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41. 发明专利

JP2005273074A Hydrogen storage body and hydrogen storage container 审中-公开
标题翻译：氢存储体和氢储存容器
公开(公告)号：JP2005273074A
公开(公告)日：2005-10-06
申请号：JP2004087484
申请日：2004-03-24
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： IGUCHI MASAHITO , TOKIYODA KAZUHIKO
IPC分类号： F17C11/00 , B01J20/28 , C01B3/00 , D06M11/74 , H01M8/04
CPC分类号： Y02E60/321 , Y02E60/324
摘要： PROBLEM TO BE SOLVED: To provide a hydrogen storage body hardly causing separation of a hydrogen storage material carried by the surface of a filament, and having a large hydrogen storage capacity per unit volume or unit weight; and to provide a hydrogen storage container storing the hydrogen storage body in a container. SOLUTION: The hydrogen storage container is obtained by storing the hydrogen storage body obtained by winding the filament carrying the hydrogen storage material through a low-melting point glass on the surface of the filament, on a core member so as to form a porous mesh shape, and fixing the hydrogen storage material on the surface of the filament by a heat treatment. The hydrogen storage body does not cause the separation of the hydrogen storage material, and has the large hydrogen storage capacity per unit weight. As a result, the hydrogen storage container having the large hydrogen storage capacity and not requiring a large storage space is provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供几乎不会使长丝表面携带的储氢材料分离并且每单位体积或单位重量具有大的储氢能力的储氢体; 并且提供将储氢体储存在容器中的储氢容器。解决方案：储氢容器是将通过将携带储氢材料的细丝通过低熔点玻璃卷绕在细丝表面上而获得的储氢体在核心部件上形成的，通过热处理将储氢材料固定在长丝的表面上。氢存储体不会导致储氢材料的分离，并且每单位重量具有大的储氢能力。结果，提供了具有大的储氢容量并且不需要大的储存空间的储氢容器。版权所有（C）2006，JPO＆NCIPI

42. 发明专利

JP2005035839A Low thermal expansion ceramic joined body 审中-公开
标题翻译：低热膨胀陶瓷接合体
公开(公告)号：JP2005035839A
公开(公告)日：2005-02-10
申请号：JP2003274442
申请日：2003-07-15
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： ISHII MAMORU , IGUCHI MASAHITO , KATAOKA MASAKO , UMETSU MOTOHIRO , NAKAMURA HIROAKI
IPC分类号： C04B37/00
摘要： PROBLEM TO BE SOLVED: To provide a low thermal expansion ceramic joined body having low thermal expansion coefficient, no residual internal stress in the joined part, rigidity comparable to that of a conventional ceramic and high joining strength.
SOLUTION: The low thermal expansion ceramic joined body is formed by joining a base material composed of a low thermal expansion ceramic with a joining material composed of a low thermal expansion ceramic having a melting temperature lower than that of the base material. The average coefficient of thermal expansion of the base material and the joining material at 20-30°C is -1×10
-6 to 1×10
-6 /°C and the joining material is constituted of a composite material composed of lithium aluminosilicate, nitride and magnesium oxide.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有低热膨胀系数的低热膨胀陶瓷接合体，在接合部分中没有残留的内部应力，刚性与常规陶瓷相当，并且接合强度高。解决方案：低热膨胀陶瓷接合体通过将由低热膨胀陶瓷组成的基材与由熔化温度低于基材的低热膨胀陶瓷组成的接合材料接合而形成。基体材料和接合材料在20-30℃的平均热膨胀系数为-1×10 -6 至1×10 -6 /℃ 接合材料由铝硅酸锂，氮化物和氧化镁组成的复合材料构成。版权所有（C）2005，JPO＆NCIPI

