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41. 发明授权

US07843053B2 Stack package made of chip scale packages 有权
标题翻译：堆叠封装由芯片级封装制成
公开(公告)号：US07843053B2
公开(公告)日：2010-11-30
申请号：US12338905
申请日：2008-12-18
申请人： Dong-Ho Lee
发明人： Dong-Ho Lee
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065
CPC分类号： H01L25/105 , H01L2224/4824 , H01L2225/1023 , H01L2225/1058 , H01L2225/1064 , H01L2924/15311
摘要： A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent pair of chip scale packages is attached to the other in a manner that the ball land pads of the upper stacked chip scale package face in the opposite direction to those of the lower stacked chip scale package, and the circuit patterns of the upper stacked chip scale package are electrically connected to the those of the lower stacked chip scale package by, for example, connecting boards. Therefore, it is possible to stack not only fan-out type chip scale packages, but to also efficiently stack ordinary area array type chip scale packages.
摘要翻译：通过堆叠至少两个区域阵列型芯片级封装件来制造本发明的堆叠封装。相邻的一对芯片级封装的每个芯片级封装以上堆叠芯片级封装的焊盘焊盘与下堆叠芯片尺寸封装的方向相反的方式附接到另一芯片尺寸封装，并且电路上堆叠芯片级封装的图案通过例如连接板电连接到下堆叠芯片级封装的图案。因此，不仅可以堆叠扇出式芯片级封装，而且可以有效地堆叠普通区域阵列型芯片级封装。

42. 发明授权

US07777323B2 Semiconductor structure and method for forming the same 有权
标题翻译：半导体结构及其形成方法
公开(公告)号：US07777323B2
公开(公告)日：2010-08-17
申请号：US11750663
申请日：2007-05-18
申请人： Yong Chai Kwon , Keum-Hee Ma , Kang-Wook Lee , Dong-Ho Lee , Seong-il Han
发明人： Yong Chai Kwon , Keum-Hee Ma , Kang-Wook Lee , Dong-Ho Lee , Seong-il Han
IPC分类号： H01L23/12 , H01L21/44
CPC分类号： H01L21/76898 , H01L25/0657 , H01L25/50 , H01L2224/05009 , H01L2224/06181 , H01L2224/13009 , H01L2224/16145 , H01L2224/16146 , H01L2224/16147 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2924/01327 , H01L2924/15311 , H01L2924/00
摘要： Example embodiments are directed to a method of forming a semiconductor structure and a semiconductor structure including a semiconductor unit including a protrusion on a front side of the semiconductor unit and a recess on a backside of the semiconductor unit.
摘要翻译：示例性实施例涉及一种形成半导体结构的方法和包括半导体单元的半导体结构的方法，所述半导体单元包括在半导体单元的前侧上的突起和半导体单元的背侧上的凹部。

43. 发明授权

US07515220B2 Display device 失效
标题翻译：显示设备
公开(公告)号：US07515220B2
公开(公告)日：2009-04-07
申请号：US11138211
申请日：2005-05-27
申请人： Hyung-Seok Ko , Soo-Jin Kim , Dong-Ho Lee
发明人： Hyung-Seok Ko , Soo-Jin Kim , Dong-Ho Lee
IPC分类号： G02F1/1333 , G02F1/1335
CPC分类号： G02F1/133308 , G02B6/0018 , G02B6/002 , G02B6/0088 , G02F2001/133322 , G02F2001/133342
摘要： A display device including a display panel displaying an image; a light source unit supplying light to the display panel, and a light guiding unit including a light guiding section which has a light receiving surface positioned adjacent to the light source unit and a light emitting surface positioned opposite to the display panel and which guides light emitted from the light source unit to the display panel, a side wall section forming a reception space for receiving the display panel along the edges of the light guiding section, and a fixing section fixing the light guiding section to the display device.
摘要翻译：一种显示装置，包括显示图像的显示面板; 向显示面板供给光的光源单元以及具有导光部的导光单元，该导光单元具有位于与该光源单元相邻的光接收面和与该显示面相对配置的发光面，从所述光源单元到所述显示面板的侧壁部，形成沿着所述导光部的边缘接收所述显示面板的接收空间的侧壁部以及将所述导光部固定在所述显示装置上的固定部。

