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    • 41. 发明授权
    • Method for manufacturing cover of electronic device and cover obtained thereby
    • 制造电子装置盖的方法和由此得到的盖
    • US08240185B2
    • 2012-08-14
    • US12495685
    • 2009-06-30
    • Feng JinGen-Ping DengChun-Chi Chen
    • Feng JinGen-Ping DengChun-Chi Chen
    • B21D41/00B23D23/00
    • B21D19/08Y10T29/49828
    • A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.
    • 一种用于制造电子设备的盖的方法,包括提供金属绿色部件的步骤,所述金属生片包括顶板,底板和互连顶板和底板侧的连接板; 提供型材成型插入件和下模具,所述型材成形插入件形成成形表面,所述下模具限定用于接收所述生坯件的端部的空腔; 将型材成型插入件放入绿色件中,成型模制插入件的成形表面朝着绿色件的端部定向; 将生坯件的端部插入下模具的腔体中并冲压下模具,使得在成型件的端部处的顶板和底板沿着型材成型件的成形表面彼此朝向彼此弯曲。