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    • 9. 发明授权
    • Continuous copper electroplating method
    • 连续铜电镀方法
    • US08801912B2
    • 2014-08-12
    • US12401113
    • 2009-03-10
    • Naoyuki OmuraToshihisa IsonoKoji ShimizuShinji TachibanaTomohiro KawaseShunsaku Hoshi
    • Naoyuki OmuraToshihisa IsonoKoji ShimizuShinji TachibanaTomohiro KawaseShunsaku Hoshi
    • C25D21/18C25D17/00C25D3/38H05K3/24
    • C25D17/00C25D3/38C25D7/123C25D17/001C25D17/002C25D21/18H05K3/241
    • Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel. Plating performance impairing components, which are produced when the copper ion supplying salt is dissolved in the plating bath for replenishing the copper ions, are oxidized and decomposed, whereby defective plating due to the presence of the plating performance impairing components can be prevented.
    • 公开了一种通过在容纳硫酸铜电镀浴的电镀槽中使用不溶性阳极来重复电镀作为阴极的工件的方法,其中提供了不同于电镀槽的铜溶解容器,电镀浴是 转移到铜溶解容器中,并从铜溶解容器返回到电镀槽,用于使电镀槽和铜溶解容器之间的电镀槽循环,将铜离子供应盐装入铜溶解容器中并溶解在镀浴中 使得可以补充由电镀消耗的铜离子,并且将被镀工件连续电镀,其特征在于允许电镀液在阳极侧和阴极侧之间转移,电镀浴返回到 阳极将电镀液从铜溶解容器返回到电镀槽中。 当铜离子供应盐溶解在用于补充铜离子的镀浴中时产生的电镀性能损害部件被氧化分解,从而可以防止由于存在电镀性能损害部件而导致的不良电镀。