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    • 44. 发明授权
    • Method of preparing a compound semiconductor crystal
    • 化合物半导体晶体的制备方法
    • US06273947B1
    • 2001-08-14
    • US09274286
    • 1999-03-22
    • Tomohiro KawaseShinichi SawadaMasami Tatsumi
    • Tomohiro KawaseShinichi SawadaMasami Tatsumi
    • C30B900
    • C30B29/42C30B11/06C30B11/12
    • A method of preparing a compound semiconductor crystal is able to dope the crystal with carbon with high reproducibility. The method includes the steps of sealing a carbon oxide gas of a predetermined partial pressure and a compound semiconductor material in a gas-impermeable airtight vessel, increasing the temperature of the vessel to melt the compound semiconductor material sealed in the vessel, and then decreasing the temperature of the vessel to solidify the melted compound semiconductor material to grow a compound semiconductor crystal containing a predetermined amount of carbon. With this method, a compound semiconductor crystal with a carbon concentration of 0.1×1015 cm−3 to 20×1015 cm−3 is prepared with high reproducibility.
    • 制备化合物半导体晶体的方法能够以高重现性将碳掺杂。 该方法包括以下步骤:将不规则分压的氧化碳气体和化合物半导体材料密封在不透气体的气密容器中,增加容器的温度以熔化密封在容器中的化合物半导体材料,然后将 使熔融的化合物半导体材料固化,生长含有规定量的碳的化合物半导体晶体。 通过该方法,以高的再现性制备碳浓度为0.1×10 15 cm -3〜20×10 15 cm -3的化合物半导体晶体。
    • 45. 发明授权
    • Method for preparing compound semiconductor crystal
    • 化合物半导体晶体的制备方法
    • US5584929A
    • 1996-12-17
    • US400925
    • 1995-03-09
    • Tomohiro Kawase
    • Tomohiro Kawase
    • C30B11/00C30B11/04
    • C30B29/42C30B11/00C30B11/002Y10S117/90Y10T117/10
    • A method of preparing a compound semiconductor crystal in a crucible involves first forming a boron or boron compound containing layer on an inner surface of the crucible and heat treating the same to form a B.sub.2 O.sub.3 containing layer. The resulting pretreated crucible is the employed for preparing the compound semiconductor crystal. By pretreating the crucible in this manner, it is possible to previously form a homogenous B.sub.2 O.sub.3 film on the crucible interior surface while preventing incomplete and heterogeneous coating of the B.sub.2 O.sub.3 film. Consequently, it is possible to prevent a raw material melt from wetting the crucible interior surface and thus to suppress polycrystallization, thereby preparing a compound semiconductor single crystal with an excellent yield.
    • 在坩埚中制备化合物半导体晶体的方法包括首先在坩埚的内表面上形成含硼化合物或含硼化合物层并对其进行热处理以形成含B2O3的层。 所得预处理坩埚用于制备化合物半导体晶体。 通过以这种方式预处理坩埚,可以预先在坩埚内表面上形成均匀的B2O3膜,同时防止B2O3膜的不均匀涂层。 因此,可以防止原料熔体润湿坩埚内表面,从而抑制多晶化,从而以优异的成品率制备化合物半导体单晶。