44. 发明授权

US07508479B2 Liquid crystal display 有权
标题翻译：液晶显示器
公开(公告)号：US07508479B2
公开(公告)日：2009-03-24
申请号：US10199831
申请日：2002-07-19
申请人： Hyung-Guel Kim , Dong-Ho Lee , Won-Seok Ma
发明人： Hyung-Guel Kim , Dong-Ho Lee , Won-Seok Ma
IPC分类号： G02F1/1345
CPC分类号： G11C19/28 , G09G3/2011 , G09G3/3688 , G09G2300/0408 , G09G2300/08 , G09G2310/0275 , G09G2310/0297
摘要： An LCD capable of being reduced by a whole size and a defective proportion thereof being minimized. An LCD panel of the LCD includes a gate driving circuit that drives gate lines formed extended along a row direction and a line block selecting circuit that drives data lines extended along a column direction. On the LCD panel, an integrated driving chip having a controller, a memory, a level shifter, a source driver, a common voltage generator and a DC/DC converter is mounted. The integrated driving chip not only drives the gate driving circuit and line block selecting circuit, but also controls the operation of the LCD panel to display an image. Thus configured, a defective proportion of the LCD is decreased, with the whole size thereof being reduced.
摘要翻译：能够将整体尺寸减小并且其缺陷比例的LCD最小化。 LCD的LCD面板包括驱动沿着行方向延伸的栅极线的栅极驱动电路和驱动沿列方向延伸的数据线的线路块选择电路。在LCD面板上，安装有具有控制器，存储器，电平转换器，源极驱动器，公共电压发生器和DC / DC转换器的集成驱动芯片。集成驱动芯片不仅驱动栅极驱动电路和线路块选择电路，而且还控制LCD面板的操作以显示图像。因此，LCD的缺陷比例减小，整体尺寸减小。

45. 发明授权

US07301233B2 Semiconductor chip package with thermoelectric cooler 有权
标题翻译：半导体芯片封装带热电冷却器
公开(公告)号：US07301233B2
公开(公告)日：2007-11-27
申请号：US11169615
申请日：2005-06-30
申请人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
发明人： Hae-Hyung Lee , Sang-Wook Park , Joong-Hyun Baek , Dong-Ho Lee , Jin-Yang Lee
IPC分类号： H01L23/34 , H01L23/10 , H01L23/02
CPC分类号： H01L23/38 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/37599 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/49113 , H01L2224/73253 , H01L2224/73265 , H01L2224/8385 , H01L2224/8485 , H01L2225/06589 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.
摘要翻译：半导体芯片封装可以包括具有电路图案的衬底和与电路图案连接的衬底焊盘。至少一个半导体芯片安装在基板上，并且具有P型材料板和N型材料板的热电冷却器安装在半导体芯片上。 P型和N型材料板的部分可以附着在半导体芯片上。 P型和N型材料板可以电连接到衬底的电路图案以提供DC电力。

46. 发明申请

US20070109474A1 COLOR FILTER SUBSTRATE AND LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME 有权
标题翻译：彩色滤光片和液晶显示装置
公开(公告)号：US20070109474A1
公开(公告)日：2007-05-17
申请号：US11616506
申请日：2006-12-27
申请人： Yong-Ho Yang , Dong-Ho Lee
发明人： Yong-Ho Yang , Dong-Ho Lee
IPC分类号： G02F1/1335
CPC分类号： G02F1/133514 , G02F1/133555 , G02F2001/133357
摘要： A color filter substrate is provided, including a substrate, a color filter layer formed on the substrate and including color filters where at least one of the color filters has an opening that partially exposes a portion of the substrate, a planarization layer reducing a step difference between the color filter layer and the portion of the substrate exposed by the opening, and a transparent electrode formed on the planarization layer,
摘要翻译：提供一种滤色器基板，包括基板，形成在基板上的滤色器层，并且包括滤色器，其中至少一个滤色器具有部分地暴露基板的一部分的开口，平坦化层减小阶梯差在所述滤色器层和由所述开口曝光的所述基板的所述部分之间，形成在所述平坦化层上的透明电极，

47. 发明申请

US20060176254A1 Display apparatus 有权
标题翻译：显示装置
公开(公告)号：US20060176254A1
公开(公告)日：2006-08-10
申请号：US11102175
申请日：2005-04-08
申请人： Dong-Hwan Lee , Dong-Ho Lee , Soo-Jin Kim
发明人： Dong-Hwan Lee , Dong-Ho Lee , Soo-Jin Kim
IPC分类号： G09G3/36
CPC分类号： G02F1/13452 , G02F2001/13456
摘要： In a display apparatus, a printed circuit board has a base substrate, a flip chip, and an adhesive member. The flip chip is mounted onto a first face of the base substrate by the adhesive member between the flip chip and the first face of the base substrate. The first display panel is disposed on a second face opposite to the first face of the base substrate, and a second display panel is mounted on the first face of the base substrate with the flip chip. Thus, a chip mounted on the printed circuit board is made smaller and the freed up space can be used to mount the second display panel.
摘要翻译：在显示装置中，印刷电路板具有基底基板，倒装芯片和粘合部件。倒装芯片通过位于倒装芯片和基底基板的第一面之间的粘合部件安装在基底基板的第一面上。第一显示面板设置在与基底基板的第一面相反的第二面上，第二显示面板通过倒装芯片安装在基底基板的第一面上。因此，安装在印刷电路板上的芯片更小，并且可以使用释放的空间来安装第二显示面板。