43. 发明专利

JP2004292249A Low thermal expansion and high rigidity ceramic and its manufacture method 审中-公开
标题翻译：低热膨胀和高刚性陶瓷及其制造方法
公开(公告)号：JP2004292249A
公开(公告)日：2004-10-21
申请号：JP2003087730
申请日：2003-03-27
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： NAKAMURA HIROAKI , ISHII MAMORU , IGUCHI MASAHITO , KATAOKA MASAKO , UMETSU MOTOHIRO
IPC分类号： G03F7/20 , C04B35/19 , H01L21/027 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a ceramic which has low thermal expansion and high rigidity and is optimum for material of various kinds of devices such as an exposure device, components and fixtures used in a semiconductor manufacture process, and to provide a manufacture method of the ceramic. SOLUTION: In the manufacture method of the low thermal expansion and high rigidity ceramic, a molding obtained by molding ceramic raw material which contains β-eucryptite raw material powder of 97-99.5 mass.% and silicon nitride raw material powder of 0.5-3 mass.% is fired in the reducing environment. Thereby, such a ceramic having low thermal expansion coefficient and high rigidity that the relative density is ≥98%, the rigidity is 110-120 GPa and the thermal expansion coefficient is -0.5×10 -6 /°C to 0.3×10 -6 /°C can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有低热膨胀和高刚性的陶瓷，并且对于在半导体制造工艺中使用的诸如曝光装置，部件和夹具的各种装置的材料是最佳的，并且提供陶瓷的制造方法。解决方案：在低热膨胀和高刚性陶瓷的制造方法中，将通过模制含有97-99.5质量％的β-锂辉石原料粉末和0.5重量％的氮化硅原料粉末的陶瓷原料 -3质量％在还原环境中燃烧。因此，相对密度≥98％，刚性为110〜120GPa，热膨胀系数为-0.5×10 -6 /°的这种陶瓷的热膨胀系数低，刚性高可以得到C至0.3×10 -6 /℃。版权所有（C）2005，JPO＆NCIPI

44. 发明专利

JP2004269272A High stiffness low thermal expansion ceramic member 有权
公开(公告)号：JP2004269272A
公开(公告)日：2004-09-30
申请号：JP2003058132
申请日：2003-03-05
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： UMETSU MOTOHIRO , IGUCHI MASAHITO , KATAOKA MASAKO , NAKAMURA HIROAKI , ISHII MAMORU
IPC分类号： C04B35/00
摘要： PROBLEM TO BE SOLVED: To provide a high stiffness low thermal expansion ceramic member which has high stiffness in a desired direction while maintaining a sufficiently low coefficient of thermal expansion and which is suitably used as a member for a semiconductor production device, or the like. SOLUTION: The provided ceramic member has a plurality of base material layers 1, each comprising a composite material composed of a low thermal expansion ceramic and a ceramic having a high Young's modulus, and one stiffness layer or a plurality of stiffness layers 2, each comprising a carbon fiber or a high stiffness metal mesh, which are interposed between the base material layers 1. COPYRIGHT: (C)2004,JPO&NCIPI

45. 发明专利

JP2004186400A Vacuum chuck for semiconductor manufacturing apparatus 审中-公开
公开(公告)号：JP2004186400A
公开(公告)日：2004-07-02
申请号：JP2002351172
申请日：2002-12-03
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： IGUCHI MASAHITO , ISHII MAMORU , KATAOKA MASAKO , UMETSU MOTOHIRO , NAKAMURA HIROAKI
IPC分类号： C04B37/00 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a vacuum chuck for semiconductor manufacturing apparatus made of low thermal expansion ceramics with a low coefficient of thermal expansion and a high joining strength wherein no internal stress is left at a joining part between a low thermal expansion ceramics compact body and a low thermal expansion ceramics porous body. SOLUTION: The vacuum chuck for semiconductor manufacturing apparatus is configured by fitting the low thermal expansion ceramics porous body 5 with the same kind of type of material as that of a dent to the dent provided with a suction hole 4, in the low thermal expansion ceramics compact body 3 containing 50 to 95 mass % of β-eucryptite and 5 to 50 mass % of silicon carbide, and joining the body 5 and the dent with a joining member made of a low thermal expansion ceramics whose melting temperature is lower than that of the compact body. COPYRIGHT: (C)2004,JPO&NCIPI

