
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
摘要翻译：散热装置包括散热器（60），散热器（70）和传热管（80）。散热器包括底盘（62），与底盘分离的板（64）和在底盘和板之间延伸的多个翅片（66）。散热器包括平行于翅片的基座（72）。每个传热管包括热定位到底盘的热吸收部分（82），热定位于板的散热部分（84）和设置在吸热部分和散热部。热传递部分被热接收在散热器的基座中。

5. 发明授权

US07047640B2 Method of manufacturing a heat dissipating device 失效
标题翻译：制造散热装置的方法
公开(公告)号：US07047640B2
公开(公告)日：2006-05-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B21D53/06 , B23P15/26
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.
摘要翻译：一种制造散热装置的方法，所述方法包括以下步骤：a）提供热管，固体焊料条和散热片，其中所述散热器包括在其一侧限定凹槽的基座; b）将焊条和热管依次放入散热器的槽中; c）加热熔化焊料条并同时按压热管以使热管的外表面与限定槽的所述一侧共面; 和d）冷却以实现散热装置，其中焊条均匀分布在热管和基座之间。

6. 发明申请

US20060059684A1 Method of manufacturing a heat dissipating device 失效
公开(公告)号：US20060059684A1
公开(公告)日：2006-03-23
申请号：US11069743
申请日：2005-03-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： B23P15/26 , B21D53/06
CPC分类号： B23K1/0012 , B23K2101/06 , B23K2101/14 , B23P2700/10 , F28D15/0275 , H01L21/4882 , H01L23/427 , H01L2924/0002 , Y10T29/49353 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49378 , Y10T29/49393 , H01L2924/00
摘要： A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

7. 发明申请

US20070263358A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070263358A1
公开(公告)日：2007-11-15
申请号：US11308847
申请日：2006-05-15
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/467 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
摘要翻译：散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。主散热器包括设置在基座中间的基座（12）和散热部分（14）。二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。底座被放置在基板上，翅片组件布置在散热部分周围。主散热器部分地叠置在具有紧凑结构的二次散热器上。散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。

8. 发明授权

US07631850B2 Apparatus for supporting cooling device 失效
标题翻译：用于支撑冷却装置的装置
公开(公告)号：US07631850B2
公开(公告)日：2009-12-15
申请号：US11135745
申请日：2005-05-24
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).
摘要翻译：一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24），在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。

9. 发明授权

US07296617B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07296617B2
公开(公告)日：2007-11-20
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： F28D15/04
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

10. 发明授权

US07755894B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07755894B2
公开(公告)日：2010-07-13
申请号：US11309344
申请日：2006-07-28
申请人： Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F2210/10 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.
摘要翻译：散热装置包括具有平坦顶面的第一基板，多个平坦化的热管，位于热管上方的散热片组件和形成在热管和散热片组件之间的导热层。导热层具有与热管接触的平坦表面。热管被支撑在第一基板的顶表面上。第一底板具有用于与电子包装件接合的平坦底面。每个热管包括蒸发部分和从蒸发部分弯曲的冷凝部分，并且热管的蒸发部分彼此并排地邻接。

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