48. 发明授权

US07007996B2 Lock of information reproducer for car 失效
标题翻译：汽车锁信息再现器
公开(公告)号：US07007996B2
公开(公告)日：2006-03-07
申请号：US10698789
申请日：2003-10-30
申请人： Dong-Ho Lee , Wae-Yeul Kim
发明人： Dong-Ho Lee , Wae-Yeul Kim
IPC分类号： B69N3/12
CPC分类号： B60R11/0211 , B60R2011/0005 , B60R2011/0047 , B60R2011/0096 , Y10T70/50
摘要： In a lock of information reproducer for car, when a passenger or a driver stays in a car, in more detail, only when a car key is inserted into a car key holder (power of the car is ON), an information reproducer can be detached from a contact support unit, when the key is taken out of the key holder, the information reproducer can not be detached from the contact support unit, and accordingly theft of the information reproducer can be efficiently prevented in parking.
摘要翻译：在汽车信息再现器锁中，当乘客或驾驶员停留在汽车中时，更详细地说，只有当汽车钥匙插入汽车钥匙座（汽车电源为ON）时，信息再现器可以是从接触支撑单元分离时，当钥匙从钥匙架中取出时，信息再现器不能从接触支撑单元拆下，因此在停车时可以有效地防止信息再现器的盗窃。

49. 发明申请

US20060006517A1 Multi-chip package having heat dissipating path 审中-公开
标题翻译：具有散热路径的多芯片封装
公开(公告)号：US20060006517A1
公开(公告)日：2006-01-12
申请号：US11176800
申请日：2005-07-06
申请人： Jin-Yang Lee , Sang-Wook Park , Hae-Hyung Lee , Dong-Ho Lee , Joong-Hyun Baek
发明人： Jin-Yang Lee , Sang-Wook Park , Hae-Hyung Lee , Dong-Ho Lee , Joong-Hyun Baek
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3677 , H01L24/45 , H01L24/48 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2225/0651 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/01077 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A multi-chip package having a heat dissipating path. The multi-chip package includes a stack of integrated circuit (IC) chips, a heat sink part interposed between the IC chips so that one end portion of the heat sink part can be exposed from a side of the stack of integrated circuit chips, a substrate on which the stack of integrated circuit chips is mounted, and solder or solder ball-shaped thermally connecting parts to thermally connect the exposed end portion of the heat sink part to the substrate to dissipate heat collected in the heat sink part through the substrate.
摘要翻译：具有散热路径的多芯片封装。多芯片封装包括集成电路（IC）芯片堆叠，插入在IC芯片之间的散热器部分，使得散热部件的一个端部可以从集成电路芯片堆叠的一侧露出，其上安装有集成电路芯片的堆叠的基板，以及焊料或焊球形的热连接部件，以将散热部件的暴露端部热连接到基板，以散发通过基板收集在散热部件中的热量。

50. 发明申请

US20050284900A1 Spare tire carrier fixing holder 失效
标题翻译：备胎轮胎固定架
公开(公告)号：US20050284900A1
公开(公告)日：2005-12-29
申请号：US11117208
申请日：2005-04-28
申请人： Dong-Ho Lee
发明人： Dong-Ho Lee
IPC分类号： B62D43/02 , B62D43/00 , B62D43/04
CPC分类号： B62D43/04
摘要： A spare tire carrier fixing holder includes a bolt penetrating a vehicle body member. A holder is equipped at the upper end with a nut screwed to the bolt while the lower end of the holder is formed with a hook onto which a carrier is engaged. A guide ring is formed within the holder to guide the bolt to minimize the eccentricity between the bolt and nut.
摘要翻译：备用轮胎载体固定保持器包括穿过车身构件的螺栓。在上端装有一个固定器，螺母与螺栓螺合，同时保持架的下端形成一个钩子，托架与托架接合。引导环形成在保持器内以引导螺栓以使螺栓和螺母之间的偏心度最小化。

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