46. 发明专利

JP2004177794A Mirror for position measurement and member for mirror 审中-公开
标题翻译：镜头位置测量和镜子会员
公开(公告)号：JP2004177794A
公开(公告)日：2004-06-24
申请号：JP2002345837
申请日：2002-11-28
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： UMETSU MOTOHIRO , KATAOKA MASAKO , IGUCHI MASAHITO , NAKAMURA HIROAKI , ISHII MAMORU
IPC分类号： G01B9/02 , G01B11/00 , G02B5/08 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide mirrors for position measurement having a low coefficient of thermal expansion and a high Young's modulus and high measurement accuracy and a member for the mirrors.
SOLUTION: The mirrors 4 and 5 for position measurement are disposed on a sample stage for horizontally holding a sample and obtain reflected light for position measurement by reflecting reflected light. The mirrors have mirror bodies 11 comprising a composite material of low-thermal expansion ceramics and high-Young's modulus ceramics and reflection films 12 disposed on the surfaces thereof, in which the surface roughness RA of the surfaces of the mirror bodies 11 formed with reflection films 12 is ≤10 nm.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供具有低热膨胀系数和高杨氏模量和高测量精度的位置测量用反射镜和用于反射镜的构件。
解决方案：用于位置测量的反射镜4和5设置在样品台上，用于水平保持样品，并通过反射反射光获得用于位置测量的反射光。反射镜具有镜体11，其包括低热膨胀陶瓷和高杨氏模量陶瓷的复合材料和设置在其表面上的反射膜12，其中镜体11的表面的表面粗糙度RA形成有反射膜 12≤10nm。版权所有（C）2004，JPO

47. 发明专利

JP2004160880A Ceramic molded body and its manufacturing method 审中-公开
公开(公告)号：JP2004160880A
公开(公告)日：2004-06-10
申请号：JP2002330601
申请日：2002-11-14
申请人： Chugoku Electric Power Co Inc:The , Taiheiyo Cement Corp , 中国電力株式会社 , 太平洋セメント株式会社
发明人： KASHIWAGI TATSUJI , WAKIDOKORO KEIJI , SHINTANI SHIZUMA , IGUCHI MASAHITO , ISHII MAMORU , SHIMIZU HIROSHI
IPC分类号： B28B3/02
摘要： PROBLEM TO BE SOLVED: To provide a ceramic molded body which can be molded without occurrence of edge chipping, even if the ceramic molded body is thin and has a curved surface.
SOLUTION: The ceramic molded body 1 is made of a ceramic and has a thin thickness, with its upper surface 2 and the lower surface 3 having a curved shape respectively. A belt-like projecting part 2a flat on surface is formed projectingly at the center of the upper surface 2 of the molded body 1. The molded body 1 has flat parts 4, at both ends in the width direction, extending in its depth direction orthogonally crossed in the width direction, with the upper surface and the lower surface of the flat parts 4 being flat. The width of respective flat parts 4 has 0.8% or more relative to the total width W of the molded body 1. The molded body 1 has 2,000 or more of an area/thickness ratio. The molded body 1 has a value of 1.1 times or more relative to the total width W of the respective molded body 1 in the curvature radius R of the curved surfaces of the upper surface 2 and the lower surface 3.
COPYRIGHT: (C)2004,JPO

