会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 41. 发明授权
    • Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
    • 用于制造图像传感器封装等的框架结构和半导体附着工艺以及所产生的封装
    • US07645635B2
    • 2010-01-12
    • US10919604
    • 2004-08-16
    • Alan G. WoodKyle K. KirbyWarren M. FarnworthSalman Akram
    • Alan G. WoodKyle K. KirbyWarren M. FarnworthSalman Akram
    • H01L21/00
    • H01L27/14618B33Y80/00H01L27/14625H01L2224/48091H01L2924/00014
    • A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.
    • 诸如图像传感器封装的半导体封装以及制造方法。 框架结构包括每个具有穿过其中的孔的框架阵列,图像传感器与盖玻片,过滤器,透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。 单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。 或者,框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上,其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口 ,然后安装其他包装组件。 在任一情况下,将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。 各种外部连接方法可用于包装。
    • 44. 发明授权
    • Image sensor packages and frame structure thereof
    • 图像传感器封装及其框架结构
    • US07791184B2
    • 2010-09-07
    • US11411265
    • 2006-04-26
    • Alan G. WoodKyle K. KirbyWarren M. FarnworthSalman Akram
    • Alan G. WoodKyle K. KirbyWarren M. FarnworthSalman Akram
    • H01L23/02
    • H01L27/14618B33Y80/00H01L27/14625H01L2224/48091H01L2924/00014
    • A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used.
    • 诸如图像传感器封装的半导体封装。 框架结构包括每个具有穿过其中的孔的框架阵列,图像传感器与盖玻片,过滤器,透镜或其它部件组合的模具可以精确地相互对准地安装在该框架中。 单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。 或者,框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上,其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口 ,然后安装其他包装组件。 在任一情况下,将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。 可以使用各种外部连接方法。