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41. 发明授权

US06617021B2 Adhesive composition and adhesive sheet for semiconductor devices 失效
公开(公告)号：US06617021B2
公开(公告)日：2003-09-09
申请号：US10068945
申请日：2002-02-11
申请人： Masaharu Kobayashi , Osamu Oka , Yasuhiro Yoshii
发明人： Masaharu Kobayashi , Osamu Oka , Yasuhiro Yoshii
IPC分类号： B32B2738
CPC分类号： C09J163/08 , C08G59/504 , C08L53/025 , C08L61/04 , C08L2666/02 , C08L2666/14 , C09J7/22 , C09J7/38 , C09J153/025 , C09J163/00 , C09J2203/326 , C09J2453/00 , C09J2461/00 , C09J2463/00 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/06135 , H01L2224/06136 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , Y10S428/901 , Y10T428/1476 , Y10T428/287 , Y10T428/31511 , Y10T428/31663 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.

42. 外观设计

USD408832S Combined video tape recorder and camera 失效
公开(公告)号：USD408832S
公开(公告)日：1999-04-27
申请号：US69103
申请日：1997-04-14
申请人： Masaharu Kobayashi
设计人： Masaharu Kobayashi

43. 发明授权

US5500294A Adhesive tape for electronic parts and liquid adhesive 失效
标题翻译：电子部件和液体胶粘剂胶带
公开(公告)号：US5500294A
公开(公告)日：1996-03-19
申请号：US326428
申请日：1994-10-20
申请人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C08G73/12 , C09J4/00 , C09J4/02 , C09J7/00 , C09J7/02 , C09J109/02 , C09J119/00 , C09J121/00 , C09J179/04 , C09J179/08 , H01L21/301 , H01L21/52 , H01L23/29 , H01L23/31 , H05K13/00 , C09J133/20
CPC分类号： C09J7/0203 , C09J119/006 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896
摘要： This invention is to provide a liquid adhesive can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same. The liquid adhesive of this invention is obtainable by dissolving(a) a butadiene-acrylonitrile copolymer having piperazinylethylaminocarbonyl groups at both terminals and having a weight average molecular weight of 1,000-50,000, and an acrylonitrile content of 5-50% by weight, represented by the following formula (I): ##STR1## wherein, m=50-95, and n=5-50; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
摘要翻译：本发明提供一种液体粘合剂可以在较低的温度下粘附和固化并且具有足够的耐热性和可靠性等，以及使用其的胶带。本发明的液体粘合剂可通过以下方式获得：（a）在两端具有哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物，其重均分子量为1,000-50,000，丙烯腈含量为5-50重量％，以下式（I）：其中m = 50-95，n = 5-50; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内。将其应用于耐热膜或脱模膜的一个表面的一个或两个表面以形成粘合剂层，从而获得电子部件用胶带。

44. 发明授权

US5428113A Piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer and process for producing the same 失效
标题翻译：含有哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物及其制备方法
公开(公告)号：US5428113A
公开(公告)日：1995-06-27
申请号：US324542
申请日：1994-10-18
申请人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C08C19/36 , C08F8/30 , C08F8/32 , C08F20/52 , C08F220/60 , C08F236/04 , C09J133/20 , C09J147/00
CPC分类号： C08F8/30 , C08C19/36
摘要： The piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer of this invention is a novel substance useful as an adhesive component for adhesive tapes, which tapes are used in the interior of a resin-sealed type semiconductor device. The copolymer has a weight average molecular weight of 10,000-200,000, and is represented by the following general formula (I) and obtained by condensing a carboxyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000 with N-aminoethylpiperazine in the presence of a phosphite and a pyridine derivative to undergo the amidation. ##STR1## wherein k, m, and n indicate molar proportions, where n is taken as 1, k is a number in the range of 3-175, and m is a number in the range of 0.3-93.
摘要翻译：本发明的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物是用作粘合带的粘合剂组分的新型物质，这些胶带用于树脂密封型半导体器件的内部。共聚物的重均分子量为10,000〜200,000，由以下通式（I）表示，通过将重均分子量为10,000〜200,000的含羧基的丁二烯 - 丙烯腈共聚物与N-氨基乙基哌嗪在亚磷酸盐和吡啶衍生物的存在下进行酰胺化。（I）其中k，m和n表示摩尔比例，其中n取为1，k为3-175范围内的数，m为0.3-93范围内的数。