48. 发明专利

JP2003273203A Electrostatic chuck 审中-公开
标题翻译：静电卡
公开(公告)号：JP2003273203A
公开(公告)日：2003-09-26
申请号：JP2002077616
申请日：2002-03-20
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： ISHII MAMORU , IGUCHI MASAHITO , KATAOKA MASAKO , KIKUCHI MASAYA
IPC分类号： C04B35/00 , C04B35/495 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic chuck which uses a low thermal expansion material for a wafer chucking part, thus reducing the size change of a wafer due to a temperature change and making it usable for precision work. SOLUTION: The electrostatic chuck has an electrode and a ceramic material covering the electrode. The ceramic material contains a compound having a negative thermal expansion coefficient and a compound having a positive thermal expansion coefficient and has a thermal expansion coefficient of -0.5×10 -6 to 0.5×10 -6 /°C and a volume resistivity of 1×10 8 to 1×10 12 Ωcm at 23±3°C. COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种使用低热膨胀材料用于晶片夹紧部件的静电卡盘，从而由于温度变化而减小了晶片的尺寸变化，并使其可用于精密加工。解决方案：静电吸盘具有覆盖电极的电极和陶瓷材料。陶瓷材料含有具有负热膨胀系数的化合物和具有正热膨胀系数并且具有-0.5×10 -6 至0.5×10 -6 -6的热膨胀系数的化合物在23±3℃下，体积电阻率为1×10 8 至1×10 12 Ωcm。版权所有（C）2003，JPO

49. 发明专利

JP2010277980A Electrode for cold-cathode fluorescent lamp and method of manufacturing the same 审中-公开
标题翻译：冷阴极荧光灯电极及其制造方法
公开(公告)号：JP2010277980A
公开(公告)日：2010-12-09
申请号：JP2009145818
申请日：2009-05-29
申请人： Nihon Ceratec Co Ltd , 株式会社日本セラテック
发明人： SATO KEISUKE , TSUTAI YOSHIFUMI , IGUCHI MASAHITO , SATO YUTAKA
IPC分类号： H01J61/067 , H01J9/02 , H01J61/06
摘要： PROBLEM TO BE SOLVED: To provide an electrode for cold-cathode fluorescent lamp, which has a great film thickness and capable of achieving long lifetime. SOLUTION: In order to form an oxide ceramic film on an inner surface of an electrode in a shape of a cup, a plasma thermal spraying method is used and an angle of a thermal spraying gun during a period of formation is set arbitrarily, and it is made possible to form the film on an inside surface part of the electrode in the shape of the cup. COPYRIGHT: (C)2011,JPO&INPIT

50. 发明专利

JP2009228022A Oxide film deposition method and oxide film member 有权
标题翻译：氧化膜沉积方法和氧化膜成员
公开(公告)号：JP2009228022A
公开(公告)日：2009-10-08
申请号：JP2008072038
申请日：2008-03-19
申请人： Nagaoka Univ Of Technology , Nihon Ceratec Co Ltd , 国立大学法人長岡技術科学大学 , 株式会社日本セラテック
发明人： SATO KEISUKE , TSUTAI YOSHIFUMI , IGUCHI MASAHITO , SAITO HIDETOSHI , KAWAGUCHI SHINNOSUKE
IPC分类号： C23C16/40 , C01F17/00 , C04B41/87
摘要： PROBLEM TO BE SOLVED: To provide an oxide film deposition method and an oxide film member for depositing a metal oxide thin film on the projection and recessed face, in the crack or the like of a surface of a substrate. SOLUTION: A Y 2 O 3 film is deposited on an aluminum oxide (Al 2 O 3 ) sintered body substrate 10 by using an air-open type CVD method using an air-open type CVD apparatus. An yttrium oxide film can be synthesized along a base material by using Y(DPM) 3 as a starting material of the Y 2 O 3 film. Any unevenness of the surface of the substrate can be uniformized, and the deepest part of grain boundary cracking or the like can be filled by the vapor deposition of the yttrium oxide film. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供氧化膜沉积方法和用于在基板的表面的裂纹等中在突起和凹面上沉积金属氧化物薄膜的氧化物膜部件。解决方案：将AY 2 3 膜沉积在氧化铝（Al 2 SB 3 O 3 / SB 3）上，通过使用空气开放式CVD装置的空气开放式CVD方法来烧结体基板10。可以通过使用Y（DPM） 3 作为Y SB“2 O”SB“膜的原料，沿着基材合成氧化钇膜。基板表面的任何不均匀性均匀化，可以通过氧化钇膜的气相沉积来填充最深部分的晶界裂纹等。版权所有（C）2010，JPO＆INPIT

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