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    • 41. 发明授权
    • Optimization of space width for hybrid photoresist
    • 混合光刻胶的空间宽度优化
    • US06200726B1
    • 2001-03-13
    • US09170756
    • 1998-10-13
    • Kuang-Jung ChenSteven J. HolmesWu-Song HuangAhmad D. KatnaniPaul A. Rabidoux
    • Kuang-Jung ChenSteven J. HolmesWu-Song HuangAhmad D. KatnaniPaul A. Rabidoux
    • G03C173
    • G03F7/038G03F7/0045G03F7/039G03F7/095H01L21/0274H01L21/3085H01L28/82Y10S430/106Y10S430/115Y10S430/128
    • A photo resist composition contains at least one photoacid generator (PAG), wherein at least two photoacids are produced upon exposure of the photo resist to actinic energy and wherein the photo resist is capable of producing a hybrid response. The function of providing generation of two photoacids in a hybrid resist is to optimize the use of hybrid resist by varying the hybrid space width. The at least two photoacids may differ in their effectiveness at catalyzing at least one mechanism of the hybrid response. In particular, one photoacid may be a weaker acid and another may be a stronger acid, wherein there exists a difference of at least four orders of magnitude between the acid dissociation constant (Ka) of the weaker acid and the stronger acid. A method for optimizing space width in a hybrid photo resist includes the steps of: 1) selecting a desired space width; 2) selecting at least one photoacid generator (PAG), wherein at least two photoacids will be produced upon exposure to actinic energy in relative proportions sufficient to produce the desired space width in the hybrid photo resist; and 3) forming a hybrid photo resist composition comprising the at least one PAG. The step of selecting at least one PAG may include first determining the space width produced alone by each photoacid in a group of candidate photoacids and then selecting the photoacids and corresponding at least one PAG that will produce the desired space width.
    • 光致抗蚀剂组合物含有至少一种光致酸发生剂(PAG),其中当光致抗蚀剂暴露于光化能时,产生至少两种光酸,并且其中光致抗蚀剂能产生杂化响应。 在混合抗蚀剂中提供两种光酸的产生的功能是通过改变混合空间宽度来优化混合抗蚀剂的使用。 至少两种光酸在催化至少一种混合反应机制方面的有效性可能不同。 特别地,一种光致酸可以是较弱的酸,而另一种可能是较强的酸,其中在较弱酸的酸解离常数(Ka)和较强酸之间存在至少四个数量级的差异。 一种用于优化混合光刻胶中的空间宽度的方法包括以下步骤:1)选择期望的空间宽度; 2)选择至少一种光致酸产生剂(PAG),其中当以相对比例暴露于足以产生混合光致抗蚀剂中所需空间宽度的光化能时,将产生至少两种光酸; 和3)形成包含所述至少一种PAG的混合光刻胶组合物。 选择至少一个PAG的步骤可以包括首先确定由一组候选光酸中的每个光酸酸单独产生的空间宽度,然后选择将产生所需空间宽度的光酸和相应的至少一个PAG。
    • 47. 发明授权
    • Method of multiple patterning to form semiconductor devices
    • 多重图形化形成半导体器件的方法
    • US08871596B2
    • 2014-10-28
    • US13555240
    • 2012-07-23
    • Kuang-Jung ChenKangguo ChengBruce B. DorisSteven J. HolmesSen Liu
    • Kuang-Jung ChenKangguo ChengBruce B. DorisSteven J. HolmesSen Liu
    • H01L21/31
    • H01L21/0274H01L21/26586H01L21/3081H01L21/76229H01L21/76283H01L29/517H01L29/66575H01L29/78
    • A method of forming different structures of a semiconductor device using a single mask and a hybrid photoresist. The method includes: applying a first photoresist layer on a semiconductor substrate; patterning the first photoresist layer using a photomask to form a first patterned photoresist layer; using the first patterned photoresist layer to form a first structure of a semiconductor device; removing the first patterned photoresist layer; applying a second photoresist layer on the semiconductor substrate; patterning the second photoresist layer using the photomask to form a second patterned photoresist layer; using the second patterned photoresist layer to form a second structure of a semiconductor device; removing the second patterned photoresist layer; and wherein either the first or the second photoresist layer is a hybrid photoresist layer comprising a hybrid photoresist.
    • 使用单个掩模和混合光致抗蚀剂形成半导体器件的不同结构的方法。 该方法包括:在半导体衬底上施加第一光致抗蚀剂层; 使用光掩模图案化第一光致抗蚀剂层以形成第一图案化光致抗蚀剂层; 使用所述第一图案化的光致抗蚀剂层形成半导体器件的第一结构; 去除第一图案化光致抗蚀剂层; 在所述半导体衬底上施加第二光致抗蚀剂层; 使用光掩模图案化第二光致抗蚀剂层以形成第二图案化光致抗蚀剂层; 使用所述第二图案化的光致抗蚀剂层形成半导体器件的第二结构; 去除第二图案化光致抗蚀剂层; 并且其中所述第一或第二光致抗蚀剂层是包含混合光致抗蚀剂的混合光致抗蚀剂层。
    • 50. 发明授权
    • Package of environmental sensitive electronic element
    • 环保敏感电子元件包装
    • US09142798B2
    • 2015-09-22
    • US13354298
    • 2012-01-19
    • Kuang-Jung ChenJian-Lin WuShu-Tang Yeh
    • Kuang-Jung ChenJian-Lin WuShu-Tang Yeh
    • H01L33/56H01L51/52
    • H01L51/5256
    • A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.
    • 提供一种包括第一基板,第二基板,环境敏感电子元件,柔性结构层和填充层的环境敏感电子元件的封装。 环境敏感电子元件设置在第一基板上并且位于第一基板和第二基板之间。 环境敏感电子元件包括阳极层,空穴注入层,空穴传输层,有机发光层,阴极层和电子注入层。 柔性结构层设置在环境敏感电子元件上,并且包括软层,捕获层和保护层。 捕获层的材料与电子注入层的材料相同。 填充层设置在第一基板和第二基板之间,并且封装环境敏感的电子元件和柔性结构层。