45. 发明授权

US4984050A Gate-array type intergated circuit semiconductor device 失效
标题翻译：门阵列型中间电路半导体器件
公开(公告)号：US4984050A
公开(公告)日：1991-01-08
申请号：US297628
申请日：1989-01-13
申请人： Masaharu Kobayashi
发明人： Masaharu Kobayashi
IPC分类号： H01L21/768 , H01L21/82 , H01L23/522 , H01L27/118
CPC分类号： H01L27/11801 , H01L2924/0002 , Y10S257/903 , Y10S257/906
摘要： A gate array type integrated circuit semiconductor device includes a semiconductor substrate, in a basic cell forming portion of which are formed a plurality of impurity regions of basic circuit elements. The impurity regions form a plurality of basic cells. A field insulating layer is also formed on the substrate, which is partially embedded in the major surface of the substrate and is formed entirely on a wiring channel forming portion of the substrate and selectively on the basic cell forming portion of the same to surround each of the impurity regions. An insulating film is formed on the field insulating layer. A wiring structure is provided, which includes mutual wirings formed of a first level conductive layer, internal wirings, and interconnecting wirings formed of a second level conductive layer higher than the first level conductive layer. Each of the mutual wirings is formed only on the insulating film formed on the wiring channel forming portion and is connected to the impurity regions through the interconnecting and internal wirings.
摘要翻译：门阵列型集成电路半导体器件包括半导体衬底，其基本单元形成部分形成有多个基本电路元件的杂质区域。杂质区形成多个碱性电池。场致绝缘层也形成在衬底上，该衬底被部分地嵌入衬底的主表面中，并且整体地形成在衬底的布线沟道形成部分上，并且选择性地在其基本单元形成部分上围绕杂质区。在场绝缘层上形成绝缘膜。提供一种布线结构，其包括由第一层导电层，内部布线和由比第一层导电层高的第二层导电层形成的互连布线形成的互连。每个相互配线仅形成在形成在布线沟道形成部分上的绝缘膜上，并且通过互连和内部布线连接到杂质区域。

46. 外观设计

USD312824S Television receiver 失效
公开(公告)号：USD312824S
公开(公告)日：1990-12-11
申请号：US252972
申请日：1988-10-04
申请人： Masaharu Kobayashi
设计人： Masaharu Kobayashi

47. 发明授权

US08835266B2 Method and structure for compound semiconductor contact 有权
标题翻译：化合物半导体接触的方法和结构
公开(公告)号：US08835266B2
公开(公告)日：2014-09-16
申请号：US13085511
申请日：2011-04-13
申请人： Norma E. Sosa Cortes , Edward W. Kiewra , Masaharu Kobayashi , Kuen-Ting Shiu
发明人： Norma E. Sosa Cortes , Edward W. Kiewra , Masaharu Kobayashi , Kuen-Ting Shiu
IPC分类号： H01L21/336 , H01L29/66 , H01L29/78 , H01L29/417
CPC分类号： H01L29/66522 , H01L29/41783 , H01L29/66628 , H01L29/66636 , H01L29/7838 , H01L29/7848
摘要： The present disclosure provides a buried channel semiconductor structure in which a crystallographic wet etch is used to tailor the profile of etched regions formed into a multilayered substrate which includes a compound semiconductor layer located atop a buried semiconductor channel material layer. The use of crystallographic wet etching on a compound semiconductor allows one to tailor the shape of a source recess region and a drain recess region formed into a multilayered substrate. This allows for the control of gate overlap/underlap. Also, the use of crystallographic wet etching on a compound semiconductor allows independent control of the length of an underlying buried semiconductor channel region.
摘要翻译：本公开提供了掩埋沟道半导体结构，其中使用结晶湿蚀刻来定制形成多层衬底的蚀刻区域的轮廓，其包括位于掩埋半导体沟道材料层顶部的化合物半导体层。在化合物半导体上使用结晶湿式蚀刻可以使形成多层基板的源极凹部区域和漏极凹陷区域的形状成为可能。这允许控制栅极重叠/欠压。此外，在化合物半导体上使用晶体湿式蚀刻可以独立控制下面的掩埋半导体沟道区的长度。

48. 发明授权

US08524614B2 III-V compound semiconductor material passivation with crystalline interlayer 有权
标题翻译： III-V化合物半导体材料钝化与晶体中间层
公开(公告)号：US08524614B2
公开(公告)日：2013-09-03
申请号：US12955203
申请日：2010-11-29
申请人： Kuen-Ting Shiu , Dechao Guo , Shu-Jen Han , Edward W. Kiewra , Masaharu Kobayashi
发明人： Kuen-Ting Shiu , Dechao Guo , Shu-Jen Han , Edward W. Kiewra , Masaharu Kobayashi
IPC分类号： H01L21/31
CPC分类号： H01L29/0603 , H01L21/28158 , H01L21/28264 , H01L29/517 , H01L29/66522 , H01L29/78 , H01L29/7833
摘要： The present disclosure reduces and, in some instances, eliminates the density of interface states in III-V compound semiconductor materials by providing a thin crystalline interlayer onto an upper surface of a single crystal III-V compound semiconductor material layer to protect the crystallinity of the single crystal III-V compound semiconductor material layer's surface atoms prior to further processing of the structure.
摘要翻译：本公开通过在单晶III-V化合物半导体材料层的上表面上提供薄的晶体中间层来减少并且在一些情况下消除III-V族化合物半导体材料中的界面态的密度，以保护单晶III-V化合物半导体材料层的结晶度单晶III-V化合物半导体材料层的表面原子在进一步处理结构之前。

49. 外观设计

USD440556S1 Speaker box 失效
公开(公告)号：USD440556S1
公开(公告)日：2001-04-17
申请号：US29119079
申请日：2000-02-23
申请人： Masaharu Kobayashi , Akihiro Akiyama
设计人： Masaharu Kobayashi , Akihiro Akiyama

50. 发明授权

US5512628A Adhesive tape for electronic parts and liquid adhesive 失效
标题翻译：电子部件和液体胶粘剂胶带
公开(公告)号：US5512628A
公开(公告)日：1996-04-30
申请号：US462367
申请日：1995-06-05
申请人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
发明人： Yukinori Sakumoto , Takeshi Hashimoto , Katsuji Nakaba , Masaharu Kobayashi , Takeshi Nishigaya , Fumiyoshi Yamanashi
IPC分类号： C09J4/00 , C09J7/00 , C09J7/02 , C09J109/02 , C09J121/00 , H01L21/301 , H01L21/52 , H01L23/29 , H01L23/31 , H05K13/00 , C08F8/30
CPC分类号： C09J109/02 , C09J7/0203 , H01L24/29 , C08K5/3415 , C08K5/544 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2924/181 , Y10T428/28 , Y10T428/31663 , Y10T428/31667 , Y10T428/31931
摘要： This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts.
摘要翻译：本发明提供一种本发明的液体粘合剂可以在相对低的温度下粘合和固化，并且具有足够的耐热性和可靠性等，以及使用它们的粘合带。本发明的液体粘合剂可通过将（a）重均分子量为10,000-200,000，丙烯腈含量为5-50重量％，氨基当量为500-200重量％的含哌嗪基乙基氨基羰基的丁二烯 - 丙烯腈共聚物， 10,000，由下式（I）表示：其中，k，m和n为摩尔比，n为1，k为3-175的数，m为数量为0.3〜93; 和（b）具有至少两个马来酰亚胺基团的化合物，组分（b）基于100重量份的组分（a）的比例在10至900重量份的范围内。将其应用于耐热膜或脱模膜的一个表面的一个或两个表面以形成粘合剂层，从而获得电子部件用胶带。

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